Patent application number | Description | Published |
20090184754 | Signal amplifier - A signal amplifier including a transformer with a primary winding and a secondary winding, an oscillator circuit driven by an input signal establishing in the primary winding an oscillating signal amplified by the secondary, and a rectifier circuit responsive to the secondary winding configured to convert the amplified oscillating signal to an amplified version of the input signal. | 07-23-2009 |
20090195082 | Solid state relay - A solid state relay includes: an oscillator circuit responsive to a control signal for generating an a.c. signal; an isolation transformer having a primary winding which forms a part of the tank circuit of the oscillator circuit and a secondary winding; a rectifier responsive to the a.c. signal from the oscillator circuit for providing a d.c. drive signal; and a switch circuit responsive to the drive signal to open and close the relay. | 08-06-2009 |
20100052630 | HIGH FREQUENCY POWER CONVERTER BASED ON TRANSFORMERS - A transformer-based power conversion system includes a primary coil is provided in a current path that includes a single energy switch. An oscillator is coupled to a control input of the energy switch. The design conserves switch-based losses as compared to prior designs because a single switch is provided in a current path occupied by the primary coil. The design also provides improved conversion efficiency because parasitic capacitances associated with the energy switch cooperate with charge transfers generated by the oscillator. | 03-04-2010 |
20100134139 | SIGNAL ISOLATORS USING MICRO-TRANSFORMERS - A logic signal isolator comprising a transformer having a primary winding and a secondary winding; a transmitter circuit which drives said primary winding in response to a received logic signal, such that in response to a first type of edge in the logic signal, a signal of a first predetermined type is supplied to the primary winding and in response to a second type of edge in the logic signal, a signal of a second predetermined type is supplied to said primary winding, the primary winding and the transmitter being referenced to a first ground; and the secondary winding being referenced to a second ground which is galvanically isolated from the first ground and said secondary winding supplying to a receiver circuit signals received in correspondence to the signals provided to the primary winding, the receiver reconstructing the received logic signal from the received signals. | 06-03-2010 |
20110175642 | SIGNAL ISOLATORS USING MICRO-TRANSFORMERS - A logic signal isolator comprising a transformer having a primary winding and a secondary winding; a transmitter circuit which drives said primary winding in response to a received logic signal, such that in response to a first type of edge in the logic signal, a signal of a first predetermined type is supplied to the primary winding and in response to a second type of edge in the logic signal, a signal of a second predetermined type is supplied to said primary winding, the primary winding and the transmitter being referenced to a first ground; and the secondary winding being referenced to a second ground which is galvanically isolated from the first ground and said secondary winding supplying to a receiver circuit signals received in correspondence to the signals provided to the primary winding, the receiver reconstructing the received logic signal from the received signals. | 07-21-2011 |
20120099345 | SOFT-START CONTROL SYSTEM AND METHOD FOR AN ISOLATED DC-DC CONVERTER WITH SECONDARY CONTROLLER - A DC-DC converter for supplying a gradually increasing voltage via a soft start circuit from a first powered domain to a second unpowered domain. The powered domain may be connected to a primary winding of a first transformer, and the unpowered domain may be connected to the secondary winding of the first transformer. The unpowered domain may respond to an applied voltage from the soft start circuit by supplying a feedback signal to the powered domain via a feedback circuit. The feedback signal indicating the power supplied from the secondary winding of the first transformer to the unpowered domain is satisfactory. | 04-26-2012 |
20120153964 | SYSTEM AND METHOD FOR DETECTING ISOLATION BARRIER BREAKDOWN - A circuit system includes a first circuit for receiving an input signal, a second circuit for interfacing with a user, a signal path connecting the first circuit to the second circuit, the signal path including a first isolator and a second isolator serially connected to the first isolator, and a capacitance detector that detects a change in a combined capacitance of the first and second isolators as an indicator of a breakdown of one of the first and second isolators. | 06-21-2012 |
20130027170 | ISOLATED POWER CONVERTER WITH MAGNETICS ON CHIP - An integrated circuit fabricated with a number of layer may include a substrate, a transformer having a first winding, a second winding and a magnetic core. The first winding and the second winding may surround the magnetic core. The transformer may be disposed above a first side of the substrate. A flux conductor may be disposed on a second surface of the substrate opposite to the first surface. | 01-31-2013 |
20130056847 | SMALL SIZE AND FULLY INTEGRATED POWER CONVERTER WITH MAGNETICS ON CHIP - An integrated circuit has a semiconductor die provided in a first IC layer and an inductor fabricated on a second IC layer. The inductor may have a winding and a magnetic core, which are oriented to conduct magnetic flux in a direction parallel to a surface of a semiconductor die. The semiconductor die may have active circuit components fabricated in a first layer of the die, provided under the inductor layer. The integrated circuit may include a flux conductor provided on a side of the die opposite the first layer. PCB connections to active elements on the semiconductor die may progress through the inductor layer as necessary. | 03-07-2013 |
