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Cheng-Chih
Cheng-Chih Chao, Fengyuan City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110051729 | METHODS AND APPARATUSES RELATING TO PSEUDO RANDOM NETWORK CODING DESIGN - A method of providing a pseudo random network coding design may include receiving, at a receiver node, signaling including an index of a codebook communicated from a transmitter node employing network coding, utilizing the codebook associated with the index to generate a coding coefficient used to employ the network coding, and decoding the signaling using the coding coefficient. A corresponding apparatus is also provided. | 03-03-2011 |
Cheng-Chih Huang, Taipei Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090098698 | MEMORY DEVICE AND FABRICATION THEREOF - A semiconductor memory device. A trench capacitor disposed at a lower portion of a trench in a substrate, in which the trench capacitor comprises a filling electrode layer and a collar dielectric layer surrounding the filling electrode layer. The top of the collar dielectric layer is lower than top surface level of the filling electrode layer. A vertical transistor is disposed at the upper portion of the trench, comprising a doped region disposed in a portion of the trench adjacent to the trench. A buried conductive layer interposed between the vertical transistor and the trench capacitor, wherein the cross section of the buried conductive layer is H shaped. The trench capacitor and the doping region of vertical transistor are electrically connected through the H shaped buried conductive layer. | 04-16-2009 |
Cheng-Chih Lai, Changhua City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110007521 | BACKLIGHT MODULE WITH A HEAT CONDUCTIVE BLOCK - A backlight module includes a bezel having at least one edge, a circuit board, one or more light emitting diodes connected to the circuit board for emitting light. Each light emitting diode has a light axis which is neither parallel nor vertical to the edge of the bezel. The backlight module utilizes a heat conductive block disposed between the bezel and the light emitting diode for transferring heat generated by the light emitting diode to the bezel. | 01-13-2011 |