Chao, TW
Aldous Chao, Nantou County TW
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20120041401 | MINUS-PRESSURED BANDAGE - A minus-pressured bandage includes a coverage layer, a minus-pressed acting member, an adhering layer and a fixing tap. The coverage layer includes a through-hole to be connected to a minus-pressured device. The minus-pressed acting member includes a fixed-shaped layer and a contact layer abutting with the fixed-shaped layer. The contact layer is made of a resilient material. The fixed-shaped layer has hardness greater than that of the contact layer. Each of the fixed-shaped layer and contact layer has a plurality of first absorbing holes and a plurality of second absorbing holes aligned with the first absorbing holes. The adhering layer is porous and abuts between the coverage layer and the fixed-shaped layer. The fixing tap is arranged on the coverage layer in order to fasten the minus-pressured bandage on the wound. In this arrangement, a minus-pressured suction applied to the wound may be increased to facilitate capillary angiogenesis. | 02-16-2012 |
Aldous Chao, Nantou City TW
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20100058597 | SAW BLADE GUARD UNIT - A saw blade guard unit is used in cooperation with a handsaw having a saw blade and a handle connected with the saw blade. The saw blade guard unit includes a flexible strip and a holder. The flexible strip has a head end, a tail end for positioning to a front portion of the saw blade of the handsaw, and a body between the head end and the tail end for guarding teeth of the saw blade of the handsaw. The holder is adapted for mounting to the handle of the handsaw. The holder is connected with the head end of the flexible strip and capable of rolling up the flexible strip | 03-11-2010 |
Chang-Po Chao, Banqiao City TW
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20110267303 | CAPACITIVE TOUCH PANEL - The present invention discloses a capacitive touch panel comparing a first electrode layer, a dielectric layer and a second electrode layer. The first electrode layer has a first pattern. Also, the dielectric layer is disposed under the first electronic layer with a second pattern. Moreover, the first pattern and the second pattern are complementary. | 11-03-2011 |
Chen-Yu Chao, Shulin City TW
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20110231766 | Systems and Methods for Customizing Photo Presentations - Various systems and methods are described for customizing photo presentations. One particular method comprises receiving by the media display system, a plurality of photos depicting individuals and displaying one or more controls for specifying an action to one or more selected individuals. The method further comprises receiving a selection of one or more individuals, generating an action list according to the selection, and customizing the photo presentation comprising photos from among the received plurality of photos according to the action list and according to the analyzed facial regions. | 09-22-2011 |
20130051756 | Systems and Methods of Detecting Significant Faces in Video Streams - Systems and methods of processing video streams are described. A face is detected in a video stream. The face is tracked to determine a video clip associated with one of a plurality of individuals. The video segment is assigned to a group of video clips based on the associated individual. A significant face is detected in the group of video clips when the detected face meets one or more significance criteria. The significance criteria describes a face-frame characteristic. A representation of the significant face is displayed in association with a representation of the group of video clips. The order of the significance criteria is adjusted through a user interface. | 02-28-2013 |
Chia-Chen Chao, New Taipei City TW
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20110291818 | METHOD FOR STORING CONTROL SIGNALS OF REMOTE CONTROLLER AND ELECTRONIC DEVICE USING THE SAME - The present invention provides a method for storing control signals and an electronic device using the method. An object thereof is receiving and storing control signals sent from a remote controller. The method comprises: using the electronic device to receive a first control signal sent from the remote controller by pressing a first key of the remote controller; performing a comparison program between the first control signal and a query record comprising a plurality of function options and a plurality of corresponding control signals; dynamically displaying a function option of the function options and a corresponding modification prompt according to a result of the comparison program; and updating and storing a control signal corresponding to the function option of the query record. | 12-01-2011 |
Chia Hsin Chao, Dadu Shiang TW
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20100321640 | PROJECTION DISPLAY CHIP - A projection display chip comprises a micro light emitting array comprising a plurality of micro LEDs, a micro collimation array comprising a plurality of micro collimation devices, and a projection micro lens array comprising a plurality of micro lenses. Each micro LED has a corresponding driving circuit device. The plurality of micro lenses has different optical axes to enlarge projected images. | 12-23-2010 |
Chia-Hsin Chao, Taichung City TW
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20110297975 | LIGHT-EMITTING UNIT ARRAY - A light-emitting unit array includes a plurality of light-emitting units arranged and integrated monolithically in an array, and each of the light-emitting units includes a first doped type layer, a second doped type layer, a light-emission layer, and a photonic crystal structure. The light emission layer is disposed between the first doped type layer and the second doped type layer, wherein the second doped type layer has a surface facing away from the light emission layer. The photonic crystal structure is disposed on the surface of the second doped type layer. | 12-08-2011 |
20110299044 | PROJECTION APPARATUS - A projection apparatus is provided. The projection apparatus includes a light-emitting unit array, an optical sensor, and a control unit. The light-emitting unit array is for emitting an image beam. The optical sensor is for detecting electromagnetic waves so as to generate a signal. The control unit is electrically coupled to the light-emitting unit array and the optical sensor for controlling emission of the light-emitting unit array according to the signal from the optical sensor. | 12-08-2011 |
20130026511 | TRANSFER-BONDING METHOD FOR THE LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE ARRAY - A transfer-bonding method for light emitting devices including following steps is provided. A plurality of light emitting devices is formed over a first substrate and is arranged in array, wherein each of the light emitting devices includes a device layer and a sacrificial pattern sandwiched between the device layer and the first substrate. A protective layer is formed over the first substrate to selectively cover parts of the light emitting devices, and other parts of the light emitting devices are uncovered by the protective layer. The device layers uncovered by the protective layer are bonded with a second substrate. The sacrificial patterns uncovered by the protective layer are removed, so that parts of the device layers uncovered by the protective layer are separated from the first substrate and are transfer-bonded to the second substrate. | 01-31-2013 |
20130135507 | PHOTOGRAPHY AND PROJECTION APPARATUS AND LIGHT EMITTING AND SENSING MODULE - A photography and projection apparatus including a light emitting and sensing module and a projection lens is provided. The light emitting and sensing module has a light emitting and sensing area, and includes a light emitting unit array and a light sensing unit array. The light emitting unit array includes a plurality of light emitting units arranged in an array. The light emitting units are distributed in the light emitting and sensing area. The light emitting unit array is adapted to provide an image beam. The light sensing unit array includes a plurality of light sensing units arranged in an array. The light sensing units are distributed in the light emitting and sensing area. The projection lens is disposed on a transmission path of the image beam. A light emitting and sensing module is also provided. | 05-30-2013 |
20130214302 | LIGHT EMITTING ELEMENT AND FABRICATING METHOD THEREOF - A fabricating method of light emitting element. A substrate is provided. A plurality of first concaves and a plurality of second concaves are formed on the substrate, wherein a volume of each first concave is different from a volume of each second concave. A plurality of first light emitting diode chips and a plurality of second light emitting diode chips are provided, wherein a volume of each first light emitting diode chip is corresponding to the volume of each first concave, and a volume of each second light emitting diode chip is corresponding to the volume of each second concave. The first light emitting diode chips are moved onto the substrate such that the first light emitting diode chips go into the first concaves, and the second light emitting diode chips are moved onto the substrate such that the second light emitting diode chips go into the first concaves. | 08-22-2013 |
20130236183 | VISIBLE LIGHT COMMUNICATION TRANSCEIVER AND SYSTEM - A visible light communication (VLC) transceiver and a VLC system are provided. The VLC transceiver includes a substrate, a lens module and a plurality of channel units. The channel units are disposed on the substrate in an array to provide different bidirectional communication channels. Wherein, each of the channel units respectively includes at least a visible light emitter and at least a visible light receiver. The channel units can enhance communication bandwidth by using modulation technology such as spatial multiplexing or time multiplexing. The lens module is disposed on an optical path of the channel units. The lens module actively tracks the receiving situation of the visible light receiver to improve the signal quality of high-speed multiplexing communication. | 09-12-2013 |
20130341659 | DISPLAY PANEL - A display panel including a substrate, a meshed shielding pattern, and a plurality of light-emitting devices is provided. The meshed shielding pattern is disposed on the substrate so as to define a plurality of pixel regions on the substrate. The light-emitting devices are disposed on the substrate. At least one light-emitting device of the light-emitting devices is disposed in each pixel region of the pixel regions, wherein an area of the pixel region is A1, an area of the light-emitting device is A2, and a ratio of A2 to A1 is below 50%. | 12-26-2013 |
20150063386 | SEMICONDUCTOR LASER STRUCTURE - A semiconductor laser structure is provided. The semiconductor laser comprises a central thermal shunt, a ring shaped silicon waveguide, a contiguous thermal shunt, an adhesive layer and a laser element. The central thermal shunt is located on a SOI substrate which has a buried oxide layer surrounding the central thermal shunt. The ring shaped silicon waveguide is located on the buried oxide layer and surrounds the central thermal shunt. The ring shaped silicon waveguide includes a P-N junction of a p-type material portion, an n-type material portion and a depletion region there between. The contiguous thermal shunt covers a portion of the buried oxide layer and surrounds the ring shaped silicon waveguide. The adhesive layer covers the ring shaped silicon waveguide and the buried oxide layer. The laser element covers the central thermal shunt, the adhesive layer and the contiguous thermal shunt. | 03-05-2015 |
20150063745 | OPTICAL COUPLING MODULE - An optical coupling module includes a silicon photonic substrate, and an optical waveguide module. The silicon photonic substrate has a first surface and a first grating on the first surface for diffracting the light which passes through the grating. The optical waveguide module is disposed on the silicon photonic substrate, wherein the optical waveguide module includes an optical waveguide having an end disposed in corresponding to the first grating of the silicon photonic substrate. Otherwise, the optical waveguide module has a reflective surface coupled to the end of the optical waveguide and adapted to reflect the light emerging from or incident into the grating to form an optical path between the silicon photonic substrate and the optical waveguide for transmitting the light. | 03-05-2015 |
Chieh-Yuan Chao, Jhubei City TW
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20090109242 | DISPLAY APPARATUS - A display apparatus including a process module, a screen and an electric module is provided. The process module determines the display mode of an image according to the format of the image. The screen coupling the process module displays the image. The electric module coupling the screen and the process module adjusts the screen in the orientation in accordance with the display mode of the image. Thus, the display apparatus automatically adjusts the screen in the orientation in accordance with whether the display mode of an image is in the portrait mode or the landscape mode. | 04-30-2009 |
Chien-Hsin Chao, Xiushui Township TW
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20110296692 | Utensil that is Decomposed Naturally and the Method for Making It - A method for making a utensil includes a first step of placing and stirring a mixture containing a melamine resin of 30-60%, a bamboo fiber powder of 30-60% and an adjuvant of 5% to form an evenly distributed first blank, a second step of cooling the first blank to form a second blank, a third step of pressing and molding the second blank to form a semi-product, and a fourth step of polishing the semi-product to form a final product of the utensil. Thus, all of the melamine resin, the bamboo fiber powder and the adjuvant are made of organic material so that the utensil can be decomposed naturally and will not pollute the environment when it is disposed of to achieve the environmental protection purpose. | 12-08-2011 |
20110309088 | Utensil that is Decomposed Naturally and the Method for Making It - A method for making a utensil includes a first step of placing and stirring a mixture containing a thermoplastic material of 20-60%, a bamboo fiber powder of 20-60% and an adjuvant of 10-20% to form an evenly distributed first blank, a second step of graining the first blank to form multiple grains with uniform sizes, a third step of baking the multiple grains to form a semi-product, and a fourth step of injection molding the semi-product to form a final product of the utensil. Thus, the utensil is made of the bamboo fiber powder so that the utensil will not consume the foodstuff of the natural resource. | 12-22-2011 |
20120328833 | Double-face Antiskid Mat - An antiskid mat includes a mat body having a front face and a rear face. Each of the front face and the rear face of the mat body is provided with a plurality of convex portions and a plurality of concave portions. Thus, each of the concave portions of the mat body is compressed and restored to produce a vacuum suction force so that each of the concave portions of the mat body is attached to the object closely and exactly so as to provide an antiskid effect to the user. | 12-27-2012 |
Chien-Lian Chao, Taoyuan TW
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20100298283 | PHARMACEUTICAL COMPOSITION FOR ENHANCING IMMUNITY, AND EXTRACT OF PORIA - A pharmaceutical composition is used to enhance immunity of the human body. The composition contains potent components of lanostane compounds. A method is devised to obtain an extract from metabolite, sclerotium, or fermentation product of | 11-25-2010 |
20140065174 | PHARMACEUTICAL COMPOSITION FOR ENHANCHING IMMUNITY, AND EXTRACT OF PORIA - A pharmaceutical composition is used to enhance immunity of the human body. The composition contains potent components of lanostane compounds. A method is devised to obtain an extract from metabolite, sclerotium, or fermentation product of | 03-06-2014 |
Chih-Han Chao, Miao-Li TW
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20090027317 | Electro-wetting display device - An exemplary electro-wetting display (EWD) device includes an upper substrate, a lower substrate opposite to the upper substrate, a plurality of side walls interposed between the upper and lower substrates and cooperating with the upper and lower substrates to form a plurality of pixel units, a first polar liquid disposed in the pixel units, a second, colored, non-polar liquid disposed in the pixel units and being immiscible with the first liquid, and a plurality of scanning lines disposed on the lower substrate and parallel to and spaced apart from each other for providing scanning signals to the pixel units. Each of the pixel units corresponds to at least part of a corresponding previous scanning line. | 01-29-2009 |
