Chen-Kai

Chen-Kai Hsu, Miaoli City TW

Patent application number	Description	Published
20100145639	DIAGNOSIS METHOD OF DEFECTS IN A MOTOR AND DIAGNOSIS DEVICE THEREOF - A diagnosis method of defects in a motor and a diagnosis device thereof are described. A vibration sensing module can generate a vibration signal corresponding to a vibration of a motor during operation of the motor. Then, a data pre-processing procedure is performed to eliminate noises of the vibration signal. After the data pre-processing procedure, an analyzing procedure is performed to determine a first harmonic of spectrum features in the spectrum of the pre-processed vibration signal. And, other spectrum feature(s) is(/are) retrieved from the spectrum of the pre-processed vibration signal according to the first harmonic. Finally, a comparison procedure is performed with a defect spectrum feature database according to the retrieved spectrum features, so as to determine a defect type of the motor.	06-10-2010

Patent application number	Description	Published
20110126896	Photovoltaic Devices and Methods for Producing the Same - Disclosed herein are hybrid solar cells and methods for fabricating the same. In one aspect, the method is characterized in transferring nanowires from one substrate to another substrate. In another aspect, the method is characterized in having an organic active layer that is not made of [6,6]-phenyl-C61-butyric acid methyl ester (PCBM) and said organic active layer comprises nanowires embedded therein.	06-02-2011

Patent application number	Description	Published
20100032822	CHIP PACKAGE STRUCTURE - A chip package structure including a first substrate, a chip, a second substrate, a plurality of conductive wires, a plurality of solder balls and a molding compound is provided. The chip is disposed on the first substrate. The second substrate disposed on the chip has an upper surface and a lower surface, in which a distance of the lower surface relative to the chip is smaller than that of the upper surface relative to the chip. The upper surface has a ball mounting surface and a wire bonding surface. A distance between the wire bonding surface and the first substrate is smaller than that between the ball mounting surface and the first substrate. The conductive wires connect the wire bonding surface to the first substrate. The solder balls are disposed on the ball mounting surface. The molding compound is disposed on the first substrate.	02-11-2010