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Cheng-Hao

Cheng-Hao Chen, Taipei City TW

Patent application numberDescriptionPublished
20100004882FAULT DETECTION AND CLASSIFICATION METHOD FOR WAFER ACCEPTANCE TEST PARAMETERS - A fault detection and classification (FDC) method for wafer acceptance test (WAT) parameters includes the following steps. A plurality of fault detection and classification parameters is collected. A plurality of wafer acceptance test parameters that are corresponded by the fault detection and classification parameters is collected. The fault detection and classification parameters are grouped. A contingency table of the wafer acceptance test parameters corresponding to the fault detection and classification parameters is built. A probability model of the contingency table is built. Finally, a safety range of the probability model is determined.01-07-2010
20100223027MONITORING METHOD FOR MULTI TOOLS - A monitoring method for multi tools is disclosed. The method includes the steps of providing a plurality of measurement tools for measuring the testing points of standard wafers, calculating a vector for representing a measurement tool, calculating the angle between every two of the vectors and determining the measurement tools having the same performance or not. Thereby, the measurement tools can be efficiently grouped and the measuring stability of the measurement tool is analyzed.09-02-2010
20100268501Method for assessing data worth for analyzing yield rate - A method for assessing data worth for analyzing yield rate includes: getting measured data with data points that corresponds to control variables of semiconductor manufacturing; transforming the data points into a distance matrix with matrix distances corresponding to differences of the data points under the control variables; expressing sample differences recorded in the distance matrix by two-dimension vectors and calculating similarity degrees of the two-dimension vectors and the distance matrix so as to take loss information as a conversion error value; calculating discriminant ability of the transformed two-dimension data and expressing the discriminant ability by an error rate of discriminant; and taking the conversion error value and the error rate of discriminant as penalty terms and calculating a quality score corresponding to the measured data. Thereby, before analyzing the yield rate of semiconductor manufacturing, analysts can determine whether data includes information affecting the yield rate based on the quality score.10-21-2010
20110093226FAULT DETECTION AND CLASSIFICATION METHOD FOR WAFER ACCEPTANCE TEST PARAMETERS - A fault detection and classification (FDC) method for wafer acceptance test (WAT) parameters includes the following steps. A plurality of fault detection and classification parameters is collected. A plurality of wafer acceptance test parameters that are corresponded by the fault detection and classification parameters is collected. The fault detection and classification parameters are grouped. A contingency table of the wafer acceptance test parameters corresponding to the fault detection and classification parameters is built. A probability model of the contingency table is built. Finally, a safety range of the probability model is determined.04-21-2011
20110137595YIELD LOSS PREDICTION METHOD AND ASSOCIATED COMPUTER READABLE MEDIUM - A yield loss prediction method includes: performing a plurality of types of defect inspections upon a plurality of batches of wafers which begin to be processed during different periods to generate defect inspection data, respectively; for a specific batch of wafers different from the plurality of batches of wafers, calculating defect prediction data of at least one type of defect inspection according to the defect inspection data of at least the type of defect inspections; and predicting a yield loss of the specific batch of wafers according to at least the defect prediction data.06-09-2011
20110153660METHOD OF SEARCHING FOR KEY SEMICONDUCTOR OPERATION WITH RANDOMIZATION FOR WAFER POSITION - A method of searching for the key semiconductor operation with randomization for wafer position, comprising: recording the wafer position and the wafer yields of a plurality of wafer ID respectively corresponding to a plurality of semiconductor operations; establishing a matrix model which describes the matrix set for wafer yields of the plurality of wafer ID; analyzing the matrix model, further computing the matrix set for wafer yields of the wafer ID, thereby acquiring the weightings of the randomized wafer positions in such semiconductor operations; and searching for a key semiconductor operation among the plurality of semiconductor operations; herein, by using a local regression model to estimate the wafer position effect, computing the weighting of the position effect in each semiconductor operation based on the estimated position effect and the randomized wafer yield, higher weighting thereof indicates the key semiconductor operation having greater position effect in the aforementioned semiconductor process.06-23-2011
20120102052SPECIFICATION ESTABLISHING METHOD FOR CONTROLLING SEMICONDUCTOR PROCESS - A specification establishing method for controlling semiconductor process, the steps includes: providing a database and choosing a population from the database; sampling a plurality of sample groups from the population, each sample group being a non-normal distribution and having a plurality of samples; filtering the sample groups; summarizing the filtered sample groups to form a non-normal distribution diagram; getting a value-at-risk and a median by calculating from the non-normal distribution diagram; getting a critical value by calculating the value-at-risk and the median with a critical formula; getting a plurality of state values by calculating the filtered sample groups with a proportion formula; and getting an index value by calculating the non-normal distribution diagram with the proportion formula. Thus, the state values indicate the states of the sample groups are abnormal or not by comparing the state values to the index value.04-26-2012