Chih-Han Chao, Taoyuan TW
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20110294067 | PHOTOSENSITIVE RESIN COMPOSITION - A photosensitive resin composition is disclosed. The photosensitive resin composition includes an alkali soluble resin with an epoxy structure, a photopolymerizable compound having an ethylenically unsaturated bond, a photoinitiator, and a thermal curing agent. The photosensitive resin composition provides great surface hardness, adhesion and transmittance to meet industrial requirements. | 12-01-2011 |
Chih-Hang Chao, Taipei-Hsien TW
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20090016024 | MOTHERBOARD - A motherboard includes a printed circuit board, a first chip and a second chip arranged on the printed circuit board in parallel. A plurality of securing holes are defined in the printed circuit board around the first chip. At least one isolating hole is defined in the printed circuit board between the second chip and a first line determined by two of the securing holes close to the second chip. Should the printed circuit board suffer an impact, damage to the chips may be effectively minimized or prevented. | 01-15-2009 |
Chih-Ping Chao, Juhdong Town TW
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20110177668 | METHOD OF MAKING A THIN FILM RESISTOR - A method of making a thin film resistor includes: forming a doped region in a semiconductor substrate; forming a dielectric layer over the substrate; forming a thin film resistor over the dielectric layer; forming a contact hole in the dielectric layer before annealing the thin film resistor, wherein the contact hole exposes a portion of the doped region; and performing rapid thermal annealing on the thin film resistor after forming the contact hole. | 07-21-2011 |
Chih-Yeh Chao, Ping-Tung Hsien TW
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20110086726 | Iron-based alloy for a golf club head - An iron-based alloy for a golf club head includes: chromium in an amount ranging from 16.3 to 17.2 wt %; nickel in an amount ranging from 5.8 to 6.5 wt %; nitrogen in an amount ranging from 0.10 to 0.20 wt %; carbon in an amount ranging from 0.01 to 0.12 wt %; silicon in an amount ranging from 0.3 to 1.2 wt %; manganese in an amount ranging from 0.3 to 1.2 wt %; and a balance of iron and impurities, based on a total weight of the iron-based alloy. The alloy has a duplex-phase microstructure including a martensite phase and 10 to 30 percent austenite phase, and has a tensile strength greater than 120 Ksi and an elongation greater than 35%. | 04-14-2011 |
Chi-Mou Chao, Hsinchu County TW
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20080279056 | Calibration Method for Determining Servo Parameters for Accessing an Optical Disc - Calibration methods are provided for determining servo parameters to enhance an optical drive in reading and writing a blank optical disc. First, test data is written on the blank disc with various writing parameters. Second, the written test data is read from the optical disc with various reading parameters. A plurality of quality measures are obtained, each corresponds to a specific combination of the writing parameter and the reading parameter. An optimal writing parameter and an optimal reading parameter are determined by comparing the quality measures with respect to both the reading and writing parameters respectively. | 11-13-2008 |
20110308547 | CLEANER AND PATH CONTROLLING METHOD THEREOF - A cleaner adapted to clean particles on a plate is provided. The cleaner includes an active driver and a slave driver. The active driver includes a plurality of active cleaning wheels and a control system. Each of the active cleaning wheels includes a first magnet, and the first magnet has an even number of magnetic poles. The control system is electronically connected with the active cleaning wheels so as to control a rotation of the active cleaning wheels. The slave driver includes a plurality of slave cleaning wheels. Each of the slave cleaning wheels includes a second magnet, and the second magnet has an even number of magnetic poles. The plate is disposed between the active driver and the slave driver. The second magnets are disposed opposite to the first magnets, so that the active cleaning wheels drive the slave cleaning wheels to rotate by a magnetic force. | 12-22-2011 |
20130037050 | CLEANER AND PATH CONTROLLING METHOD THEREOF - A cleaner includes at least one cleaning component, a pump module, a driving module and a control system. The at least one cleaning component and the plate delimit at least one space. The pump module is connected to the at least one space to pump air out of the at least a space to form a negative air pressure in the at least one space so that the cleaner is sucked on the plate. The driving module is connected to the at least a cleaning component to drive the at least a cleaning component. The control system is coupled to the pump module and the driving module and controls the driving module to cause the at least one driven cleaning component to make a movement on the plate. | 02-14-2013 |
Ching-Hung Chao, Hsin-Tien TW
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20120042156 | METHOD OF MULTIPLE BOOT MANAGER - The present invention provides a method of multiple boot manager in a computer equipped with BIOS and a storing medium. The storing medium is defined with a partition for multiple boot manager, a first partition and a second partition, wherein the partition for multiple boot manager contained with a multiple boot manager and address flags. Firstly, starting up a computer is executed for loading a first operating system located on the first partition. Then altering operating system is executed which includes: executing an application program and creating a conversational option interface for choice by the user; altering the address flag to direct the second partition. Finally, rebooting a computer is executed which includes: unloading the first OS; loading the partition for multiple boot manager; directing to the second partition according to the address flag of the partition for multiple boot manager and multiple boot manager loading the second partition; loading the second OS located on the second partition. | 02-16-2012 |
Ching-Ian Chao, Hsinchu County TW
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20100033517 | BI-STABLE DISPLAY AND DRIVING METHOD THEREOF - A bi-stable display having a plurality of bi-stable light emitting diodes (LEDs) and a driver are provided. The bi-stable LEDs have bi-stable memory characteristics and emit light according to a plurality of specified voltages, wherein the driver is used to apply the specified voltages to the bi-stable LEDs. The driver further has a brightness controller. The brightness controller is used to control the brightness of the bi-stable display by controlling a plurality of durations in which the specified voltages are applied to the bi-stable LEDs for a plurality of frames. | 02-11-2010 |
Ching-Kong Chao, Danshuei Township TW
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20090210009 | Vertebral Fixation Plate Assembly - A vertebral fixation plate assembly for insertion into the resection site between two vertebrae of a patients vertebral column and fixation to front or lateral side of the two adjacent vertebral bodies above and below the resection site by means of surgical implantation is disclosed to include a fixation plate that has a plurality of round holes and elongated holes and an opening on the middle, a plurality of bone screws respectively inserted through the round holes and elongated holes for fastening the fixation plate to the patient's vertebral column, and a cage affixed to the opening on the fixation plate and holding holes cut through the periphery for bone fusion and grow. The cage is linked to a vertebral spacer for artificial vertebrae by means of bone fusion to prevent vertebral sinking or slipping of the vertebral spacer and to improve bone fusion efficiency. | 08-20-2009 |
Chuan Hao Chao, Tainan TW
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20100231366 | DOOR BELL WITH COMPACT PROFILE - A door bell includes a case and a frame is located within the open space of the case. An electromagnetic valve is connected to the frame and controls two hit pins and a circuit board is connected to the frame and electronically connected to the electromagnetic valve. Two resilient members are mounted to the hit pins which hit a sound plate located beneath the hit pins to generate sound. The sound is amplified by two sound boxes. The circuit board transfers alternative current into direct current so that no hulky part projecting from the door bell. | 09-16-2010 |
Chu-Lung Chao, Luzhu Township TW
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20110197961 | CONDUCTIVE ALUMINUM PASTE AND THE FABRICATION METHOD THEREOF, THE SOLAR CELL AND THE MODULE THEREOF - This present disclosure relates to conductive aluminum paste for fabricating a silicon solar cell. Herein, the conductive aluminum paste is composed of organic carrier, aluminum powder, nano-scale metal particle, and glass frit, wherein the nano-scale metal particle has a particle size distribution D50 in the range from 10 nanometers to 1000 nanometers and the weight percentage of the nano-scale metal particle associated with the conductive aluminum paste is around 0.1 through 10 wt %. Furthermore, the characteristics of the conductive aluminum paste are for reducing the sheet resistance value of the electrode, increasing the adhesion in the silicon solar cell package module, and enhancing the electro-optical conversion efficiency of the silicon solar cell. | 08-18-2011 |
20140174529 | CONDUCTIVE ALUMINUM PASTE AND THE FABRICATION METHOD THEREOF, THE SOLAR CELL AND THE MODULE THEREOF - This present disclosure relates to conductive aluminum paste for fabricating a silicon solar cell. Herein, the conductive aluminum paste is composed of organic carrier, aluminum powder, nano-scale metal particle, and glass frit, wherein the nano-scale metal particle has a particle size distribution D50 in the range from 10 nanometers to 1000 nanometers and the weight percentage of the nano-scale metal particle associated with the conductive aluminum paste is around 0.1 through 10 wt %. Furthermore, the characteristics of the conductive aluminum paste are for reducing the sheet resistance value of the electrode, increasing the adhesion in the silicon solar cell package module, and enhancing the electro-optical conversion efficiency of the silicon solar cell. | 06-26-2014 |
Chun-Ling Chao, Sijhih City TW
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20090127790 | Electronic target device - A electronic target device comprises two dielectric sheets, two conductive layers formed on one surface of the dielectric sheets and defining a plurality of contact regions, a plurality of leading wires located on the other surfaces of the dielectric sheets and penetrate the dielectric sheets to connect the contact regions respectively, and a plurality of dielectric grains distributed over the contact regions. A target housing which the dielectric sheets are installed therein with a target member and the opposite ends of the leading wires connect to a circuit board which set in the housing for the shooting practice and competition. When ammo or pellets hit on the target member, one of the dielectric sheets abutting the target member is pressed to touch the other dielectric sheet for the conductive layers electrical connecting each other and produce a target-hit signal for transmitting to the circuit board registered and shown accumulated score. | 05-21-2009 |
Donald Y. Chao, Hsin-Chu City TW
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20090014813 | Metal Gates of PMOS Devices Having High Work Functions - A semiconductor structure includes a refractory metal silicide layer; a silicon-rich refractory metal silicide layer on the refractory metal silicide layer; and a metal-rich refractory metal silicide layer on the silicon-rich refractory metal silicide layer. The refractory metal silicide layer, the silicon-rich refractory metal silicide layer and the metal-rich refractory metal silicide layer include same refractory metals. The semiconductor structure forms a portion of a gate electrode of a metal-oxide-semiconductor device. | 01-15-2009 |
Gwo-Cheng Chao, Taichung TW
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20100011297 | METHOD AND SYSTEM FOR GENERATING INDEX PICTURES FOR VIDEO STREAMS - A method and system is proposed for generating index pictures for video streams, where the index pictures can be used in a video database for visual browsing by users to quickly find and retrieve video clips or files from the video database. The proposed method and system operates in such a manner as to first create a set of content items of particular interest or concern (particularly moving objects), and then combine each content item together with an associated activity record dataset in a predefined manner into a single image to serve as an index picture. In practice, each moving object and its associated activity record dataset can be displayed by means of 2D (two-dimensional) or 3D (three-dimensional) graphic icons or imagery. | 01-14-2010 |
Han-Yu Chao, Tainan County TW
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20080265781 | LIGHT SOURCE MODULE - A light source module including a circuit substrate, light emitting chip packages, and driving devices is provided. The circuit substrate has a top surface and a bottom surface opposite to the top surface. The bottom surface has at least one component installed area and at least one metal exposed area. The light emitting chip packages are disposed on the top surface. The driving devices are disposed in the component installed area. The driving devices are electrically connected to the light emitting chip packages through the circuit substrate. | 10-30-2008 |
20080284692 | METHOD FOR CONTROLLING BACKLIGHT APPARATUS AND LUMINANCE CONTROL CIRCUIT THEREOF - A luminance control circuit including a detection unit, a control unit and a current adjustor is provided. The detection unit detects a working current of each light emitting module and produces detection signals to be transmitted to the control unit. The control unit produces control signals according to the detection signals to be transmitted to the current adjustor. The current adjustor adjusts each of the working currents of each of the light emitting modules according to the control signals. | 11-20-2008 |
20090295298 | LIGHT SOURCE DRIVING CIRCUIT - A light source driving circuit includes a power supply circuit, a first dimming circuit, and a control circuit. The power supply circuit has a control terminal and an output terminal that is connected to a terminal of a first light-emitting element. The first dimming circuit has a first terminal connected to the other terminal of the first light-emitting element, a second terminal connected to a common potential, and a pulse width signal input terminal. The control circuit is connected between the pulse width input terminal of the first dimming circuit and the control terminal of the power supply circuit. The first dimming circuit determines an ON/OFF state according to a logic state of the pulse width signal. The power supply circuit determines whether or not to output the voltage. The control circuit delays the power supply circuit, turns off the power supply circuit, and delays the first dimming circuit. | 12-03-2009 |
Hao-Po Chao, Chung Ho City TW
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20110153961 | STORAGE DEVICE WITH FUNCTION OF VOLTAGE ABNORMAL PROTECTION AND OPERATION METHOD THEREOF - The present invention discloses a storage device and an operation method thereof. The storage device includes a non-volatile memory for storing data, a control unit coupled to the non-volatile memory, a power supply unit coupled to an external power source and converting the external power source to a suitable voltage for the non-volatile memory and the control unit, and a power monitor unit for monitoring the external power source. When the external power source falls below a low voltage threshold of the non-volatile memory, a control signal is transmitted into the control unit so as to stop accessing the non-volatile memory. The non-volatile memory finishes the last processing procedure according to the last programming instruction sent by the control unit before the control signal for protecting the data stored in the non-volatile memory. | 06-23-2011 |
Hou-Hsun Chao, Taoyuan Hsien TW
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20090259066 | Method for preparing prostaglandin F analogue - A method for preparing a prostaglandin F analogue represented by the following formula (I) is disclosed, | 10-15-2009 |
Hsiao-Shu Chao, Hsin-Chu County TW