20140061854 | SMALL SIZE AND FULLY INTEGRATED POWER CONVERTER WITH MAGNETICS ON CHIP - An integrated circuit has a semiconductor die provided in a first IC layer and an inductor fabricated on a second IC layer. The inductor may have a winding and a magnetic core, which are oriented to conduct magnetic flux in a direction parallel to a surface of a semiconductor die. The semiconductor die may have active circuit components fabricated in a first layer of the die, provided under the inductor layer. The integrated circuit may include a flux conductor provided on a side of the die opposite the first layer. PCB connections to active elements on the semiconductor die may progress through the inductor layer as necessary. | 03-06-2014 |
20140190542 | WAFER SCALE THERMOELECTRIC ENERGY HARVESTER - An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer. The p-type thermoelectric elements and the n-type thermoelectric elements may be connected in series while alternating between the p-type and the n-type thermoelectric elements. | 07-10-2014 |
20140190543 | WAFER SCALE THERMOELECTRIC ENERGY HARVESTER - An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer. The p-type thermoelectric elements and the n-type thermoelectric elements may be connected in series while alternating between the p-type and the n-type thermoelectric elements. | 07-10-2014 |
20140218153 | STEP UP OR STEP DOWN MICRO-TRANSFORMER WITH TIGHT MAGNETIC COUPLING - A system and method for manufacturing of a micro-transformer providing direct electrical isolation between a primary winding and a secondary winding while featuring tight magnetic coupling for a large possible step-up or step-down ratio. The micro-transformer may be implemented in an integrated circuit, and may include a magnetic core. A high stepping ratio, e.g. approximately 50 to 100, may be achieved by connecting multiple symmetric primary windings in parallel and multiple symmetric secondary windings in series, or vice-versa. A plurality of windings may be stacked vertically. The micro-transformer may be of particular utility in wireless sensor networks, thermal and vibrational energy harvesters, power converters, and signal isolators. | 08-07-2014 |
20140246066 | WAFER SCALE THERMOELECTRIC ENERGY HARVESTER - An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer. The p-type thermoelectric elements and the n-type thermoelectric elements may be connected in series while alternating between the p-type and the n-type thermoelectric elements. | 09-04-2014 |
20140262464 | LATERALLY COUPLED ISOLATOR DEVICES - A laterally coupled isolator includes a pair of isolator traces provided in a common dielectric layer and separated by a distance that defines the isolation strength of the system. Circuit designers can vary the lateral distance to tailor isolation rating to suit individual design needs. A second embodiment includes a semiconductor substrate, provided below the isolator traces that includes a communication circuit electrically coupled to one of the isolator devices | 09-18-2014 |
20140266373 | INTEGRATED DELAYED CLOCK FOR HIGH SPEED ISOLATED SPI COMMUNICATION - A system may include a plurality of isolators to transfer data signals across an isolation barrier, one of the signals including a clock signal. A delay circuit may be included to receive the clock signal and provide a delayed clock signal that lags the clock signal by an amount representing a delay across the isolation barrier. The delayed clock signal may be delayed by a round trip propagation delay over the isolation barrier. The delayed clock signal may be used as a reference to read data sent over the isolation barrier. | 09-18-2014 |
20140268917 | ISOLATED ERROR AMPLIFIER FOR ISOLATED POWER SUPPLIES - A power converter may include an amplifier that generates an error signal, a modulator that generates a modulated error signal, an isolator that generates an isolated modulated error signal, and a demodulator that generates an isolated error signal, which may be substantially proportional to the difference between the output signal and the reference signal, and a controller that controls a power stage to generate the output signal of the power converter. | 09-18-2014 |
Patent application number | Description | Published |
20140191019 | APPARATUS AND METHOD FOR STRIPPING SOLDER METALS DURING THE RECYCLING OF WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT - Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module. | 07-10-2014 |
20140295071 | PRECURSOR COMPOSITIONS FOR ATOMIC LAYER DEPOSITION AND CHEMICAL VAPOR DEPOSITION OF TITANATE, LANTHANATE, AND TANTALATE DIELECTRIC FILMS - Barium, strontium, tantalum and lanthanum precursor compositions useful for atomic layer deposition (ALD) and chemical vapor deposition (CVD) of titanate thin films. The precursors have the formula M(Cp) | 10-02-2014 |
20140329011 | COMPOSITION AND METHOD FOR LOW TEMPERATURE CHEMICAL VAPOR DEPOSITION OF SILICON-CONTAINING FILMS INCLUDING SILICON CARBONITRIDE AND SILICON OXYCARBONITRIDE FILMS - Silicon precursors for forming silicon-containing films in the manufacture of semiconductor devices, such as films including silicon carbonitride, silicon oxycarbonitride, and silicon nitride (Si | 11-06-2014 |
20140329357 | TELLURIUM COMPOUNDS USEFUL FOR DEPOSITION OF TELLURIUM CONTAINING MATERIALS - Precursors for use in depositing tellurium-containing films on substrates such as wafers or other microelectronic device substrates, as well as associated processes of making and using such precursors, and source packages of such precursors. The precursors are useful for deposition of Ge | 11-06-2014 |