Patent applications by Cheng-Hao Chen, Taipei City TW

Cheng-Hao Chen, Taipei City 105 TW

Patent application numberDescriptionPublished
20100049355METHOD FOR DETERMINING TOOL'S PRODUCTION QUALITY - A method for determining manufacturing tool production quality includes providing a table with manufacturing process data. The table is analyzed and a contingency table is established. The contingency table comprises several manufacturing tools, manufacturing processes, and the number of occurrences of bad lots. Split the contingency table up into a plurality of sub-tables. Use Cochran-Mantel-Haenszel test for determining the number of bad lots produced by the manufacturing tools and getting a plurality of statistics. Translate the statistics into a plurality of P-values. Sort the P-values for examining data automatically. Draw a line chart for detecting substandard manufacturing tools. As a result, users can diagnose the quality of the manufacturing tools.02-25-2010
20100093114METHOD OF SEARCHING FOR KEY SEMICONDUCTOR OPERATION WITH RANDOMIZATION FOR WAFER POSITION - A method of searching for the key semiconductor operation with randomization for wafer position, comprising: recording the wafer position and the wafer yields of a plurality of wafer ID respectively corresponding to a plurality of semiconductor operations; establishing a matrix model which describes the matrix set for wafer yields of the plurality of wafer ID; analyzing the matrix model, further computing the matrix set for wafer yields of the wafer ID, thereby acquiring the weightings of the randomized wafer positions in such semiconductor operations; and searching for a key semiconductor operation among the plurality of semiconductor operations; herein, by using a local regression model to estimate the wafer position effect, computing the weighting of the position effect in each semiconductor operation based on the estimated position effect and the randomized wafer yield, higher weighting thereof indicates the key semiconductor operation having greater position effect in the aforementioned semiconductor process.04-15-2010

Cheng-Hao Huang, Taipei Hsien TW

Patent application numberDescriptionPublished
20110075349NOTEBOOK COMPUTER DOCKING STATION - A notebook computer docking station including a body and a first connecting port is provided. The body has a first recess and a second recess, wherein the first recess is for accommodating a notebook computer and the second recess is for accommodating peripheral devices. The first connecting port is located in the second recess and electrically connected to the peripheral devices.03-31-2011

Cheng-Hao Huang, Taipei TW

Patent application numberDescriptionPublished
20110099315MULTIMEDIA SYSTEM - A multimedia system includes a portable device, a multimedia expansion apparatus and a second display. The portable device further includes a main body and a first display coupling with the main body, in which the main body has a first multimedia module and a switch module. The multimedia further includes an expansion port for coupling the portable device, a multimedia switch circuit, a plurality of signal output ports and a power control circuit for energizing the expansion port, the multimedia switch circuit and the signal output ports. The second display is coupled with one of the signal output ports. The switch module forwards a multimedia signal of the main body to one of the first multimedia module and the multimedia switch circuit, and the power control circuit is to terminate power output to while the portable device is separated from the expansion port of the multimedia expansion apparatus.04-28-2011

Cheng-Hao Ko, Zhudong Town TW

Patent application numberDescriptionPublished
20080225392OPTICAL SYSTEM - The invention concerns an optical system. The optical system comprises an input for receiving an optical signal, a predetermined output plane, and a diffraction grating for separating the optical signal received at the input into spectral elements thereof. The grating has a diffraction surface with a first predetermined profile. The first profile is formed by a plurality of points each conducted by different equations. Consequently, each spectral component is focused on the predetermined plane.09-18-2008
20090034080OPTICAL SYSTEM - The invention concerns an optical system. The optical system comprises an input for receiving an optical signal, a predetermined output plane, and a diffraction grating for separating the optical signal received at the input into spectral components thereof. The grating has a diffraction surface, which is formed by a photolithography process.02-05-2009

Cheng-Hao Ko, Zhudong Township TW

Patent application numberDescriptionPublished
20110080584Optical System - The invention concerns an optical system. The optical system comprises an input for receiving an optical signal, a predetermined output plane, and a diffraction grating for separating the optical signal received at the input into spectral elements thereof. The grating has a diffraction surface, which is formed by a photolithography process. The diffraction surface has a first predetermined profile. The first profile is formed by a plurality of points each conducted by different equations. Consequently, each spectral component is focused on the predetermined output plane.04-07-2011

Cheng-Hao Lee, Taipei City TW

Patent application numberDescriptionPublished
20120133327ELECTROMAGNETIC TOUCH INPUT PEN HAVING A USB INTERFACE - An electromagnetic touch input pen having a USB interface, used to provide touch input to an information processing device, the pen including: an electromagnetic touch input pen, having a battery module; and a USB plug, coupled with the battery module, wherein the battery module can access a charging power with the USB plug inserted into a USB socket of the information processing device.05-31-2012

Cheng-Hao Yu, Hukou Township TW

Patent application numberDescriptionPublished
20110050622Load cell touch control device - A load cell touch control device includes a touch panel, a plurality of load cells and a control unit. The touch panel receives a stress applied thereon. The load cells are implemented in the touch panel to detect respective components of the stress received by the touch panel. The control unit is connected to the load cells in order to receive magnitudes of the respective components to thereby calculate a magnitude, position and motion trace of the stress on the touch panel based on the respective components detected by the load cells in the touch panel.03-03-2011