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Chao-Yuan
Chao-Yuan Chiang, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20100324223 | FIBER COMPOSITION AND FIBER MADE FROM THE SAME - A fiber modifier for improving thermo-bonding affinity of a composite fiber to a natural fiber includes a blend of maleic anhydride and a copolymer component selected from a copolymer of ethylene and acrylic acid, a copolymer of ethylene and methacrylic acid, and combinations thereof. A core and sheath composite fiber including a sheath component made from a fiber composition that contains the above fiber modifier is also disclosed. | 12-23-2010 |
Chao-Yuan Huang, Tai Chung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090050922 | Front and rear covering type LED package structure and method for packaging the same - A front and rear covering type LED package structure includes an insulating body, a substrate unit, at least one light-emitting element, and a package colloid. The insulating body has a receiving space. The substrate unit has two electrode pins separated from each other. Each electrode pin has one side covered by the insulating body. Each electrode pin has another side bent into a U-shape and exposed outside the insulating body in order to cover two opposite lateral sides and front and rear sides of the insulating body by a front and rear covering method. The at least one light-emitting element is received in the receiving space and electrically connected with the two electrode pins of the substrate unit. The package colloid is filled into the receiving space of the insulating body. | 02-26-2009 |
| 20100006880 | Led chip package structure using sedimentation and method for making the same - An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature. | 01-14-2010 |
Chao-Yuan Huang, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090145481 | NANO-OPTOELECTRONIC DEVICES - Optoelectronic devices with multiple nano-scale quantum dots detecting photons are presented. A nano-optoelectronic device includes a semiconductor substrate, an insulation layer on the semiconductor substrate, and a nano-optoelectronic structure on the insulation layer. The nano-optoelectronic structure includes a positive semiconductor, a negative semiconductor, and a plurality of quantum dots disposed therebetween. A first electrode connects the negative semiconductor, and a second electrode connects the positive semiconductor. | 06-11-2009 |
Chao-Yuan Yang, Tamshui Chen TW
| Patent application number | Description | Published |
|---|---|---|
| 20090045897 | TRANSFORMER AND TRANSFORMER ASSEMBLY - The transformer has a bobbin, a coil assembly and a magnetic core assembly. The bobbin is mounted in the magnetic core assembly and has multiple connecting pins being formed on at least one side of a bottom surface of the bobbin. Each connecting pin has a top surface as a soldering surface that corresponds to a solder pad on a back of a circuit board. At least one fastener is further formed on the bottom surface of the circuit board. Therefore, when the transformer is mounted through the circuit board, the connecting pins are soldered on the back of the circuit board to reduce the total thickness of the combination of the transformer and the circuit board. | 02-19-2009 |