20150050199 | REMOVAL OF LEAD FROM SOLID MATERIALS - A leaching composition that substantially removes lead from solid materials and a method of using said composition. Preferably, the concentration of lead in the solid materials following processing is low enough that the solid materials can be reused and/or disposed of at minimal cost to the processor. Preferably, the solid materials comprise glass, such as cathode ray tube glass. | 02-19-2015 |
Patent application number | Description | Published |
20090085560 | APPARATUS AND METHODS FOR AN INDUCTIVE PROXIMITY SENSOR - An inductive proximity sensor is disclosed. The proximity sensor includes a housing having at least a first pair of inductive coils disposed within the housing. One of the first pair of inductive coils is opposite in polarity from another one of the first pair of inductive coils. The sensor optionally includes a second set of inductive coils, having opposite polarity. | 04-02-2009 |
20090140727 | APPARATUS AND METHODS FOR PROXIMITY SENSING CIRCUITRY - An inductive proximity sensor is disclosed. The proximity sensor includes a source circuit with an inductive element configured to deliver energy to a resonator when a source current is changed. In various embodiments, the source current is provided a step current source. In various embodiment, the source current is provided by constant current source coupled to the inductive element by a switch. Apparatus and methods for operating the inductive proximity sensor are disclosed. | 06-04-2009 |
20100060270 | Method and System for Inductive Proximity Sensing that Includes Mounting Effect Compensation - An inductive proximity sensor and related method for sensing a presence/position of a target, with mounting effect compensation, are disclosed. In at least one embodiment, the method includes providing a proximity sensor having first and second coils that are both at least indirectly in communication with control circuitry. The method also includes receiving respective first and second signals at least indirectly indicative of respective first and second electromagnetic field components respectively experienced by the first coil as influenced both by a target and a structure supporting the sensor and the second coil as influenced by the supporting structure. The method further includes determining by way of the circuitry a third signal based at least in part upon the first signal, as modified based at least in part upon the second signal, whereby the third signal is indicative of the presence or position of the target relative to the sensor. | 03-11-2010 |
20110057668 | INDUCTIVE PROXIMITY SENSOR - The present invention relates to an inductive proximity sensor that includes an oscillator having first and second inductor-capacitor circuits arranged such that an inductance of one of the inductor-capacitor circuits has substantially greater sensitivity to an external target than an inductance of the other inductor-capacitor circuit. The sensor also includes an alternating current drive to each of the inductor-capacitor circuits that is in-phase and depends on differences in voltage across the inductor-capacitor circuits. The sensor may be coupled to a calibration device that applies power and triggers a calibration routine within the sensor. In response to the trigger signal, a calibration processor within the sensor executes the calibration routine and adjusts the inductor-capacitor circuits and provides an indication of successful calibration. | 03-10-2011 |
20120086444 | Apparatus and Method for Reducing a Transient Signal in a Magnetic Field Sensor - A magnetic field sensor includes a compensation loop coupled in series with normal circuit couplings in order to reduce a transient signal that would otherwise be generated when the magnetic field sensor experiences a high rate of change of magnetic field. In some embodiments, the magnetic field sensor is a current sensor responsive to a magnetic field generated by a current-carrying conductor. | 04-12-2012 |
20130009638 | Apparatus And Method For Reducing A Transient Signal In A Magnetic Field Sensor - A magnetic field sensor includes a compensation loop coupled in series with normal circuit couplings in order to reduce a transient signal that would otherwise be generated when the magnetic field sensor experiences a high rate of change of magnetic field. In some embodiments, the magnetic field sensor is a current sensor responsive to a magnetic field generated by a current-carrying conductor. | 01-10-2013 |
20130020660 | Reinforced Isolation for Current Sensor with Magnetic Field Transducer - A current sensor packaged in an integrated circuit package to include a magnetic field sensing circuit, a current conductor and an insulator that meets the safety isolation requirements for reinforced insulation under the UL 60950-1 Standard is presented. The insulator is provided as an insulation structure having at least two layers of thin sheet material. The insulation structure is dimensioned so that plastic material forming a molded plastic body of the package provides a reinforced insulation. According to one embodiment, the insulation structure has two layers of insulating tape. Each insulating tape layer includes a polyimide film and adhesive. The insulation structure and the molded plastic body can be constructed to achieve at least a 500 VRMS working voltage rating. | 01-24-2013 |
20130214778 | APPARATUS AND METHOD FOR REDUCING A TRANSIENT SIGNAL IN A MAGNETIC FIELD SENSOR - A magnetic field sensor includes a compensation loop coupled in series with normal circuit couplings in order to reduce a transient signal that would otherwise be generated when the magnetic field sensor experiences a high rate of change of magnetic field. In some embodiments, the magnetic field sensor is a current sensor responsive to a magnetic field generated by a current-carrying conductor. | 08-22-2013 |