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20110035717 | Design Optimization for Circuit Migration - An embodiment of the present invention is a computer program product for providing an adjusted electronic representation of an integrated circuit layout. The computer program product has a medium with a computer program embodied thereon. Further, the computer program comprises computer program code for providing full node cells from a full node netlist, computer program code for scaling the full node cells to provide shrink node cells, computer program code for providing a timing performance of the full node cells and the shrink node cells, computer program code for comparing the timing performance of the full node cells to the timing performance of the shrink node cells, and computer program code for providing a first netlist. | 02-10-2011 |
Hsiao-Shu Chao, Baoshan Township TW
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20110072405 | Chip-Level ECO Shrink - In a method of forming an integrated circuit, a layout of a chip representation including a first intellectual property (IP) is provided. Cut lines that overlap, and extend out from, edges of the first IP, are generated. The cut lines divide the chip representation into a plurality of circuit regions. The plurality of circuit regions are shifted outward with relative to a position of the first IP to generate a space. The first IP is blown out into the space to generate a blown IP. A direct shrink is then performed. | 03-24-2011 |
20120226479 | Method of Generating RC Technology File - A method of generating resistance-capacitance (RC) technology files is disclosed. The method comprises receiving a plurality of metal schemes from an IC foundry and dividing the plurality of metal schemes into one or more modular RC groups. The method further comprises identifying a modular RC structure; calculating capacitance values of the modular RC structure by means of a field solver; calculating an equivalent dielectric constant and an equivalent height of the RC structure based upon a variety of interconnect layers not having interconnects; calculating an equivalent dielectric constant and an equivalent height for each of the plurality of metal schemes; and deriving capacitance values of each of the plurality of metal schemes from the capacitance values of the modular RC structure. | 09-06-2012 |
20130014070 | SYSTEMS AND METHODS FOR CREATING FREQUENCY-DEPENDENT NETLIST - A method includes creating a technology file including data for an integrated circuit including at least one die coupled to an interposer and a routing between the at least one die and the interposer, b) creating a netlist including data approximating at least one of capacitive or inductive couplings between conductors in the at least one die and in the interposer based on the technology file, c) simulating a performance of the integrated circuit based on the netlist, d) adjusting the routing between the at least one die and the interposer based on the simulation to reduce the at least one of the capacitive or the inductive couplings, and e) repeating steps c) and d) to optimize the at least one of the capacitive or inductive couplings. | 01-10-2013 |
20130061186 | MULTI-PATTERNING METHOD - A method includes receiving data representing a layout of a DPT-layer of an integrated circuit generated by a place and route tool. The layout includes a plurality of polygons to be formed in the DPT-layer by a multi-patterning process. First and second ones of the plurality of polygons to be formed using first and second photomasks, respectively are identified. Any intervening polygons along a first path connecting the first polygon to the second polygon, and separator regions between adjacent polygons along the first path are identified. The separator regions have sizes less than a minimum threshold distance between polygons formed on the first photomask. The separator regions are counted. A multi-patterning conflict is identified, if the count of separator regions is even, prior to assigning all remaining ones of the plurality of polygons to the first or second masks. | 03-07-2013 |
20130074018 | MULTI-PATTERNING METHOD - A method comprises (a) receiving data representing a layout of a DPT-layer of an integrated circuit generated by a place and route tool, the layout including a plurality of polygons to be formed in the DPT-layer by a multi-patterning process; (b) receiving at least one identification of a subset of the plurality of polygons that are to be formed in the DPT-layer using the same photomask as each other; (c) constructing a graph of the subset of the plurality of polygons and any intervening polygons of the plurality of polygons, where the subset of the plurality of polygons are represented in the graph by a single node, the graph including connections connecting adjacent ones of the polygons in the graph that are positioned within a threshold distance of each other; and (d) identifying a multi-patterning conflict if any subset of the connections form an odd loop. | 03-21-2013 |
20130139121 | RC Extraction Methodology for Floating Silicon Substrate with TSV - The present disclosure relates to methods and apparatuses for generating a through-silicon via (TSV) model for RC extraction that accurately models an interposer substrate comprising one or more TSVs. In some embodiments, a method is performed by generating an interposer wafer model having a sub-circuit that models a TSV. The sub-circuit can compensate for limitations in resistive and capacitive extraction of traditional TSV models performed by EDA tools. In some embodiments, the sub-circuit is coupled to a floating common node of the model. The floating common node enables the interposer wafer model to take into consideration capacitive coupling within the interposer. The improved interposer wafer model enables accurate RC extraction of an interposer with one or more TSVs, thereby providing for an interposer wafer model that is consistent between GDS and APR flows. | 05-30-2013 |
20130174112 | METHOD OF GENERATING A BIAS-ADJUSTED LAYOUT DESIGN OF A CONDUCTIVE FEATURE AND METHOD OF GENERATING A SIMULATION MODEL OF A PREDEFINED FABRICATION PROCESS - A method of generating a bias-adjusted layout design of a conductive feature includes receiving a layout design of the conductive feature. If a geometry configuration of the layout design is within a first set of predetermined criteria, the bias-adjusted layout design of the conductive feature is generated according to a first layout bias rule. If the geometry configuration of the layout design is within a second set of predetermined criteria, the bias-adjusted layout design of the conductive feature is generated according to a second layout bias rule. | 07-04-2013 |
20130227501 | SEMICONDUCTOR DEVICE DESIGN METHOD, SYSTEM AND COMPUTER-READABLE MEDIUM - In a semiconductor device design method performed by at least one processor, first and second electrical components are extracted from a layout of a semiconductor device. The semiconductor device has a semiconductor substrate and the first and second electrical components in the semiconductor substrate. Parasitic parameters of a coupling in the semiconductor substrate between the first and second electrical components are extracted using a first tool. Intrinsic parameters of the first and second electrical components are extracted using a second tool different from the first tool. The extracted parasitic parameters and intrinsic parameters are combined into a model of the semiconductor device. The parasitic parameters of the coupling are extracted based on a model of the coupling included in the second tool. | 08-29-2013 |
20130227514 | Method of Generating RC Technology File - A method of generating resistance-capacitance (RC) technology files is disclosed. The method comprises receiving a plurality of metal schemes from an IC foundry and dividing the plurality of metal schemes into one or more modular RC groups. The method further comprises identifying a modular RC structure; calculating capacitance values of the modular RC structure by means of a field solver; calculating an equivalent dielectric constant and an equivalent height of the RC structure based upon a variety of interconnect layers not having interconnects; calculating an equivalent dielectric constant and an equivalent height for each of the plurality of metal schemes; and deriving capacitance values of each of the plurality of metal schemes from the capacitance values of the modular RC structure. | 08-29-2013 |
20130239070 | RC EXTRACTION FOR SINGLE PATTERNING SPACER TECHNIQUE - A method includes performing a place and route operation using an electronic design automation tool to generate a preliminary layout for a photomask to be used to form a circuit pattern of a semiconductor device. The place and route operation is constrained by a plurality of single patterning spacer technique (SPST) routing rules. Dummy conductive fill patterns are emulated within the EDA tool using an RC extraction tool to predict locations and sizes of dummy conductive fill patterns to be added to the preliminary layout of the photomask. An RC timing analysis of the circuit pattern is performed within the EDA tool, based on the preliminary layout and the emulated dummy conductive fill patterns. | 09-12-2013 |
20130254726 | MULTI-PATTERNING METHOD - A method includes receiving data representing a layout of a DPT-layer of an integrated circuit generated by a place and route tool. The layout includes a plurality of polygons to be formed in the DPT-layer by a multi-patterning process. First and second ones of the plurality of polygons to be formed using first and second photomasks, respectively are identified. Any intervening polygons along a first path connecting the first polygon to the second polygon, and separator regions between adjacent polygons along the first path are identified. The separator regions have sizes less than a minimum threshold distance between polygons formed on the first photomask. The separator regions are counted. A multi-patterning conflict is identified, if the count of separator regions is even, prior to assigning all remaining ones of the plurality of polygons to the first or second masks. | 09-26-2013 |
20130275927 | RC Corner Solutions for Double Patterning Technology - A method includes determining model parameters for forming an integrated circuit, and generating a techfile using the model parameters. The techfile includes at least two of a C_worst table, a C_best table, and a C_nominal table. The C_worst table stores greatest parasitic capacitances between layout patterns of the integrated circuit when lithography masks comprising the layout patterns shift relative to each other. The C_best table stores smallest parasitic capacitances between the layout patterns when the lithography masks shift relative to each other. The C_nominal table stores nominal parasitic capacitances between the layout patterns when the lithography masks do not shift relative to each other. The techfile is embodied on a tangible non-transitory storage medium. | 10-17-2013 |
20140082578 | RC EXTRACTION METHODOLOGY FOR FLOATING SILICON SUBSTRATE WITH TSV - The present disclosure relates to methods and apparatuses for generating a through-silicon via (TSV) model for RC extraction that accurately models an interposer substrate comprising one or more TSVs. In some embodiments, a method is performed by generating an interposer wafer model having a sub-circuit that models a TSV. The sub-circuit can compensate for limitations in resistive and capacitive extraction of traditional TSV models performed by EDA tools. In some embodiments, the sub-circuit is coupled to a floating common node of the model. The floating common node enables the interposer wafer model to take into consideration capacitive coupling within the interposer. The improved interposer wafer model enables accurate RC extraction of an interposer with one or more TSVs, thereby providing for an interposer wafer model that is consistent between GDS and APR flows. | 03-20-2014 |
20140245251 | Design Optimization for Circuit Migration - An embodiment of the present invention is a computer program product for providing an adjusted electronic representation of an integrated circuit layout. The computer program product has a medium with a computer program embodied thereon. Further, the computer program comprises computer program code for providing full node cells from a full node netlist, computer program code for scaling the full node cells to provide shrink node cells, computer program code for providing a timing performance of the full node cells and the shrink node cells, computer program code for comparing the timing performance of the full node cells to the timing performance of the shrink node cells, and computer program code for providing a first netlist. | 08-28-2014 |
20140258962 | Parasitic Capacitance Extraction for FinFETs - A method includes generating a three-dimensional table. The table cells of the three-dimensional table comprise normalized parasitic capacitance values selected from the group consisting essentially of normalized poly-to-fin parasitic capacitance values and normalized poly-to-metal-contact parasitic capacitance values of Fin Field-Effect Transistors (FinFETs). The three-dimensional table is indexed by poly-to-metal-contact spacings of the FinFETs, fin-to-fin spacings of the FinFETs, and metal-contact-to-second-poly spacings of the FinFETs. The step of generating the three-dimensional table is performed using a computer. | 09-11-2014 |
20140304670 | RC Corner Solutions for Double Patterning Technology - A method includes selecting a process corner, determining model parameters for forming an integrated circuit, and generating a file using the model parameters for the process corner. The generating the file is performed using a computer. The file includes at least two of a first capacitance table, a second capacitance table, and a third capacitance table. The first capacitance table stores greatest parasitic capacitances between layout patterns of the integrated circuit when lithography masks including the layout patterns shift relative to each other. The second capacitance table stores smallest parasitic capacitances between the layout patterns when the lithography masks shift relative to each other. The third capacitance table stores nominal parasitic capacitances between the layout patterns when the lithography masks do not shift relative to each other. | 10-09-2014 |
20140310675 | Methods and Apparatus for RC Extraction - The method for extracting a capacitance from a layout is disclosed. The method decomposes a first net into a first and a second component, and decomposes a second net into a third and a fourth component. The method may obtain a first capacitance for the first component and the third component by a first method, and obtain a second capacitance for the second component and the fourth component by a second method different from the first method. A library with a plurality of entries may be provided, wherein each entry has a component pair comprising a component of the first net and a component of the second net, and a pre-calculated capacitance for the component pair. The first method may be to search a library to find a pre-calculated capacitance. The second method may be to obtain the first capacitance by an equation solver on the fly. | 10-16-2014 |
20150052493 | METHOD OF GENERATING A SIMULATION MODEL OF A PREDEFINED FABRICATION PROCESS - A method of generating a simulation model of a predefined fabrication process according to a sample conductive feature includes receiving a geometry configuration and layout design of the conductive feature. A circuit-level simulation model of the sample conductive feature based on the geometry configuration of the sample conductive feature is generated. A hardware processor converts the circuit-level simulation model of the sample conductive feature into at least a first layout bias rule corresponding to a first set of predetermined criteria of the layout design and a second layout bias rule, different from the first layout bias rule, corresponding to a second set of predetermined criteria of the layout design. | 02-19-2015 |
Hsuan-Ching Chao, Keelung City TW
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20110293055 | CIRCUIT FOR GENERATING A CLOCK DATA RECOVERY PHASE LOCKED INDICATOR AND METHOD THEREOF - A circuit includes an oversampling logic unit, an alternating current estimator, and a logic processor. The oversampling logic unit generates a plurality of alternating current terms according to an oversampling clock, and outputs a plurality of alternating current terms corresponding to an output clock from the plurality of alternating current terms according to the output clock. The alternating current estimator executes a discrete cosine transform and a discrete sine transform on a plurality of alternating current terms outputted from the oversampling logic unit within a first predetermined time to generate a first value and a second value respectively. The logic processor compares a number of first values and a number of second values within a second predetermined time, and generates a clock data recovery phase locked indicator according to a comparing result. | 12-01-2011 |
