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Chen-Fu
Chen-Fu Chang, Sanhsia Town TW
| Patent application number | Description | Published |
|---|---|---|
| 20100009847 | Thermal color change wall - A thermal color change wall having a thermal color change coating covered on the surface thereof that changes color due to a change in temperature. | 01-14-2010 |
Chen-Fu Chang, Taoyuan County TW
| Patent application number | Description | Published |
|---|---|---|
| 20080285189 | Electrostatic discharge protection device for an optical disc drive - An electrostatic discharge protection device for an optical disc drive is provided. A rail disposed on the casing of the disc drive has an opening. A guide bar is slidable disposed on the rail. A conductive elastic plate is fixed around the opening on the rail. The elastic plate has an elastic-pressing end leaning against the guide bar through the opening, and a protrusion electrically contacting the casing. A tray supported by the guide bar to move in and out of the casing has an underside covered by a protection bottom plate. A conductive strip-shaped elastic element is fixed on the tray by a fixing screw, which fastens the protection bottom plate on the tray. As such, the elastic element is in contact with the protection bottom plate; besides, the elastic element also leans against the guide bar, so as to dissipate electrostatic discharge by the guide bar. | 11-20-2008 |
| 20100032203 | PROTECTION DEVICE FOR PROTECTING A FLAT CABLE - The invention provides a protection device for protecting a flat cable in an optical disk drive. The protection device includes a casing, whereon a main board is fixed inside the casing, and an opening is formed at a front edge of the casing. The protection device further includes a tray disposed inside the casing in a slidable manner, a circuit board disposed on a bottom of the tray, the flat cable connected to the main board and the circuit board, a cover disposed on the bottom of the tray, and a support frame connected to the cover and protruding towards a rear of the casing. The support frame is disposed on the bottom of the tray and adjacent to a position, where the flat cable is connected to the circuit board, for holding the flat cable and preventing the flat cable from dropping. | 02-11-2010 |
Chen-Fu Huang, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110249138 | DISPLAY DATA EXTRACTION METHODS, DEVICES AND COMPUTER SYSTEMS UTILIZING THE SAME - A device of capturing display data is implemented in an electronic device. A first request for capture of display data associated with the display of the electronic device is received. The display is a composite image generated by a program from one or more raw data objects in the electronic device. When the first request is received, a backup of the display data, comprising the one or more raw data objects, is stored by the electronic device in form of a data structure in response to the first request | 10-13-2011 |
Chen-Fu Lin, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110169056 | HYDROGEN ION-SENSITIVE FIELD EFFECT TRANSISTOR AND MANUFACTURING METHOD THEREOF - A hydrogen ion-sensitive field effect transistor and a manufacturing method thereof are provided. The hydrogen ion-sensitive field effect transistor includes a semiconductor substrate, an insulating layer, a transistor gate, and a sensing film. A gate area is defined on the semiconductor substrate having a source area and a drain area. The insulating layer is formed within the gate area on the semiconductor substrate. The transistor gate is deposited within the gate area and includes a first gate layer. Further, the first gate layer is an aluminum layer, and a sensing window is defined thereon. The sensing film is an alumina film formed within the sensing window by oxidizing the first gate layer. Thus, the sensing film is formed without any film deposition process, and consequently the manufacturing method is simplified. | 07-14-2011 |
Chen-Fu Lin, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120086020 | Integrated photodetecting device - This invention relates to an integrated photodetecting device. The integrated photodetecting device includes a substrate, a light source layer and a photodetector layer. The photodetector layer and light source layer are epitaxied in a stacked structure. The whole device in this invention is fabricated by epitaxy method during a single process. Therefore, the production cost can be reduced by the omission of alignment process. Besides, the integrated photodetecting device of the invention integrates the light source and photodetector into one chip, hence has the ability of minimization, resulting in the reduction of consumption of samples and test time. The distance between the photodetector layer and targets to be tested can also be largely reduced, making the accuracy and sensitivity largely improved, and the kinds of detectable targets largely increased. Furthermore, the integrated photodetecting device of the invention is a portable device so as to increase the possibility of preventive medicine. | 04-12-2012 |
Chen-Fu Lin, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20100098585 | Biosensor Package Structure with Micro-Fluidic Channel - A biosensor package structure with a micro-fluidic channel is provided. The biosensor package structure includes a substrate, a biochip, and a cover. The substrate has a first surface, a second surface, and an opening. The biochip is attached on the first surface. A bio-sensing area of the biochip is exposed to the opening of the substrate. The cover is attached on the second surface to cover the opening so as to form a micro-fluidic channel. By implementing the invention, the manufacturing process of the biosensor is simplified and the productivity is increased. | 04-22-2010 |
Chen-Fu Lin, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20100099582 | Biochip Package Structure - A biochip package structure is provided. The biochip package structure includes a substrate, a biochip, at least one wire, and a molding compound. The substrate has a circuit unit electrically connected, by wiring, to the biochip defined with a sensing region. The molding compound covers the wire but leaves the sensing region of the biochip exposed, allowing a cavity to be formed in the sensing region. The cavity delivers a biomedical sample. The biomedical sample reacts in the sensing region. Thus, the biochip package structure is applicable to various medical and biochemical assays. | 04-22-2010 |
| 20110133256 | CMOS-MEMS Cantilever Structure - The present invention discloses a CMOS-MEMS cantilever structure. The CMOS-MEMS cantilever structure includes a substrate, a circuit structure, and a cantilever beam. The substrate has a circuit area and a sensor unit area defined thereon. The circuit structure is formed in the circuit area. The cantilever beam is disposed in the sensor unit area with one end floating above the substrate and the other end connecting to the circuit structure. With the above arrangement, the manufacturing process of CMOS-MEMS cantilever structure of this invention can be simplified. Furthermore, the structure of the cantilever beam is thinned down and therefore has a higher sensitivity. | 06-09-2011 |
Chen-Fu Liu, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090111757 | HCV PROTEASE INHIBITORS - Compounds of formula (I): | 04-30-2009 |
| 20090286814 | HCV PROTEASE INHIBITORS - This invention relates to macrocyclic compounds of formula (I) or (II) shown in the specification. These compounds can be used to treat hepatitis C virus infection. | 11-19-2009 |
| 20110065737 | HCV PROTEASE INHIBITORS - This invention relates to macrocyclic compounds of formula (I) shown in the specification. These compounds can be used to treat hepatitis C virus infection. | 03-17-2011 |
| 20110178107 | HCV PROTEASE INHIBITORS - This invention relates to compounds of Formula (I), (II), or (III) shown in the specification. These compounds can be used to treat hepatitis C virus infection. | 07-21-2011 |