Patent application number | Description | Published |
20090315576 | PROBE CARD ASSEMBLY AND TEST PROBES THEREIN - Disclosed are a probe card assembly and test probes used therein. The probe card assembly includes a main body, a probe base provided at a center of the main body, and a plurality of test probes connecting the main body and the probe base. Therein, each of the test probes has a tip extending out from the probe base for contacting and testing a wafer. The test probes include at least one power probe, at least one grounding probe and a plurality of signal probes, wherein each of the test probes has a middle section between the main body and contains therein a core that is wrapped by an insulation layer. | 12-24-2009 |
20090315577 | PROBE CARD ASSEMBLY - Disclosed is a probe card assembly including a main body, a probe base provided at a center of the main body, and a plurality of test probes connecting the main body and the probe base. Therein, each of the test probes has a tip extending out from the probe base for contacting and testing a wafer. The test probes include at least one power probe, at least one grounding probe and a plurality of signal probes, wherein each of the test probes has a middle section between the main body and the probe base. Each of the power probe and the signal probes further contains therein a core that is wrapped by an insulation layer. | 12-24-2009 |
20100109689 | PROBE CARD ASSEMBLY AND TEST PROBES THEREIN - Discloses are a probe card assembly and test probes used therein. The probe card assembly includes a main body, a probe base disposed in a central portion of the main body and a plurality of test probes connected between the probe base and the main body. Each of the test probes has a tip extending from the probe base for contacting a wafer under test. The test probes include at least one power probe, at least one signal probe and a plurality of ground probes. Each of the test probes has a middle section interposed between the main body and the probe base. Each of the test probes except the ground probes has a naked middle section coated with an insulating film but not sheltered by an insulating sleeve. | 05-06-2010 |
20100164524 | ZIF CONNECTORS AND SEMICONDUCTOR TESTING DEVICE AND SYSTEM USING THE SAME - A ZIF connector, a semiconductor testing device using the ZIF connectors, and a semiconductor testing system using the ZIF connectors are proposed. The ZIF connector comprises a body portion and a clamping portion. The body portion is a print circuit board provided with circuit patterns, and further comprises a plurality of signal holes disposed on an upper part of the body portion for electrically connecting a plurality of corresponding signal cables and a plurality of electrical terminals disposed on a lower part of the body portion and arranged on two lateral sides of the body portion for electrically connecting a plurality of corresponding electrical pads of a substrate. The circuit patterns are provided in the body portion to connect to the electrical terminals through the signal holes accordingly. The clamping portion is horizontally extended on one lateral side of the body portion for securing the ZIF connector in a connector board. | 07-01-2010 |
Patent application number | Description | Published |
20090093987 | Method for accurate measuring stray capacitance of automatic test equipment and system thereof - A method for measuring accurate stray capacitance of automatic test equipment (ATE) and system thereof are disclosed. The method has several steps, comprising: First of all, an internal circuit is charged and discharged several times by a driver unit; Next, the internal circuit is self-discharged, and values of voltage from V | 04-09-2009 |
20090108862 | Testing system module - A testing system module for testing printed circuit board (PCB) includes a first robot having a pogo pin for moving to a first testing point of a first surface of the PCB and the pogo pin contacting the first testing point; a second robot having another pogo pin for moving to a second point of a second surface of the PCB and the pogo pin contacting the second testing point; and a source meter for forcing the signals to the pogo pins and sensing the signals from the pogo pins. | 04-30-2009 |
20090243643 | TESTING SYSTEM MODULE - A testing system module for testing printed circuit board (PCB) includes at least one robot having a pogo pin for moving to a testing point of the PCB; a pressure detecting unit for detecting a current pressure value on the printed circuit board; and a control system for keeping the pogo pin to contact with the PCB with constant pressure. | 10-01-2009 |
20100052710 | Probe Card - The present invention discloses a probe card for testing a wafer. The probe card comprises a printed circuit board for transmitting test signals, a fastened ring arranged at the downside of the printed circuit board, and a plurality of needles passing through the fastened ring, each needle having one end connecting to circuits of the printed circuit board, and having a tip portion at the other end connecting to a pad of the wafer, where each needle has at least one bent portion between the fastened ring and the tip portion, to absorb stress between the needle and the pad. | 03-04-2010 |