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Chen-Pin
Chen-Pin Chen, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20110248617 | REFLECTIVE LIGHT EMITTING DIODE LAMP - A reflective LED lamp includes a metallic shell, a reflecting member, and an LED unit. The metallic shell includes a surrounding wall formed with a mounting hole unit, and an accommodating space defined by the surrounding wall. The reflecting member is disposed within the accommodating space, and includes a reflection region unit configured as at least one concaved curve surface. The LED unit is disposed within the mounting hole unit in the shell for emitting light onto the reflection region unit of the reflecting member, so that the light is reflected by the reflection region unit out of the shell. | 10-13-2011 |
Chen-Pin Hung, Miao-Li County TW
| Patent application number | Description | Published |
|---|---|---|
| 20100328585 | Substrate Unit, Display Module, and Display Apparatus - A substrate unit, which can be disposed opposite to a display panel, includes a substrate and a color filter layer. The substrate has a front surface and a rear surface. The rear surface is disposed adjacent to the display panel. The color filter layer is disposed on the rear surface or between the front surface and the rear surface. A display module and a display apparatus including the substrate unit are also disclosed. | 12-30-2010 |
Chen-Pin Hung, Tainan TW
| Patent application number | Description | Published |
|---|---|---|
| 20080231772 | FLAT PANEL DISPLAY AND FABRICATION METHOD THEREOF - A flat panel display is provided. The flat panel includes at least one light emitting device having a light emitting semiconductor device and a lens. The lens includes two reflective surfaces which are disposed at both sides with respect to a central axis of the lens. Refractive surfaces connect with the respective reflective surfaces and have a tilt included angle with respect to the central axis. Each of the refractive surfaces continuously extends from the reflective surface along a direction toward the central axis. A Fresnel surface is configured between the refractive surfaces. Light rays emitted from the light emitting semiconductor device reach the lens. A portion of the light rays reaching each of the reflective surfaces is reflected to at least one of the refractive surfaces and the Fresnel surface. The reflected light rays are refracted and collected with a convergent angle. | 09-25-2008 |
| 20100203794 | FLAT PANEL DISPLAY - A method for forming a flat panel display includes disposing a light guide plate below a display panel, disposing at least one optical film between the display panel and the light guide plate, and disposing at least one illuminating device package in proximity to the light guide plate. The method for forming the illuminating device package includes forming a light emitting diode device over a substrate and forming a lens encapsulating the light emitting diode device. The lens includes two reflective surfaces disposed substantially symmetrically at either side of a central axis. The reflective surfaces is configured to reflect portions of light beams to at least one of the diffractive surfaces. The lens also includes a plurality of diffractive surfaces separating the reflective surfaces. The diffractive surfaces are configured to diffract the reflected light beams into a convergent angle. Each of the diffractive surfaces having a tilt angle respective to the central axis. | 08-12-2010 |
Chen-Pin Lee, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120133520 | COMPUTER CHASSIS SYSTEM AND HARD DISK STATUS DISPLAY METHOD THEREOF - A computer system displays and controls the hard disk condition. The computer system includes a host bus adapter which detects the status of the hard disk, and the status light gives light to display the hard disk status. The baseboard management controller and the host bus adapters are set on the motherboards, in which the baseboard management controller monitors and records the status of the hard disk. The microcontroller is set on the hard disk backplane for decoding the message from the host bus adapter in order to control the displaying of the status light. | 05-31-2012 |
Chen-Pin Peng, Beipu Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20090045476 | IMAGE SENSOR PACKAGE AND METHOD FOR FORMING THE SAME - An image sensor package is provided including a substrate; a sensor chip; a plurality of bond wires for connecting the sensor chip to the substrate at predetermined locations; a sensor housing on the substrate for substantially encompassing the sensor chip, the sensor housing having a through-hole cavity defining an optical glass (IR filter) seat, the sensor housing defining an upper surface and an edge surface thereof; an optical glass (IR filter) on the optical glass (IR filter) seat; an encapsulation material for substantially encapsulating the upper surface and edge surface of the sensor housing, a corresponding surface of the substrate adjacent the edge surface of the sensor housing, and the side edge of the optical glass (IR filter); wherein the sensor housing is provided with a gas-exit allowing possible high temperature gas to exit; the encapsulation material forms an upper surface which is substantially aligned with a top surface of the optical glass (IR filter); the encapsulation material forms an upper surface which is lower than a top surface of the optical glass (IR filter); the sensor housing defines a profile shape, the profile shape has at least a step-wise configuration for facilitating and accommodating flowing of the encapsulation material; the sensor housing has a bottom surface adhered to the substrate by an adhesive; and a slot is provided on the bottom surface of the sensor housing for accommodating the adhesive. | 02-19-2009 |
| 20090283809 | Image sensor structure and integrated lens module thereof - An image sensor structure and an integrated lens module thereof are provided. In the image sensor structure with the integrated lens module, the image sensor structure comprises a chip and a lens module. The chip has light-sensing elements, first conducting pads, and a conducting channel. The light-sensing elements are electrically connected to the first conducting pads and the first conducting pads are electrically connected to one end of the conducting channel passing through the chip. The lens module comprises a holder and at least one lens. The holder has a through hole and the lens is embedded in the through hole and integrated with the holder. By using the integrated lens and holder, a manufacturing process of the image sensor structure is simplified and a manufacturing cost of the image sensor structure is reduced. | 11-19-2009 |