20110296105 | SYSTEM AND METHOD FOR REALIZING RAID-1 ON A PORTABLE STORAGE MEDIUM - A system of realizing RAID-1 on a portable storage medium includes a Universal Serial Bus device and the portable storage medium. The portable storage medium is divided into a main partition and at least one backup partition according to a RAID-1 mode. The Universal Serial Bus device is coupled to the portable storage medium for receiving a write command and/or a read command transmitted by a host, and writing data to the portable storage medium and/or reading data from the portable storage medium according to the write command and/or the read command. The Universal Serial Bus device does not transmit capacity information of the at least one backup partition to the host. | 12-01-2011 |
20120079161 | CIRCUIT FOR SIMULTANEOUSLY ANALYZING PERFORMANCE AND BUGS AND METHOD THEREOF - A circuit for simultaneously analyzing performance and bugs includes a mapping unit and a USB 3.0 data flow analyzer. The mapping unit is used for mapping commands transmitted to a USB 3.0 host through a peripheral component interconnect express and internal events of the USB 3.0 host to a packet of a USB 3.0 bus. The USB 3.0 data flow analyzer is used for analyzing performance and bugs of the USB 3.0 host through the packet of the USB 3.0 bus. | 03-29-2012 |
Hui-Ling Chao, Taichung City TW
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20120013101 | Modulized bicycle frame - A modulized bicycle frame includes at least two frame body members each sidelong symmetric to each other and having a head connecting portion, a seat connecting portion and a bottom-bracket connecting portion, and a plurality of fastening members for combining the frame body members to form the bicycle frame. The frame body members are easy to assemble and disassemble so as to facilitate replacement and modification of the modulized bicycle frame. Besides, the frame body members are suitable for mass manufacture, thereby saving manufacturing costs. | 01-19-2012 |
Hui-Yun Chao, Zhubei City TW
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20110320026 | SYSTEM AND METHOD FOR DATA MINING AND FEATURE TRACKING FOR FAB-WIDE PREDICTION AND CONTROL - System and method for data mining and feature tracking for fab-wide prediction and control are described. One embodiment is a system comprising a database for storing raw wafer manufacturing data; a data mining module for processing the raw wafer manufacturing data to select the best data therefrom in accordance with at least one of a plurality of knowledge-, statistic-, and effect-based processes; and a feature tracking module associated with the data mining module and comprising a self-learning model wherein a sensitivity of the self-learning model is dynamically tuned to meet real-time production circumstances, the feature tracking module receiving the selected data from the data mining module and generating prediction and control data therefrom; wherein the prediction and control data are used to control future processes in the wafer fabrication facility. | 12-29-2011 |
20130288403 | SYSTEMS AND METHODS OF AUTOMATICALLY DETECTING FAILURE PATTERNS FOR SEMICONDUCTOR WAFER FABRICATION PROCESSES - A system and method of automatically detecting failure patterns for a semiconductor wafer process is provided. The method includes receiving a test data set collected from testing a plurality of semiconductor wafers, forming a respective wafer map for each of the wafers, determining whether each respective wafer map comprises one or more respective objects, selecting the wafer maps that are determined to comprise one or more respective objects, selecting one or more object indices for selecting a respective object in each respective selected wafer map, determining a plurality of object index values in each respective selected wafer map, selecting an object in each respective selected wafer map, determining a respective feature in each of the respective selected wafer, classifying a respective pattern for each of the respective selected wafer maps and using the respective wafer fingerprints to adjust one or more parameters of the semiconductor fabrication process. | 10-31-2013 |
20130335109 | METHOD OF TEST PROBE ALIGNMENT CONTROL - A system and method for aligning a probe, such as a wafer-level test probe, with wafer contacts is disclosed. An exemplary method includes receiving a wafer containing a plurality of alignment contacts and a probe card containing a plurality of probe points at a wafer test system. A historical offset correction is received. Based on the historical offset correct, an orientation value for the probe card relative to the wafer is determined. The probe card is aligned to the wafer using the orientation value in an attempt to bring a first probe point into contact with a first alignment contact. The connectivity of the first probe point and the first alignment contact is evaluated. An electrical test of the wafer is performed utilizing the aligned probe card, and the historical offset correction is updated based on the orientation value. | 12-19-2013 |
20140100684 | 2D/3D Analysis for Abnormal Tools and Stages Diagnosis - A method for analyzing abnormalities in a semiconductor processing system provides performing an analysis of variance on a production history associated with each of a plurality of tools at each of a plurality of process steps for each of a plurality of processed wafers, and key process steps are identified. A regression analysis on a plurality of measurements of the plurality of wafers at each process step is performed and key measurement parameters are identified. An analysis of covariance on the key measurement parameters and key process steps, and the key process steps are ranked based on an f-ratio, therein ranking an abnormality of the key process steps. Further, the plurality of tools associated with each of the key process steps are ranked based on an orthogonal t-ratio associated with an analysis of covariance, therein ranking an abnormality each tool associated with the key process steps. | 04-10-2014 |
20140106474 | SYSTEMS AND METHODS OF AUTOMATICALLY DETECTING FAILURE PATTERNS FOR SEMICONDUCTOR WAFER FABRICATION PROCESSES - A system and method of automatically detecting failure patterns for a semiconductor wafer process is provided. The method includes receiving a test data set collected from testing a plurality of semiconductor wafers, forming a respective wafer map for each of the wafers, determining whether each respective wafer map comprises one or more respective objects, selecting the wafer maps that are determined to comprise one or more respective objects, selecting one or more object indices for selecting a respective object in each respective selected wafer map, determining a plurality of object index values in each respective selected wafer map, selecting an object in each respective selected wafer map, determining a respective feature in each of the respective selected wafer, classifying a respective pattern for each of the respective selected wafer maps and using the respective wafer fingerprints to adjust one or more parameters of the semiconductor fabrication process. | 04-17-2014 |
Hui-Yun Chao, Zhubei TW
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20110307088 | Auto Device Skew Manufacturing - A system and method for manufacturing semiconductor devices is disclosed. An embodiment comprises using desired device parameters to choose an initial manufacturing recipe. Once chosen, the initial manufacturing recipe may be modified by determining and applying an offset adjustment based on previous manufacturing to tune the recipes for the particular equipment to be utilized in the manufacturing process. | 12-15-2011 |
20130131858 | Auto Device Skew Manufacturing - A system and method for manufacturing semiconductor devices is disclosed. An embodiment comprises using desired device parameters to choose an initial manufacturing recipe. Once chosen, the initial manufacturing recipe may be modified by determining and applying an offset adjustment based on previous manufacturing to tune the recipes for the particular equipment to be utilized in the manufacturing process. | 05-23-2013 |
Hung-Jen Chao, Zhubei City TW
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20110135103 | System and Method for Audio Adjustment - A system and a method for audio adjustment are provided. The method includes following steps. A first output audio signal generated from the under-test audio playback device according to a frequency response test signal is received. The first output audio signal is analyzed to generate a set of suggested equalization parameter. A set of equalization parameters are adjusted according to the suggested equalization parameters, and a sound test signal is generated from an original sound signal according to the equalization parameters and output to the under-test audio playback device. A second output audio signal is generated from the under-test audio playback device in response to the sound test signal. Whether the auditory effect of the second output audio signal is close to the original sound signal or matches the user's need is determined. The equalization parameters are adjusted when the auditory effect of the second output audio signal is not close to the original sound signal or the user is not satisfied with the auditory effect. | 06-09-2011 |
I-Li Chao, Taichung TW
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20090001687 | Securing device for bicycle accessories - A securing device for bicycle accessories includes a C-shaped collar which is mounted to a bicycle frame and includes an opening via which the bicycle frame is mounted by the collar. An extension extending from one of two ends of the opening and a plurality of positioning grooves are defined in an underside of the extension. A support member is fixed on the collar so as to connect a bicycle lamp thereon. A lever is pivotably connected to the support member by a pin and includes an eccentric portion which is removably in contact with the support member. A locking member is pivotably connected to the lever at an eccentric position relative to the pin. The locking member is engaged with one of the positioning grooves so as to adjust a size of an inner diameter of the collar. | 01-01-2009 |
I-Shuo Chao, Dadu Township TW
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20080219760 | Fixing base for bike auxiliary handle bar - A fixing base for bike auxiliary handle bar includes and upper portion having its upper end incorporated to a protection pad holder and a lower portion having its lower end incorporated to an auxiliary handle bar; an arc groove being each disposed on the lower end of the upper portion and on the upper end of the lower portion for both upper and lower portions to be inserted to each other; both fronts of the upper and the lower portions being movably pivoted to each other; a locating seat provided with a central locating hole being disposed to a terminal of the upper portion; a retainer being inserted into the locating hole; a locating block with its top disposed with an arc groove being inserted into the retainer, an open trough being disposed to a terminal of the locating seat; an insertion seat being disposed to a terminal of the lower portion; an open trough being disposed to a terminal of the insertion seat, a through hole connecting to the open trough being axially provided in the insertion seat to receive a pivoting pin provided with a central through hole to pivot an adjusting bolt to a biased hole disposed on the inner side of the pad holder; the adjusting bolt passing through the locating block, the retainer, the pivoting pin, and engaging an adjusting nut for the adjusting bolt to execute tightening up or loosing up through the biased hole by turning the pad holder so to achieve summary operation to mount or separate the fixing base and the pad holder onto or from the handle bar. | 09-11-2008 |
Jaw-Chien Chao, Miao-Li County TW
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20110176331 | DISPLAY APPARATUS AND ASSEMBLING METHOD THEREOF - A display including a back cover, a front frame, a display panel, a light guide plate, at least one metal bracket and a light emitting element is provided. The front frame is secured to the back cover to form an accommodating space. The display panel and the light guide plate are disposed in the accommodating space. The light guide plate, which has at least one light incident surface and a light exit surface, is configured between the back cover and the display panel. The light exit surface faces toward the display panel. The metal bracket is disposed at side of the accommodating space. The metal bracket has a first part and a second part connected together. The first part is secured to at least the back cover or the front frame. The light emitting element is between the second part and the light incident surface. | 07-21-2011 |
Je-Shih Chao, Hsin Chu City TW
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20100288014 | Gas sensor and method thereof - A gas sensor comprises a first surface-acoustic-wave device, at least one further surface-acoustic-wave device, and a control device. The first surface-acoustic-wave device includes a piezoelectric substrate, a pair of transducers and an external circuit. The pair of transducers consists of a first transducer and a second transducer, and they are formed on two sides of the piezoelectric substrate. The first transducer is utilized to generate a surface acoustic wave on the piezoelectric substrate. The external circuit electrically connects to the pair of transducers. At least one further surface-acoustic-wave device includes at least one first surface-acoustic-device and a sensing porous thin film of which two sides are formed on the pair of the transducers. The control device is utilized to control only one external circuit to become activated at one time. | 11-18-2010 |
Lan-Lin Chao, Sindian City TW
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20110233621 | Wafer Level Packaging Bond - The present disclosure provides a method of bonding a plurality of substrates. In an embodiment, a first substrate includes a first bonding layer. The second substrate includes a second bonding layer. The first bonding layer includes silicon; the second bonding layer includes aluminum. The first substrate and the second substrate are bonded forming a bond region having an interface between the first bonding layer and the second bonding layer. A device having a bonding region between substrates is also provided. The bonding region includes an interface between a layer including silicon and a layer including aluminum. | 09-29-2011 |
20120025389 | Hermetic Wafer Level Packaging - Provided is a wafer level packaging. The packaging includes a first semiconductor wafer having a transistor device and a first bonding layer that includes a first material. The packaging includes a second semiconductor wafer having a second bonding layer that includes a second material different from the first material, one of the first and second materials being aluminum-based, and the other thereof being titanium-based. Wherein a portion of the second wafer is diffusively bonded to the first wafer through the first and second bonding layers. | 02-02-2012 |
20120080761 | SEMICONDUCTOR HAVING A HIGH ASPECT RATIO VIA - A semiconductor device includes a substrate wafer, a dielectric layer overlying the substrate wafer, a patterned conductor layer in the dielectric layer, and a first barrier layer overlying the conductor layer. A silicon top wafer is bonded to the dielectric layer. A via is formed through the top wafer and a portion of the dielectric layer to the first barrier layer. A sidewall dielectric layer is formed along inner walls of the via, adjacent the top wafer to a distance below an upper surface of the top wafer, forming a sidewall dielectric layer shoulder. A sidewall barrier layer is formed inward of the sidewall dielectric layer, lining the via from the first barrier layer to the upper surface of the top wafer. A conductive layer fills the via and a top barrier layer is formed on the conductive layer, the sidewall barrier layer, and the top wafer. | 04-05-2012 |
20120091598 | HANDLING LAYER FOR TRANSPARENT SUBSTRATE - A device is provided which includes a transparent substrate. An opaque layer is disposed on the transparent substrate. A conductive layer disposed on the opaque layer. The opaque layer and the conductive layer form a handling layer, which may be used to detect and/or align the transparent wafer during fabrication processes. In an embodiment, the conductive layer includes a highly-doped silicon layer. In an embodiment, the opaque layer includes a metal. In embodiment, the device may include a MEMs device. | 04-19-2012 |
20120148870 | SELF-REMOVAL ANTI-STICTION COATING FOR BONDING PROCESS - A bond free of an anti-stiction layer and bonding method is disclosed. An exemplary method includes forming a first bonding layer; forming an interlayer over the first bonding layer; forming an anti-stiction layer over the interlayer; and forming a liquid from the first bonding layer and interlayer, such that the anti-stiction layer floats over the first bonding layer. A second bonding layer can be bonded to the first bonding layer while the anti-stiction layer floats over the first bonding layer, such that a bond between the first and second bonding layers is free of the anti-stiction layer. | 06-14-2012 |
