Chen-Kai
Chen-Kai Chen, Taipei City TW
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20150299427 | MELAMINE FREE COMPOSITE ADDITIVE FOR POLYOXYMETHYLENE - A melamine free composite additive used in polyoxymethylene is provided. The composite additive includes an amine stabilizer and antioxidant. The composition of the amine stabilizer is 0.01 to 3 parts by weight per 100 parts by weight of the polyoxymethylene. The composition of the antioxidant is 0.05 to 3 parts by weight per 100 parts by weight of the polyoxymethylene. The composite additive enhances the light stability and thermal stability of the polyoxymethylene. | 10-22-2015 |
Chen-Kai Hsu, Miaoli City TW
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20100145639 | DIAGNOSIS METHOD OF DEFECTS IN A MOTOR AND DIAGNOSIS DEVICE THEREOF - A diagnosis method of defects in a motor and a diagnosis device thereof are described. A vibration sensing module can generate a vibration signal corresponding to a vibration of a motor during operation of the motor. Then, a data pre-processing procedure is performed to eliminate noises of the vibration signal. After the data pre-processing procedure, an analyzing procedure is performed to determine a first harmonic of spectrum features in the spectrum of the pre-processed vibration signal. And, other spectrum feature(s) is(/are) retrieved from the spectrum of the pre-processed vibration signal according to the first harmonic. Finally, a comparison procedure is performed with a defect spectrum feature database according to the retrieved spectrum features, so as to determine a defect type of the motor. | 06-10-2010 |
Chen-Kai Hsu, Tu-Chen City TW
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20110126896 | Photovoltaic Devices and Methods for Producing the Same - Disclosed herein are hybrid solar cells and methods for fabricating the same. In one aspect, the method is characterized in transferring nanowires from one substrate to another substrate. In another aspect, the method is characterized in having an organic active layer that is not made of [6,6]-phenyl-C61-butyric acid methyl ester (PCBM) and said organic active layer comprises nanowires embedded therein. | 06-02-2011 |
Chen-Kai Liao, Pingtung County TW
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20100032822 | CHIP PACKAGE STRUCTURE - A chip package structure including a first substrate, a chip, a second substrate, a plurality of conductive wires, a plurality of solder balls and a molding compound is provided. The chip is disposed on the first substrate. The second substrate disposed on the chip has an upper surface and a lower surface, in which a distance of the lower surface relative to the chip is smaller than that of the upper surface relative to the chip. The upper surface has a ball mounting surface and a wire bonding surface. A distance between the wire bonding surface and the first substrate is smaller than that between the ball mounting surface and the first substrate. The conductive wires connect the wire bonding surface to the first substrate. The solder balls are disposed on the ball mounting surface. The molding compound is disposed on the first substrate. | 02-11-2010 |
Chen-Kai Liao, Chu-Nan TW
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20140001024 | TOUCH PANEL AND TOUCH DISPLAY DEVICE | 01-02-2014 |
Chen-Kai Yu, Kunshan City CN
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20140030506 | Mixed Fiber Structure used on a Bicycle - A mixed fiber structure used on a bicycle is provided with a plurality of mixed fiber substructures which are coupled in a parallel manner to one another to form a bicycle part, each of the mixed fiber substructures includes a plurality of two types of fibers which are alternatively arranged in a parallel manner and all extend along an axial direction, between each two neighboring fibers and between each two neighboring mixed fiber substructures is arranged an adhesive layer, and one of the two types of fibers is carbon fiber. The proportion between the carbon fiber and the glass fiber can be adjusted according to the special toughness and strength requirements for specific bicycle parts. Furthermore, the carbon and glass fibers are bonded together by the adhesive layer instead of being woven together, so the manufacturing cost of the present invention can also be reduced. | 01-30-2014 |