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Chen, Fongshan City
I-Hsien Chen, Fongshan City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090208063 | DYNAMIC CALIBRATION METHOD FOR SINGLE AND MULTIPLE VEDIO CAPTURE DEVICES - The present invention discloses a dynamic calibration method for a single and multiple video capture devices. The present invention can acquire the variations of the pan angle and tilt angle of a single video capture device according to the displacement of the feature points between successive images. For a plurality of video capture devices, the present invention includes the epipolar-plane constraint between a plurality of video capture devices to achieve the goal of dynamical calibration. The calibration method in the present invention does not require specific calibration patterns or complicated correspondence of feature points, and can be applied to surveillance systems with wide-range coverage. | 08-20-2009 |
Jia Chun Chen, Fongshan City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100089744 | Method for Improving Adhesion of Films to Process Kits - A method includes providing a process chamber including a target, wherein the target has a first coefficient of thermal expansion (CTE); selecting a process kit including a surface layer having a second CTE close to the first CTE; and installing the process kit in the process chamber with the surface layer exposed to the process chamber. A ratio of a difference between the first CTE and the second CTE is less than about 35 percent. | 04-15-2010 |
Lung-Tai Chen, Fongshan City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090020862 | DEVICE STRUCTURE WITH PREFORMED RING AND METHOD THEREFOR - A device structure with preformed ring includes a sensor chip and a ring disposed and surrounded on periphery of sensitive area of an active surface thereof. The device structure with preformed ring may batchly bind and electrically connect to a carrier by a way of two-dimension array, and then a packaging process is performed. During the packaging process, the top portion of the ring can be used to against the inner side of a packaging mold, so as to stop the packaging material covering the device at outside of the ring and stick with the ring. Therefore, an opening is formed on the sensitive area surface of the device. Depending on the ring, the extra process for eliminating the packaging material on the sensitive area surface can be avoided in the conventional process. | 01-22-2009 |
| 20090121299 | Wafer level sensing package and manufacturing process thereof - A wafer level sensing package and manufacturing process thereof are described. The process includes providing a wafer having sensing chips, in which each sensing chip has a sensing area and pads; forming a stress release layer on a wafer surface; cladding a photoresist layer on the stress release layer; patterning the photoresist layer to expose the pads and a portion of the stress release layer, without exposing opening areas of the sensing areas; forming a conductive metal layer of re-distributed pads on the portion of the stress release layer exposed by the photoresist layer; removing the photoresist layer; forming a re-cladding photoresist layer on the stress release layer and the conductive metal layer; forming holes in the re-cladding photoresist layer above the re-distributed pad area; and forming conductive bumps in the holes to electrically connect to the conductive metal layer. | 05-14-2009 |
| 20090124074 | WAFER LEVEL SENSING PACKAGE AND MANUFACTURING PROCESS THEREOF - A wafer level sensing package and manufacturing process thereof are described. The process includes providing a wafer having sensing chips, in which each sensing chip has a sensing area and pads; forming a stress release layer on a wafer surface; cladding a photoresist layer on the stress release layer; patterning the photoresist layer to expose the pads and a portion of the stress release layer, without exposing opening areas of the sensing areas; forming a conductive metal layer of re-distributed pads on the portion of the stress release layer exposed by the photoresist layer; removing the photoresist layer; forming a re-cladding photoresist layer on the stress release layer and the conductive metal layer; forming holes in the re-cladding photoresist layer above the re-distributed pad area; and forming conductive bumps in the holes to electrically connect to the conductive metal layer. | 05-14-2009 |
| 20090129622 | MEMS MICROPHONE MODULE AND MANUFACTURING PROCESS THEREOF - A micro-electro-mechanical system (MEMS) microphone module and a manufacturing process thereof are described. A thickness of a transparent temporary cover plate temporarily disposed in a conventional plastic package structure is adjusted. After a mold for a plastic protector is formed, an UV ray is utilized to irradiate the mold to reduce adherence on the temporary cover plate and a back surface of the MEMS acoustic wave sensing chip. Then, the temporary cover plate is removed, and the left space left is the main source for the back-volume of the MEMS microphone. Finally, a tag is covered on the plastic protector, so as to define the whole back-volume and form a closed back-volume. In the above-mentioned process, the size of the back-volume is the same as an area of the whole MEMS microphone chip. In addition, the back-volume can be defined. | 05-21-2009 |
Mei-Yu Chen, Fongshan City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100308499 | METHOD FOR FORMING A COMPOSITE LAMINATE - A method for forming a composite laminate includes: providing an upper die and a lower die; disposing the composite laminate over a die cavity of the lower die, and lowering the upper die onto the composite laminate and thereafter into the die cavity so as to hot press the composite laminate; folding inwardly a marginal end of the composite laminate that extends outwardly of the die cavity; removing the lower die from the upper die; and removing the upper die from the hot-pressed composite laminate. | 12-09-2010 |
Meng-Kun Chen, Fongshan City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090273048 | IMAGE-SENSING CHIP PACKAGE MODULE ADAPTED TO DUAL-SIDE SOLDERING - An image-sensing chip package module adapted to dual-side soldering includes three substrates, an image-sensing chip and a filter lens. The three substrates are stacked together by pressing (using adhesive as adhesion medium), and the image-sensing chip is electrically connected to the top side of the top substrate and the bottom side of the bottom substrate via conductive bodies that are formed on inner surfaces of through holes passing through the three substrates. Hence, the image-sensing chip package module can use the conductive bodies formed on the bottom side of the bottom substrate (positive face electrical conduction) or the conductive bodies formed on the top side of the top substrate (negative face electrical conduction) to electrically connect with a main PCB. Furthermore, the filter lens is received and hidden in an opening of the top substrate in order to prevent the filter lens from being slid, collided and destroyed. | 11-05-2009 |
Yao-Jen Chen, Fongshan City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090051540 | ANTI-FAKE PACKAGING MATERIAL OF RFID AND ITS PACKAGING METHOD - A RFID packaging material packaging method includes the steps of: providing a substrate having a conductive layer covered thereon, processing the conductive layer of the substrate to form an antenna, electrically connecting a chip to the antenna via a pad, and covering the substrate onto a product for enabling the product to provide a RFID recognition function. The invention relates also to the RFID packaging material made subject to this RFID packaging material packaging method. | 02-26-2009 |
Yuan-Chin Chen, Fongshan City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100072920 | DRIVE SYSTEM FOR ILLUMINATION DEVICE - A drive system for an illumination device includes a plurality of LEDs; an extra load; an illumination setting unit, for providing an illumination parameter such as a work cycle; a power supply unit, for providing a DC current; a microprocessor, for receiving the illumination parameter and generating a plurality of drive signals and a compensation signal according to the received illumination parameter; a plurality of first drive units, for driving the LEDs to receive the DC current in the high-level cycle for illumination; and a second drive unit, for receiving the compensation signal and outputting the DC current to the extra load according to the compensation signal. | 03-25-2010 |