20120235300 | SEMICONDUCTOR HAVING A HIGH ASPECT RATIO VIA - The present disclosure provides various embodiments of a via structure and method of manufacturing same. In an example, a via structure includes a via having via sidewall surfaces defined by a semiconductor substrate. The via sidewall surfaces have a first portion and a second portion. A conductive layer is disposed in the via on the first portion of the via sidewall surfaces, and a dielectric layer is disposed on the second portion of the via sidewall surfaces. The dielectric layer is disposed between the second portion of the via sidewall surfaces and the conductive layer. In an example, the dielectric layer is an oxide layer. | 09-20-2012 |
20120238091 | SEMICONDUCTOR HAVING A HIGH ASPECT RATIO VIA - The present disclosure provides various embodiments of a via structure and method of manufacturing same. In an example, a method for forming a via structure includes forming a via in a semiconductor substrate, wherein via sidewalls of the via are defined by the semiconductor substrate; forming a dielectric layer on the via sidewalls; removing the dielectric layer from a portion of the via sidewalls; and forming a conductive layer to fill the via, wherein the conductive layer is disposed over the dielectric layer and the portion of the via sidewalls. In an example, the dielectric layer is an oxide layer. | 09-20-2012 |
20120244677 | METHOD AND APPARATUS FOR SELECTIVELY REMOVING ANTI-STICTION COATING - The present disclosure provides various methods for removing an anti-stiction layer. An exemplary method includes forming an anti-stiction layer over a substrate, including over a first substrate region of a first material and a second substrate region of a second material, wherein the second material is different than the first material; and selectively removing the anti-stiction layer from the second substrate region of the second material without using a mask. | 09-27-2012 |
20130082338 | MEMS Structures and Methods for Forming the Same - A device includes a micro-electro-mechanical system (MEMS) device, which includes a movable element and a fixed element. The movable element and the fixed element form two capacitor plates of a capacitor, with an air-gap between the movable element and the fixed element acting as a capacitor insulator of the capacitor. At least one of the movable element and the fixed element has a rugged surface. | 04-04-2013 |
20130099355 | MEMS Structures and Methods for Forming the Same - A method includes forming a MEMS device, forming a bond layer adjacent the MEMS device, and forming a protection layer over the bond layer. The steps of forming the bond layer and the protection layer include in-situ deposition of the bond layer and the protection layer | 04-25-2013 |
20130203199 | Methods of Bonding Caps for MEMS Devices - A method includes bonding a first bond layer to a second bond layer through eutectic bonding. The step of bonding includes heating the first bond layer and the second bond layer to a temperature higher than a eutectic temperature of the first bond layer and the second bond layer, and performing a pumping cycle. The pumping cycle includes applying a first force to press the first bond layer and the second bond layer against each other. After the step of applying the first force, a second force lower than the first force is applied to press the first bond layer and the second bond layer against each other. After the step of applying the second force, a third force higher than the second force is applied to press the first bond layer and the second bond layer against each other. | 08-08-2013 |
20130208371 | BIOLOGICAL SENSING STRUCTURES AND METHODS OF FORMING THE SAME - A method of forming of biological sensing structures including a portion of a substrate is recessed to form a plurality of mesas in the substrate. Each of the plurality of mesas has a top surface and a sidewall surface. A first light reflecting layer is deposited over the top surface and the sidewall surface of each mesa. A filling material is formed over a first portion of the first light reflecting layer. A stop layer is deposited over the filling material and a second portion of the first light reflecting layer. A sacrificial layer is formed over the stop layer and is planarized exposing the stop layer. A first opening is formed in the stop layer and the first light reflecting layer. A second light reflecting layer is deposited over the first opening. A second opening is formed in the second light reflecting layer. | 08-15-2013 |
20130284885 | Method and Apparatus for Image Sensor Packaging - Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a sensor device with an application specific integrated circuit (ASIC) are disclosed. According to an embodiment, a sensor device may be bonded together face-to-face with an ASIC without using a carrier wafer, where corresponding bond pads of the sensor are aligned with bond pads of the ASIC and bonded together, in a one-to-one fashion. A column of pixels of the sensor may share a bond bad connected by a shared inter-metal line. The bond pads may be of different sizes and configured in different rows to be disjoint from each other. Additional dummy pads may be added to increase the bonding between the sensor and the ASIC. | 10-31-2013 |
20130285180 | Apparatus for Vertically Integrated Backside Illuminated Image Sensors - A backside illuminated image sensor comprises a photodiode and a first transistor located in a first chip, wherein the first transistor is electrically coupled to the photodiode. The backside illuminated image sensor further comprises a second transistor formed in a second chip and a plurality of logic circuits formed in a third chip, wherein the second chip is stacked on the first chip and the third chip is stacked on the second chip. The logic circuit, the second transistor and the first transistor are coupled to each other through a plurality of boding pads and through vias. | 10-31-2013 |
20130320556 | Three Dimensional Integrated Circuit Structures and Hybrid Bonding Methods for Semiconductor Wafers - Three dimensional integrated circuit (3DIC) structures and hybrid bonding methods for semiconductor wafers are disclosed. A 3DIC structure includes a first semiconductor device having first conductive pads disposed within a first insulating material on a top surface thereof, the first conductive pads having a first recess on a top surface thereof. The 3DIC structure includes a second semiconductor device having second conductive pads disposed within a second insulating material on a top surface thereof coupled to the first semiconductor device, the second conductive pads having a second recess on a top surface thereof. A sealing layer is disposed between the first conductive pads and the second conductive pads in the first recess and the second recess. The sealing layer bonds the first conductive pads to the second conductive pads. The first insulating material is bonded to the second insulating material. | 12-05-2013 |
20130334638 | Apparatus and Method for Backside Illuminated Image Sensors - A backside illuminated image sensor comprises a photodiode and a first transistor located in a first substrate, wherein the first transistor is electrically coupled to the photodiode. The backside illuminated image sensor further comprises a plurality of logic circuits formed in a second substrate, wherein the second substrate is stacked on the first substrate and the logic circuit are coupled to the first transistor through a plurality of bonding pads. | 12-19-2013 |
20140011324 | Hybrid Bonding Systems and Methods for Semiconductor Wafers - Hybrid bonding systems and methods for semiconductor wafers are disclosed. In one embodiment, a hybrid bonding system for semiconductor wafers includes a chamber and a plurality of sub-chambers disposed within the chamber. A robotics handler is disposed within the chamber that is adapted to move a plurality of semiconductor wafers within the chamber between the plurality of sub-chambers. The plurality of sub-chambers includes a first sub-chamber adapted to remove a protection layer from the plurality of semiconductor wafers, and a second sub-chamber adapted to activate top surfaces of the plurality of semiconductor wafers prior to hybrid bonding the plurality of semiconductor wafers together. The plurality of sub-chambers also includes a third sub-chamber adapted to align the plurality of semiconductor wafers and hybrid bond the plurality of semiconductor wafers together. | 01-09-2014 |
20140020818 | Systems and Methods of Separating Bonded Wafers - Systems and methods of separating bonded wafers are disclosed. In one embodiment, a system for separating bonded wafers includes a support for the bonded wafers and means for applying a sheer force to the bonded wafers. The system also includes means for applying a vacuum to the bonded wafers. | 01-23-2014 |
20140051336 | GRINDING WHEEL FOR WAFER EDGE TRIMMING - A grinding wheel for wafer edge trimming includes a head having an open side and an abrasive end bonded around an edge of the open side of the head. The abrasive end is arranged to have multiple simultaneous contacts around a wafer edge during the wafer edge trimming. | 02-20-2014 |
20140054779 | Semiconductor Having a High Aspect Ratio Via - The present disclosure provides various embodiments of a via structure and method of manufacturing same. In an example, a via structure includes a via having via sidewall surfaces defined by a semiconductor substrate. The via sidewall surfaces have a first portion and a second portion. A conductive layer is disposed in the via on the first portion of the via sidewall surfaces, and a dielectric layer is disposed on the second portion of the via sidewall surfaces. The dielectric layer is disposed between the second portion of the via sidewall surfaces and the conductive layer. In an example, the dielectric layer is an oxide layer. | 02-27-2014 |
20140091438 | MULTIPLE METAL LAYER SEMICONDUCTOR DEVICE AND LOW TEMPERATURE STACKING METHOD OF FABRICATING THE SAME - A semiconductor device including a conductive element and an interface surface fabricated atop the conductive element, and a method for fabricating such a device are described. An exemplary device includes a substrate having a conductive element and a metal layer fabricated atop the conductive element. An oxide layer is fabricated atop the metal layer, thus forming an interface surface. During polishing (e.g., planarization), in which an upper portion of the interface surface is removed, the presence of the interface surface greatly reduces the loading on the conductive element. A second substrate fabricated using the same process may be stacked atop the first substrate and bonded using a hybrid bonding process. | 04-03-2014 |
20140113398 | Apparatus for Vertically Integrated Backside Illuminated Image Sensors - A backside illuminated image sensor comprises a photodiode and a first transistor located in a first chip, wherein the first transistor is electrically coupled to the photodiode. The backside illuminated image sensor further comprises a second transistor formed in a second chip and a plurality of logic circuits formed in a third chip, wherein the second chip is stacked on the first chip and the third chip is stacked on the second chip. The logic circuit, the second transistor and the first transistor are coupled to each other through a plurality of boding pads and through vias. | 04-24-2014 |
20140117546 | HYBRID BONDING MECHANISMS FOR SEMICONDUCTOR WAFERS - The embodiments of diffusion barrier layer described above provide mechanisms for forming a copper diffusion barrier layer to prevent device degradation for hybrid bonding of wafers. The diffusion barrier layer(s) encircles the copper-containing conductive pads used for hybrid bonding. The diffusion barrier layer can be on one of the two bonding wafers or on both bonding wafers. | 05-01-2014 |
20140154841 | Hermetic Wafer Level Packaging - Provided is a wafer level packaging. The packaging includes a first semiconductor wafer having a transistor device and a first bonding layer that includes a first material. The packaging includes a second semiconductor wafer having a second bonding layer that includes a second material different from the first material, one of the first and second materials being aluminum-based, and the other thereof being titanium-based. Wherein a portion of the second wafer is diffusively bonded to the first wafer through the first and second bonding layers. | 06-05-2014 |
20140191341 | Method and Apparatus for a Semiconductor Structure - A semiconductor structure may include a first device having first surface with a first bonding layer formed thereon and a second device having a first surface with a second bonding layer formed thereon. The first bonding layer may provide an electrically conductive path to at least one electrical device in the first device. The second bonding layer may provide an electrically conductive path to at least one electrical device in the second device. One of the first or the second devices may include MEMS electrical devices. The first and/or the second bonding layers may be formed of a getter material, which may provide absorption for outgassing. | 07-10-2014 |
20140256087 | Hybrid Bonding and Apparatus for Performing the Same - A method includes performing a hybrid bonding to bond a first package component to a second package component, so that a bonded pair is formed. In the bonded pair, first metal pads in the first package component are bonded to second metal pads in the second package component, and a first surface dielectric layer at a surface of the first package component is bonded to a second surface dielectric layer at a surface of the second package component. After the hybrid bonding, a thermal compressive annealing is performed on the bonded pair. | 09-11-2014 |
20140263586 | Integrate Rinse Module in Hybrid Bonding Platform - A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component. | 09-18-2014 |
20140264948 | Air Trench in Packages Incorporating Hybrid Bonding - A package component includes a surface dielectric layer including a planar top surface, a metal pad in the surface dielectric layer and including a second planar top surface level with the planar top surface, and an air trench on a side of the metal pad. The sidewall of the metal pad is exposed to the air trench. | 09-18-2014 |
20150044759 | BIOLOGICAL SENSING STRUCTURES - A biological sensing structure includes a mesa integrally connected a portion of a substrate, wherein the mesa has a top surface and a sidewall surface adjacent to the top surface. The biological sensing structure includes a first light reflecting layer over the top surface and the sidewall surface of the mesa. The biological sensing structure includes a filling material surrounding the mesa, wherein the mesa protrudes from the filling material. The biological sensing structure includes a stop layer over the filling material and a portion of the first light reflecting layer. The biological sensing structure includes a second light reflecting layer over a portion of the stop layer and a portion of the top surface of the mesa. The biological sensing structure includes an opening in the second light reflecting layer to partially expose the top surface of the mesa. | 02-12-2015 |
20150044786 | Alignment Systems and Wafer Bonding Systems and Methods - Alignment systems, and wafer bonding alignment systems and methods are disclosed. In some embodiments, an alignment system for a wafer bonding system includes means for monitoring an alignment of a first wafer and a second wafer, and means for adjusting a position of the second wafer. The alignment system includes means for feeding back a relative position of the first wafer and the second wafer to the means for adjusting the position of the second wafer before and during a bonding process for the first wafer and the second wafer. | 02-12-2015 |
20150064810 | Low Contamination Chamber for Surface Activation - An embodiment low contamination chamber includes a gas inlet, an adjustable top electrode, an adjustable bottom electrode, and an outlet. The chamber is configured to adjust a distance between the adjustable top and bottom electrodes in accordance with a desired density of plasma disposed between the top electrode and the bottom electrode. | 03-05-2015 |
Ling-Chu Chao, Banciao City TW
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20110254654 | Battery Car Anti-Theft Device - A battery car anti-theft device, which is mainly characterized in utilizing an electronic control circuit to control the external power supply state of a battery, and when set in the anti-theft state, if it is detected that the supply current is greater than a preset value, then the entire external power supply of the battery is immediately cut off, thus, there is no power supply to start the engine to enable the car thief to drive the vehicle away, thereby achieving the objective of preventing the vehicle from being stolen. | 10-20-2011 |
Ling Yu Chao, Taichung City TW
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20100211228 | METHOD AND SYSTEM FOR CONTROLLING COMPRESSOR - In the present invention, a method and a system for controlling a compressor are provided. The method includes the steps of: providing a condenser connected to the compressor, and at least one evaporator connected to the condenser; measuring an inlet pressure and an outlet pressure of the compressor to obtain a flow rate of the condensate; determining a secure flow rate and a demanding flow rate based on a total number of the at least one evaporator; comparing at least two of the flow rate, the demanding flow rate and the secure flow rate with each other to obtain a compared result; and controlling the compressor based on the comparing result. | 08-19-2010 |
20100229587 | AIR CONDITIONING SYSTEM - An air conditioning system includes a first circulation module and a second circulation module. Two circulation modules are joined by a heat exchanger. The first circulation is a modular refrigeration system includes a compressor, expansion device, and heat exchangers. The second circulation module includes a main liquid refrigerant tank, a number of distributed liquid refrigerant tanks, liquid pumps and a plurality of indoor units which includes a heat exchange device and a vapor propelling device. The heat exchange device is connected to the main liquid tank. The vapor propelling device propels the working fluid in a saturated vapor state to the first heat exchanger, thus forming a working fluid loop. It can be switched between the heating and cooling modes. | 09-16-2010 |
20130118193 | HEAT PUMP AIR-CONDITIONING SYSTEM AND METHOD FOR CONTROLLING THE SAME - A heat pump air-conditioning system includes a four-way valve provided with a first opening, a second opening, a third opening and a fourth opening communicated with each other. The first opening, a compressor, a first heat exchanger, a first expansion device and the second opening are sequentially connected in series. The third opening, a second heat exchanger, a second expansion device, a third heat exchanger and the fourth opening are sequentially connected in series. A first bypass valve is connected in parallel with the first expansion device and is connected between the first heat exchanger and the second opening. A second bypass valve is connected in parallel with the second expansion device and the third heat exchanger and is connected between the third heat exchanger and the fourth opening. A liquid supply system is connected to the first heat exchanger. | 05-16-2013 |
Lin-Mei Chao, Sijhih City TW
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20110254654 | Battery Car Anti-Theft Device - A battery car anti-theft device, which is mainly characterized in utilizing an electronic control circuit to control the external power supply state of a battery, and when set in the anti-theft state, if it is detected that the supply current is greater than a preset value, then the entire external power supply of the battery is immediately cut off, thus, there is no power supply to start the engine to enable the car thief to drive the vehicle away, thereby achieving the objective of preventing the vehicle from being stolen. | 10-20-2011 |
Mao-Ching Chao, Tainan County TW
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20120008465 | Multiple display clock - A multiple display clock includes date and month timing units mounted on a clock body, and each including a needle, and a stepper motor to drive the needle. A controller is coupled to a digital display and the stepper motors of the date and month timing units, and includes a processor controlling a digital time counter to count a calendar time. The processor controls the digital display to display digital time information, and activates the stepper motors of the date and month timing units to drive the date and month needles for display of analog calendar time information. A main timing unit is disposed on the clock body and has a stepper motor that is used to drive minute and hour needles, and that is disconnected from the controller. | 01-12-2012 |
Mei-Hua Chao, Taichung TW
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20100122391 | CLOTHING CAPABLE OF GENERATING SIGNAL IN WET ENVIRONMENTS - An article of clothing includes a garment, a container installed in the garment for infiltration of liquids and filled with an electrolyte solution made of organic materials and having two electrodes electrically connected with the electrolyte solution, and an electric device electrically connected with the electrodes. When the garment is exposed to a wet environment, the water liquids can permeate through the container to mix with the electrolyte solution such that an electric current can be created to drive the electronic device to generate alerting or attracting signals automatically. The garment can take the forms of life vest, T-shirt, jean, coat, etc. | 05-20-2010 |
Pei-Kuang Chao, Gueishan Township TW
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20100076331 | Device and Method for Measuring Three-Lead ECG in a Wristwatch - A wristwatch worn by a user for measuring three-lead ECG is disclosed. The wristwatch includes three electrodes placed separately on the front, either side, and back or strap thereof. The wristwatch further includes an electrode panel having the electrode on the front or either side of the watch, sensing elements, pressure, infrared or impedance detectors, and circuits. The electrode panel is capable of sensing the contact or press of fingers to trigger ECG measuring. While the electrode in the back-side of the watch contacts the hand wearing the watch, the electrode and electrode panel on the front or either side of the watch are pressed by fingers from the other hand and the electrode in the strap contacts abdomen or left leg simultaneously, three-lead ECG can be measured. ECG data can be transmitted to a personal or hospital computer by wireless networks or flash memory. | 03-25-2010 |
Ren-Cheng Chao, Taoyuan City TW
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20110309756 | Road Lamp Dimming Control Device - A road lamp dimming control device comprises a signal processor, a power supplier, a driver and a light emitting module. The single processor is used for receiving an inputted electric current and a control signal. The control signal is decoded into a dimming control signal that then is transmitted to the power supplier. The power supplier converts the inputted electric current into constant current based upon the dimming control signal. The driver receives the constant current to drive the light emitting module to allow the light emitting module having different brightness based upon the control signal, thereby performing multi-stage variation. | 12-22-2011 |
20130201704 | VEHICLE HEADLIGHT AND ALERT SYSTEM - A vehicle headlight and control system for a bus or large vehicle includes a headlight fixture with a center or low beam light source and side illumination light source operated independently. The side illumination light source may be activated when the vehicle is turning, as detected by the vehicle speed and steering shaft turn angle, to provide supplemental illumination. Both right and left side illumination sources may be provided, and may comprise LED light elements. The system may also include an audible sound generator to alert pedestrians when the vehicle is turning. | 08-08-2013 |
Ren-Cheng Chao, Dashi TW
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20090185372 | LED flat lamp - An LED flat lamp including a housing with a light-emitting area at the bottom thereof. The internal side thereof undergoes a reflexion treatment. At least one LED is disposed within the housing. A power connector is extended from the LED to the outside. The LED is installed on a circuit board. A light guide plate is installed at one side of the LED within the housing. The light exit side of the light guide plate is provided with a microstructure for a uniform light exit. Moreover, an optical film unit is attached to the bottom of the light guide plate such that the light-emitting area of the housing is covered with the optical film unit. The optical film unit consists of one or several brightness enhancement films and one or several diffusers. In this way, the problem of glaring light directly emitted by the prior art is resolved. The LED flat lamp in accordance with the invention can emit a non-glaring light and can be modularized into a standardized product. | 07-23-2009 |
Seh-Huang Chao, Chung Ho City TW
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20100113224 | CONTROLLING DEVICE FOR ELECTRONIC DEVICE USAGE CONTROL - A controlling device for electronic device usage control converts a user's operation of an exercise apparatus into an operation record and controls the condition of on/off of an electronic device according to the operation record. | 05-06-2010 |
Shin-Min Chao, Jhonghe City TW
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20100103375 | EYE-TRACKING METHOD AND SYSTEM FOR IMPLEMENTING THE SAME - An eye-tracking method includes acquiring an image of an eye of a user, identifying a pupil of and a reflected light spot on the eye from the acquired image, determining a distance of the reflected light spot from a reference point on the pupil and an angle of the reflected light spot from an axis passing through the reference point on the pupil, determining a gazing point based on the distance and the angle and a pre-established set of data, and performing an operation associated with the gazing point. A system for implementing the eye-tracking method is also disclosed. | 04-29-2010 |
20100245767 | EYE-TRACKING METHOD AND EYE-TRACKING SYSTEM FOR IMPLEMENTING THE SAME - An eye-tracking method includes: acquiring an image of an eye of a user captured by an image-capturing module while the user is gazing at a gazing location on a screen module and a pair of light sources emit light toward the eye of the user; determining an angle and an area based on positions of a pupil and two reflected light spots on the eye of the user, wherein the angle and the area correspond to the gazing location; determining coordinates on the screen module based on the angle and the area, wherein the coordinates correspond to the gazing location; and performing an operation associated with the coordinates. An eye-tracking system for implementing the eye-tracking method is also disclosed. A correcting method and a correcting module for the eye-tracking system are further disclosed. | 09-30-2010 |
Simon Chao, Nan-Tou Hsien TW
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20120077645 | EXERCISING DEVICE - An exercising device includes left and right linking units each having a swing link pivotally mounted on a front support of a frame, a crank link coupling a crank arm to the swing link, and a pedal link connected to a lower end of the swing link, and left and right foot engaging pedals each mounted on a rear linkage end of the pedal link to be movable along an elliptical path with rotation of the crank arms. A sloping ramp member has an inclined surface to guide the foot engaging pedals to simulate stair climbing during the elliptical movement of the foot engaging pedals through left and right rollable anti-friction members mounted under the foot engaging pedals and rollably engaged with the inclined surface. | 03-29-2012 |
20120088635 | Elliptical Exercise Apparatus - An elliptical exercise apparatus includes a frame unit having a base frame, two crank arms, and two link units disposed respectively on left and right sides of the frame unit and each including a pedal rod connected pivotally to one of the crank arms. An adjustment unit includes a motor mounted on the frame unit, a threaded rod connected drivenly to the motor, a pull unit connected pivotally to the frame unit and connected drivenly to the threaded rod, and two roller sets connected pivotally to and disposed respectively on left and right sides of the pull unit. Each roller set is disposed in rolling contact with the pedal rod of a respective link unit. The roller sets are limitedly movable toward or away from an axis of rotation of the crank arms by a pulling action of the pull unit. | 04-12-2012 |
20120088636 | Elliptical Exercise Apparatus - An elliptical exercise apparatus includes a frame unit having a base frame and an upstanding frame, two crank arms, and an adjustment unit including a motor, a slide mounted movably on the upstanding frame, and a threaded rod connected threadedly to the slide and connected drivenly to the motor. Two swing units are disposed respectively on left and right sides of the frame unit and each includes a handle movable along with the slide, a link rod connected pivotally between an intermediate portion of the handle and one of the crank arms, a pivot arm connected pivotally to the link rod, and a pedal rod connected pivotally between a lower connecting portion of the handle and the pivot arm. The slide moves upwardly or downwardly along the upstanding frame when the motor is activated to adjust the position of the handle relative to the upstanding frame. | 04-12-2012 |
20130225377 | Stretching Exercise Apparatus - A stretching exercise apparatus includes a first leg frame, a second leg frame oppositely spaced apart from the first leg frame, a seat frame connected transversely to the first and second leg frames, a leg lift frame pivoted to the first leg frame, an upright bar extending upwardly from and connected foldably to a top end of the first leg frame, and an elastic cord unit extending through the upright bar and the first leg frame and having one end connected to the leg lift frame and another end extending outwardly of the upright bar. | 08-29-2013 |
Teng-Chih Chao, Pingjhen City TW
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20090171048 | SOLUBLE POLYTHIOPHENE DERIVATIVES - The present invention discloses a soluble polythiophene derivative containing highly coplanar repeating units. The coplanar characteristic of the TPT (thiophene-phenylene-thiophene) units improves the degree of intramolecular conjugation and intermolecular π-π interaction. The polythiophene derivative exhibits good carrier mobility and is suitable for use in optoelectronic devices such as organic thin film transistors (OTFTs), organic light-emitting diodes (OLEDs), and organic solar cells (OSCs). | 07-02-2009 |
20090299029 | SOLUBLE POLYTHIOPHENE DERIVATIVES - The present invention discloses a soluble polythiophene derivative containing highly coplanar repeating units. The coplanar characteristic of the TPT (thiophene-phenylene-thiophene) units improves the degree of intramolecular conjugation and intermolecular π-π interaction. The polythiophene derivative exhibits good carrier mobility and is suitable for use in optoelectronic devices such as organic thin film transistors (OTFTs), organic light-emitting diodes (OLEDs), and organic solar cells (OSCs). | 12-03-2009 |
20110049495 | QUINOXALINE DERIVATIVES AND ORGANIC LIGHT-EMITTING DIODES COMPRISING THE SAME - A quinoxaline derivative represented by Formula (I) or (II) is provided. | 03-03-2011 |
20110198571 | ORGANIC COMPOUND AND ORGANIC ELECTROLUMINESCENCE DEVICE EMPLOYING THE SAME - Organic compounds and organic electroluminescence devices employing the same are provided. The organic compound has a chemical structure represented as follows: | 08-18-2011 |
20110285275 | ORGANOMETALLIC COMPOUND, ORGANIC ELECTROLUMINESCENCE DEVICE AND COMPOSITION EMPLOYING THE SAME - Organometallic compounds and organic electroluminescence devices and compositions employing the same are provided. The organic metal compound has a chemical structure represented by formula (I) or formula (II): | 11-24-2011 |
20120305901 | QUINOXALINE DERIVATIVES AND ORGANIC LIGHT-EMITTING DIODES COMPRISING THE SAME - A quinoxaline derivative represented by Formula (I) of | 12-06-2012 |
20130033171 | ORGANOMETALLIC COMPOUND AND ORGANIC ELECTROLUMINESCENCE DEVICE EMPLOYING THE SAME - Organometallic compounds and organic electroluminescence devices employing the same are provided. The organic compound has a chemical structure as represented below: | 02-07-2013 |
20130033172 | ORGANOMETALLIC COMPOUND AND ORGANIC ELECTROLUMINESCENCE DEVICE EMPLOYING THE SAME - Organometallic compounds and organic electroluminescence devices employing the same are provided. The organometallic compound has a chemical structure represented below: | 02-07-2013 |
Tzu-Hao Chao, New Taipei City TW
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20110254024 | Circuit Structure of Package Carrier and Multi-Chip Package - A multi-chip package comprises a plurality of chip pads and a plurality of LED chips. The chip pads are arranged in an M×N array, M and N each a positive integer greater than 1. A peripheral area of each chip pad comprises a respective first bonding pad, a respective second bonding pad, and a respective third bonding pad arranged in sequence in a clockwise direction. A first orientation of the respective first to third bonding pads in a first row of the N rows differs from a second orientation of the respective first to third bonding pads in a second row of the N rows by 90 degrees. Each of the LED chips is disposed on a respective one of the chip pads and electrically connected to two of the respective first to third bonding pads on a same side of the respective LED chip. | 10-20-2011 |
20110297976 | Illumination Module - An illumination module including a substrate and a plurality of first and second LED chips is provided. The substrate has a plurality of device bonding areas, and each of device bonding areas has two sub-device bonding areas. Each sub-device bonding area has a first, second, and common route. The first routes surround the outer peripheries of each device bonding area. The second routes are located between the two sub-device bonding areas. The common routes are located between the first and second routes. The first LED chips located at the common routes are electrically connected to each other. The second LED chips located at the first and second routes respectly are electrically connected to each other. | 12-08-2011 |
20120176047 | Lighting Apparatus and Light Emitting Diode Device Thereof - The present invention provides a light emitting diode (LED) device. The LED device include a driver, a first LED coupled in series with the driver, and an impedance-providing component coupled in parallel with the first LED and in series with the driver. The impedance-providing component provides a shunt impedance having a value that varies in positive proportion with a variation in an ambient temperature. The driver is respectively coupled in series with the first LED and the at least one impedance-providing component. The driver provides a drive current divided to flow through the first LED and the at least one impedance-providing component according to the shunt impedance and the internal impedance. | 07-12-2012 |
20120181564 | Phosphor Coating Method for Fabricating Light Emitting Semiconductor Device and Applications Thereof - In one aspect, a light emitting unit comprises: a first semiconductor layer having a first electric property; a second semiconductor layer having a second electric property disposed over the first semiconductor layer; an active layer disposed between the first semiconductor layer and the second semiconductor layer; a first electrode disposed on the second semiconductor layer; a second electrode disposed under the first semiconductor layer; and a phosphor layer disposed on the first semiconductor layer. The phosphor layer covers the active layer and the second semiconductor layer. The first electrode is exposed out of the phosphor layer. | 07-19-2012 |
Tzu Yi Chao, Science-Based Industrial Park Hsin-Chu TW
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20090195505 | MOTION ESTIMATION DEVICE AND POWER SAVING METHOD THEREOF - A power saving method for a motion estimation device which has a fixed sampling period and includes a light source illuminating with an adjustable emitting cycle to provide the needed light for the motion estimation device during capturing images. The power saving method includes: capturing a first image at a first time; capturing a second image at a second time, wherein a time interval between the first time and the second time is identical to one emitting cycle which is an integral multiple of the sampling period; comparing the first image and the second image to obtain a displacement; comparing the displacement with at least one threshold value; and adjusting the emitting cycle of the light source according to a comparison result of comparing the displacement and the threshold value. The present invention further provides a motion estimation device. | 08-06-2009 |
Walley Chao, Nantou City TW
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20090288302 | FOLDING HAND SAW - A folding hand saw includes a first housing, a transmission unit disposed in the first housing, a second housing having a third pivotal end pivotally connected with a second pivotal end of the first housing and connected with the transmission unit, and a saw blade having a forth pivotal end pivotally connected with a first pivotal end of the first housing and connected with the transmission unit such that the saw blade is pivotable between a folded position where the saw blade is inserted into a first insertion groove of the first housing and a second insertion groove of the second housing, and an unfolded position where the saw blade leaves the first insertion groove and the second insertion groove. As a result, the folding hand saw of the present invention can prevent the saw blade from hurting a user or other people. | 11-26-2009 |
Walley Chao, Nantou County TW
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20090214310 | HOLE SAW - A hole saw includes an arbor, a saw blade assembly having a saw blade and an adapter connected with the saw blade and provided with a protrusion received in an indentation of the arbor, a lid movably mounted on a body portion of the arbor and movable relative to the arbor between a first position where second coupling portions of the adapter are blocked by a block portion of the lid and coupled to first coupling portions of the arbor such that the saw blade assembly can't be rotatable relative to the arbor, and a second position where the second coupling portions of the adapter are staggered with the block portion and uncoupled from the first coupling portions of the arbor through the rotation of the saw blade assembly. Thus, the hole saw has the advantages of reducing vibration in use and convenience in assembly and disassembly works. | 08-27-2009 |
20090265944 | SAW BOW FOR HANDSAW - A saw bow for a handsaw includes a saw bow body, a movable member movably mounted in a bottom of a handle of the saw bow body and movable relative to the handle along a longitudinal direction of the saw bow body, a bottom cover having a first pivotal portion pivotally connected with the handle of the saw bow body and a second pivotal portion, and a length-adjustable member having two ends respectively pivotally connected with a pivotal end of the movable member and the second pivotal portion of the bottom cover. As a result, the saw bow of the present invention can provide a congruous appearance and occupy less storage space. | 10-29-2009 |
Wan-Chin Chao, Hsinchu County TW
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20110133686 | BATTERY DEVICE - A battery device for a notebook computer includes a control circuit, a rechargeable battery unit, and a fuel cell unit. The control circuit includes a transmission interface adapted to be electrically connected to the notebook computer. The rechargeable battery unit is electrically connected to the control circuit and includes a plurality of battery cells. The fuel cell unit is electrically connected to the control circuit. A volume of the fuel cell unit is substantially integral multiple of a volume of the battery cell. | 06-09-2011 |
Wen-Hsin Chao, Changhua TW
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20110221344 | Compact fluorescent lamp operable in different power sources - One embodiment of a compact fluorescent lamp includes a circuit assembly comprising a rectifier, a plurality of capacitors, a plurality of ICs, a plurality of inductors, a transformer for converting AC to DC, a plurality of diodes, and a PCB; a CFL electrically connected to the circuit assembly; a shade for enclosing the CFL; and a housing for mounting the circuit assembly therein. The circuit assembly is operable when voltage variation is between 2.5 and 21 V. Further, the lamp can operate in one of three different power sources (e.g., DC power supply, electronic transformer, and electrical transformer). | 09-15-2011 |
Wen-Wan Chao, Changhua County TW
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20120045519 | USE OF DEOXYELEPHANTOPIN (DET) AND ANALOGUES THEREOF FOR TREATMENT OF MELANOMA - Methods for treating melanoma in a subject in need thereof are disclosed. The method comprises administering to the subject a composition comprising a therapeutically effective amount of deoxyelephantopin or an analogue thereof; and a pharmaceutically acceptable carrier. Methods of inhibiting proliferation, migration and/or metastasis of melanoma cells in a subject in need thereof are also disclosed. Also disclosed are methods for reducing side effects of an anti-cancer agent in a subject in need thereof. | 02-23-2012 |
20140242190 | USE OF DEOXYELEPHANTOPIN (DET) AND ANALOGUES THEREOF FOR TREATMENT OF MELANOMA - Methods for preventing and/or reducing side effects of an anti-cancer agent in a subject in need thereof are disclosed. The method comprises administering to the subject, who is under an anti-cancer agent treatment, a composition comprising a therapeutically effective amount of isolated deoxyelephantopin and/or an analogue thereof; and a pharmaceutically acceptable carrier. | 08-28-2014 |
Ya-Wen Chao, Kaohsiung City TW
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20120026203 | IMAGE COMPENSATION APPARATUS AND METHOD THEREOF AND FIELD SEQUENTIAL COLOR LIQUID CRYSTAL DISPLAY USING THE SAME - An image compensation apparatus and a method thereof and a field sequential color liquid crystal display (FSC-LCD) using the same are provided. The method includes performing a motion estimation to a first color image information so as to obtain a motion vector; performing a color decomposition to the first color image information so as to obtain a first sub-color-field and a residual color image information; performing a motion compensation to the residual color image information according to the motion vector, so as to obtain a second, a third and a fourth sub-color-fields; and separating a white component from the second, the third and the fourth sub-color-fields into the first sub-color-field, so as to make a color component corresponding to one of the second, the third and the fourth sub-color-fields to be zero, and accordingly output and provide a second color image information to the FSC-LCD to display frame(s). | 02-02-2012 |
Yei-Chin Chao, Tainan City TW
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20100154297 | OXIDIZER OF BURNER - The present invention pertains to a liquid oxidizer of burner consisting of a hydrogen peroxide (H | 06-24-2010 |
20130153010 | COMBUSTOR FOR THERMOPHOTOVOLTAIC POWER SYSTEMS - A combustor for thermaophotovoltaic power systems includes a chamber body pervious to light and a metal porous medium as well as an emitter tube disposed inside the chamber body, respectively. By using a mixed liquid fuel to penetrate through the porous medium to form a fuel-film on the surface thereof and injecting the air into the chamber body, the contact surface of the fuel and the air is increased for promoting the thermal conduction and thoroughly vaporizing the liquid fuel to attain the flame stabilization. Further, the material of metal carbonyl can be added into the liquid fuel to efficiently increase the intensity of the flame luminescence after the burning reaction, and the radiation of the emitter tube combines with the radiation of the flame luminescence to increase the luminosity and enhance the electricity conversion efficiency. | 06-20-2013 |
20130157206 | A COMBUSTOR APPLIED IN THERMOPHOTOVOLTAIC SYSTEM - A combustor applied in thermophotovoltaic system comprises a combustion device and a reversed tube covering the combustion device. The combustion device includes a combustion body made of a transparent, and temperature resistant material and a burning unit disposed in the combustion body. When a burning-supported medium is adopted during burning via the burning unit, the radiant intensity is increased. The reversed tube thence further redirects the hot product gas for reheating an outer wail of the combustion body in combustion. Therefore, uniform illumination is accordingly resulted for enhancing the radiant intensity. Accordingly, a photovoltaic cell plate connected to the combustor preferably transforms light into electricity. The present invention fully utilizes a micro system as well as miniature energy to offer advanced electricity. | 06-20-2013 |
Yi-Han Chao, Fing-Zhen Industrial Park TW
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20090073353 | Optical Film and Liquid Crystal Display - An optical film and a liquid crystal display are provided. The liquid crystal display includes a twisted nematic type liquid crystal panel and a backlight module. The liquid crystal panel includes a bottom polarizer, a liquid crystal cell, and a top polarizer. The liquid crystal cell is placed between the bottom polarizer and the top polarizer. The backlight includes a reflective polarizer and a half-wave plate, and the half-wave plate is placed on the reflective polarizer. The transmission axis of the bottom polarizer and the principle axis of the bottom polarizer differ a first angle. The transmission axis of the bottom polarizer and the reflective polarizer differ a second angle. The first angle is half of the second angle. | 03-19-2009 |
Yih-Sheng Chao, New Taipei City TW
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20120013578 | PEN-SHAPED POINTING DEVICE AND SHIFT CONTROL METHOD THEREOF - A shift control method is used with a pen-shaped pointing device and a controlled device. Firstly, shift information, tilt angle information and rotating angle information in response to a configuration change of the pointing device relative to a supporting plane are sensed. Then, a shift estimation operation is performed by the controlled device according to the shift information, the tilt angle information and the rotating angle information, thereby acquiring a position-compensating data. If the pointing device is in contact with the supporting plane, a moving trajectory of the pointing device displayed by the controlled device is adjusted according to the position-compensating data. | 01-19-2012 |
20120229426 | PEN-SHAPED INPUT APPARATUS - A pen-shaped input apparatus is disclosed in the disclosure. The pen-shaped input apparatus includes a body portion, a capturing module, a transparent spherical portion and a plurality of light sources. The body portion has a side surface. The capturing module is disposed within the body portion and adjacent to the side surface. The capturing module includes an optical sensor and a lens unit. The transparent spherical portion is disposed on the side surface. The transparent spherical portion, the lens unit and the optical sensor are lined on a capturing optical axis. The light sources are located between the side surface of the body portion and the transparent spherical portion. The light sources are symmetrically disposed around the capturing optical axis. | 09-13-2012 |
20130050152 | COORDINATE POSITIONING METHOD FOR DISPLAY - A coordinate positioning method to control the movement of the vernier on the display is disclosed. The method includes operating the electronic pen on the substrate having the waterprint pattern, capturing the image of the least one basis pixel where the electronic pen located on, transforming the basis pixel to the current coordinate, which is an absolute coordinate, and moving the vernier on the display to a position corresponding to the current coordinate. | 02-28-2013 |
Yin-Cheng Chao, Sanxia Township TW
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20110089461 | LED package structure and manufacturing process thereof - A process for manufacturing an LED package structure includes the following steps: (A) providing a T-shaped heat-sink block and an integral material sheet, wherein the T-shaped heat-sink block includes a base portion and a rise portion extending from the base portion, and wherein the integral material sheet includes a side frame and a pair of electrode lead frames extending, respectively, from two opposite internal sides of the side frame; (B) forming an insulating layer on an upper surface of the base portion; (C) disposing the electrode lead frames on the insulating layer; and (D) forming an insulating outer frame around the T-shaped heat-sink block, wherein the insulating layer is enveloped in the insulating outer frame, and part of the base portion of the heat-sink block exposes out of the insulating outer frame. As a result, the LED package structure can improve voltage resistance and insulation. | 04-21-2011 |
20110121706 | LED package structure - A LED package structure includes a heatsink slug, a positive-electrode frame, a negative-electrode frame, and a LED module electrically connected with the positive-electrode frame and the negative-electrode frame, respectively. The heatsink slug is provided, on its surface, with a converged ladder-like recess, where the LED module is fixed on a plane deep inside the recess. Thereby, the fluorescent-colloidal-layer covering on the LED module has an increased thickness in a normal direction, making the color-lights emitted from the chips and from the fluorescent colloid in the space and in every direction able to be maintained so as to achieve a better spatial color uniformity. | 05-26-2011 |
Yin-Cheng Chao, Yonghe City TW
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20110199749 | Led lead frame structure - An LED support's lead frame structure includes a side frame, a loading piece connected with the side frame, and at least one electrode pin. The electrode pin is located at one side of the loading piece and is spaced apart therefrom. The loading piece has a thickness same as that of the electrode pin. The electrode pin includes, connected in sequence, a first external leading section, a wire-bonding section, and a second external leading section. Both the first and the second external leading sections are connected with the side frame. The wire-bonding section includes a first protrusion. Therefore, the material required for wire-bonding is decreased, and the steps for machining the lead frame are decreased, so that the manufacturing process can be speeded up. This will help LED products miniaturized and the LED structure superior in thermal conductivity. | 08-18-2011 |
Ying-Chin Chao, Yen Chao Hsiang TW
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20110044785 | METHOD FOR MANUFACTURING SCREW WITH HELICAL CHIP DISCHARGE CHANNEL AND PRODUCT THEREOF - Disclosed is a method for manufacturing a screw with helical chip discharge channel, including providing a blank, subjecting an end of the blank to form a head and subjecting the blank to rolling to form one or more sections of threads. The screw is formed with one or more helical chip discharge channels, which can be of different helical angle according the different applications. The chip discharge channel can be formed by milling, rolling, or combined rolling and milling. The chip discharge channel is extended into the threads to form tapping edges. As such, the tapping operation is made effortless and the shape of the tapped thread excellent. The extending angle of the chip discharge channel can be changed according to different materials of the workpiece to be fastened. The length of the chip discharge channel can be selected according to different applications. | 02-24-2011 |
Ying-Fu Chao, Miaoli TW
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20110231597 | DATA ACCESS METHOD, MEMORY CONTROLLER AND MEMORY STORAGE SYSTEM - A data access method for accessing a non-volatile memory module is provided. The data access method includes configuring a plurality of logical addresses and grouping the logical addresses into logical blocks to map to the physical blocks of the non-volatile memory module, and a host system formats the logical addresses into one partition by using a file system and the partition stores at least one file and a file description block corresponding to the file. The data access method further includes searching an end mark corresponding to entry values of the file description block, setting logical addresses storing the end mark as default pattern addresses, and setting values stored in the logical addresses as default values corresponding to the default pattern addresses. Accordingly, the data access method can divide one partition into a write protect area and a writable area by updating data stored in the default pattern addresses. | 09-22-2011 |
Yin-Ping Chao, Sung-Shan TW
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20090060338 | Method of indexing Chinese characters - In practicing the present invention, in analyzing a Chinese character, a 3×3 square grid of 9 boxes is superimposed over the character. The character is analyzed based upon the shape of the stroke that is at the lowest elevation within the lower right-hand corner. A Table is consulted consisting of a plurality of elements including horizontal strokes, and the element most closely resembling the corresponding portion of the character is chosen. The user then consults a Root Table where characters all having in common the same part of the character immediately on top are displayed. From examination of the Root Table, the user narrows down the identity of the character to a smaller group. The pages to which the user is directed are carefully reviewed and the entire character may be found in a Form Block including pertinent information concerning the character. When the entire character is found, reference is made to a page in a dictionary where the same character may be found along with its definition and examples of proper use. | 03-05-2009 |
Yuan-Heng Chao, Chung Ho City TW
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20100113224 | CONTROLLING DEVICE FOR ELECTRONIC DEVICE USAGE CONTROL - A controlling device for electronic device usage control converts a user's operation of an exercise apparatus into an operation record and controls the condition of on/off of an electronic device according to the operation record. | 05-06-2010 |
Yu-Chiang Chao, Bade City TW
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20090181513 | VERTICAL ORGANIC TRANSISTOR - A vertical organic transistor and a method for fabricating the same are provided, wherein an emitter, a grid with openings and a collector are sequentially arranged above a substrate. Two organic semiconductor layers are interposed respectively between the emitter and the grid with openings and between the grid with openings and the collector. The channel length is simply decided by the thickness of the organic semiconductor layers. The collector current depends on the space-charge-limited current contributed by the potential difference between the emitter and the openings of the grid. And the grid voltage can thus effectively control the collector current. Further, the fabrication process of the vertical organic transistor of the present invention is simple and exempt from using the photolithographic process. | 07-16-2009 |
20090230383 | Passive matrix organic light emitting diode display device - A passive matrix organic light emitting diode display device comprises a plurality of vertical organic light emitting transistors, each having a first collector, a first grid/base, and a first emitter. Therein, the first collectors are electrically connected and arranged parallelly to form a plurality of first scan units, and the first grids/bases are electrically connected and arranged parallelly to form a plurality of second scan units, while the first emitters are integrated into a common electrode, in which the first scan units and the second scan units are perpendicularly crossed. By perpendicularly combining vertical transistors onto organic light emitting diodes so as to drive the organic light emitting diodes, an active area as well as a luminance of the organic light emitting diode display device are enhanced and consequently an aperture ratio of each pixel unit in the organic light emitting diode display device is increased. | 09-17-2009 |
20090230384 | Vertical organic light emitting transistor assembly and horizontal organic light emitting transistor assembly - A vertical organic light emitting transistor assembly and-a horizontal organic light emitting transistor assembly are provided. The vertical organic light emitting transistor assembly comprises a first/second vertical transistor and a first/second organic light emitting diode perpendicularly integrated with the first/second vertical transistor, respectively. The horizontal organic light emitting transistor assembly comprises a substrate, a third vertical transistor and a third organic light emitting diode. The third vertical transistor and the third organic light emitting diode are arranged abreast on the substrate. By integrating the organic light emitting diode and the vertical transistor into a unitary electronic element, the vertical transistor can efficiently drive the organic light emitting diode so that the organic light emitting transistor assembly can overcome limitations caused by existing manufacturing processes and adapt to extensive applications. | 09-17-2009 |
20090256140 | Light-detecting device structure - A light-detecting device structure comprises a substrate, a vertical organic light-emitting transistor and a light-detecting unit, wherein the vertical organic light-emitting transistor is disposed at a first location on the substrate, and the light-detecting unit is disposed at a second location on the substrate, in which the first and the second locations can be spaced out an appropriate distance as needed. The vertical organic light-emitting transistor emits a light to an object, and the light-detecting unit receives a reflected light from the object. The reflected light received is analyzed to determine a distance between the light-detecting device structure and the object, as well as a shape or a composition of the object. | 10-15-2009 |
Yu-Hsiao Chao, Jhongli City TW
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20090315472 | BACKLIGHT MODULE - A backlight module positioned on a printed circuit board (PCB) includes a power control circuit, a transformer, and a voltage detection component. The power control circuit outputs power signals. The transformer has a primary winding and at least one secondary winding. The primary winding is connected to the power control circuit and receives the power signals. The voltage detection component is positioned on a high voltage terminal of the secondary winding of the transformer, detecting voltage variations in the high voltage terminal of the secondary winding of the transformer, and outputting the detected voltage variation to the power control circuit. The power control circuit adjusts the output power signals according to the detected voltage variation. | 12-24-2009 |
20100181928 | MULTI-LAMP DRIVING CIRCUIT - A multi-lamp driving circuit for driving a plurality of lamp groups includes an inversion circuit configured to drive the plurality of lamp groups and a current balance circuit electrically connected between the inversion circuit and the plurality of lamp groups. The current balance circuit includes a plurality of transformers, each including a first magnetic loop composed of a first primary winding and a first secondary winding and a second magnetic loop composed of a second primary winding and a second secondary winding. Numbers of turns of the second primary winding and the second secondary winding of each of the plurality of transformers are equivalent, and numbers of turns of the first primary winding and the first secondary winding of each of the plurality of transformers are equivalent. | 07-22-2010 |
20110103114 | SOLAR POWER CONVERSION CIRCUIT AND POWER SUPPLY SYSTEM USING THE SAME - A solar power supply system includes at least one solar power conversion circuit and an inverter circuit. Each solar power conversion circuit comprises a solar module and a direct current (DC) module. The solar module converts the solar power into the DC signals. The DC module with two-stage conversion comprises a DC transformer circuit and a maximum power point tracking circuit, to boost the DC signals and adjust output power of the solar module to a maximum value. The inverter circuit converts the boosted DC signals output from the solar power conversion circuits into AC signals and combines the AC signals into the AC utility network. | 05-05-2011 |
20110253348 | IONIC THERMAL DISSIPATION DEVICE - An ionic thermal dissipation device includes an ionic wind generating system and a power system to drive the ionic wind generating system. The power system first converts external direct current power signals into alternating current (AC) power signals, and boosts the AC power signals. The power system doubles voltage of the boosted AC power signals, and rectifies the boosted AC power signals to generate high voltage direct current power signals to drive the ionic wind generating system. The power system also detects current signals generated by ion excitation of the ionic wind generating system, and regulates the high voltage direct current power signals according to the detected current signals. | 10-20-2011 |
20110308769 | IONIC THERMAL DISSIPATION DEVICE - An ionic thermal dissipation device includes an ionic wind generation system and a power system. The power system first converts external direct current (DC) power signals into first alternating current (AC) power signals, and boosts, increases voltage, and rectifies the first AC power signals to generate high voltage DC power signals to drive the ionic wind generation system. The power system also detects current signals generated by ion excitation of the ionic wind generation system and voltage signals of the high voltage DC power signals, and regulates the high voltage DC power signals and time of driving the ionic wind generation system according to a first PWM signal and a first analog signal from an electronic device and the detected current signals and voltage signals. | 12-22-2011 |
20120139420 | LIGHT EMITTING DIODE DRIVING SYSTEM - A light emitting diode (LED) driving system comprises a plurality of current limitation circuits and a plurality of over-voltage protection circuits to driving a plurality of LED strings. Each of the current limitation circuits comprises a first switch comprising a control pole receiving a reference voltage, a first pole correspondingly connected to a LED string, and a second pole connected to the ground via a first resistor and a second switch comprising a control pole connected to the second pole of the first switch via a second resistor, a first pole receiving the reference voltage, and a second pole grounded. Each of the over-voltage protection circuits comprises a zener diode, a third switch and a first capacitor. | 06-07-2012 |
20120256557 | MULTI-LAMP DRIVING SYSTEM - A multi-lamp driving system includes a power stage circuit, a pulse width modulation (PWM) controller, a plurality of transformer circuits, and an abnormal detection circuit. Each of the transformer circuits includes a first primary winding and a second primary winding connected in series and a first secondary winding and a second secondary winding respectively outputting AC power signals to drive at least one lamp. The abnormal detection circuit is connected to a junction of the first primary winding and the second primary winding of each of the transformer circuits, and determines if voltages of the junction of the first primary winding and the second primary winding of each of the transformer circuits are different to determine if the at least two lamps are normal. The abnormal detection circuit further generate control signals to control the PWM controller upon the condition that one of the at least two lamps are abnormal. | 10-11-2012 |
Yung-Hsiang Chao, Taoyuan Hsien TW
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20110115391 | LED LAMP AND LED LAMP MODULE - A light emitting diode (LED) lamp. Brightness of the LED lamp is controlled by a dimmer and an external alternating current (AC) source is received via the dimmer. The LED lamp includes at least one LED, a rectifying-modulating-driving apparatus and a current holding compensator. The rectifying-modulating-driving apparatus is coupled between the LED and the dimmer for bridge-rectifying and modulating an AC source with a conducting angle from the dimmer to drive the LED. The current holding compensator is coupled to the rectifying-modulating-driving apparatus to provide a compensation current when the AC source with the conducting angle is lower than a voltage after being bridge-rectified. | 05-19-2011 |
20110285319 | LIGHT SOURCE MODULE - A light source module is provided. The light source module includes a full wave rectifier, a constant current output integrated circuit (IC) and at least one high operating voltage light emitting diode (HVLED) die coupled between the constant current output IC and a ground. The full wave rectifier generates a rectified signal according to an alternating current (AC) power. The constant current output IC outputs a constant current signal according to the rectified signal. A brightness of the HVLED die is determined by the constant current signal. | 11-24-2011 |
Yung-Hsuan Chao, Banciao City TW
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20100050204 | USER GROUP ASSIGNMENT METHOD FOR KEY MANAGEMENT - A method for assigning a plurality of users of a broadcasting system, wherein each of the plurality of users subscribes to at least one of a plurality of receiver groups provided by the broadcasting system. The method includes dividing the plurality of users into a plurality of temporary groups each including ones of the plurality of users that subscribe to a same one of the plurality of receiver groups; and assigning the ones of the plurality of users to at least one user group. | 02-25-2010 |
Yun-Peng Chao, Taichung TW
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20110123448 | OIL BODY CARRIERS, USES IN TARGET THERAPY AND/OR DETECTION OF THE SAME, AND FUSION PROTEINS COMPRISED THEREIN - An oil body carrier, its uses in target therapy and/or detection, and a fusion protein comprised therein are provided. The oil body carrier comprises: | 05-26-2011 |