Patent application number | Description | Published |
20080283942 | PACKAGE AND PACKAGING ASSEMBLY OF MICROELECTROMECHANICAL SYSYEM MICROPHONE - A package of a MEMS microphone is suitable for being mounted on a printed circuit board. The package includes a substrate, at least one MEMS microphone, and a conductive sealing element. The MEMS microphone is arranged on the substrate, and electrically connected to a conductive layer on a bottom surface of the substrate. The conductive sealing element is arranged on the substrate and around the MEMS microphone for connecting the printed circuit board, and constructs an acoustic housing with the printed circuit board and the substrate. The acoustic housing has at least one acoustic hole passing through the substrate. The acoustic hole has a metal layer on the inner wall thereof for connecting the conductive layer on the bottom surface of the substrate to another conductive layer on the top surface of the substrate. | 11-20-2008 |
20080283988 | PACKAGE AND PACKAGING ASSEMBLY OF MICROELECTROMECHANICAL SYSYEM MICROPHONE - A package of microelectromechanical system (MEMS) microphone is suitable for being mounted on a printed circuit board. The package has a cover and at least one MEMS microphone. The cover has an inner surface and a conductive trace disposed thereon. The MEMS microphone is mounted on the inner surface of the cover and electrically connected to the conductive trace, and has an acoustic pressure receiving surface. When the cover is mounted on the printed circuit board, the cover and the printed circuit board construct an acoustic housing which has at least one acoustic hole passing through the cover or the printed circuit board, and the conductive trace on the inner surface of the cover is electrically connected to the printed circuit board. | 11-20-2008 |
20110150261 | CAPACITIVE TRANSDUCER AND FABRICATION METHOD - A capacitive transducer and fabrication method are disclosed. The capacitive transducer includes a substrate, a first electrode mounted on the substrate, a cap having a through-hole and a cavity beside the through-hole, a second electrode mounted on the cap across the through-hole. The second electrode is deformable in response to pressure fluctuations applied thereto via the through-hole and defines, together with the first electrode, as a capacitor. The capacitor includes a capacitance variable with the pressure fluctuations and the cavity defines a back chamber for the deformable second electrode. | 06-23-2011 |
20110154905 | CAPACITIVE SENSOR AND MANUFACTURING METHOD THEREOF - A capacitive sensor includes a substrate, at least one first electrode, at least one second electrode, a sensing device, at least one anchor base, at least one movable frame, and a plurality of spring members. The first and second electrodes are disposed on the substrate, and the anchor base surrounds the first and second electrodes and is disposed on the substrate. The movable frame surrounds the sensing device. Some of the spring members connect the movable frame and the sensing device, and the other spring members connect the movable frame and the anchor base. The sensing device and the first electrode are both sensing electrodes. The movable frame is disposed above the second electrode, and cooperates with the second electrode to act as a capacitive driver. | 06-30-2011 |
20120001276 | APPARATUS INTEGRATING MICROELECTROMECHANICAL SYSTEM DEVICE WITH CIRCUIT CHIP AND METHODS FOR FABRICATING THE SAME - One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which comprises a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip. | 01-05-2012 |
20120154068 | CRYSTAL OSCILLATOR AND METHOD FOR MANUFACTURING THE SAME - A crystal oscillator includes a cover, a crystal blank and an Integrated Circuit (IC) chip. The cover has a surface, a cavity formed in the surface, a plurality of conductive contacts and a conductive sealing ring. The conductive contacts are disposed on the surface, and the conductive sealing ring is disposed on the surface and surrounds the conductive contacts. The IC chip is connected to the conductive contacts and the conductive sealing ring, and forms a hermetic chamber with the cover and the conductive sealing ring. The crystal blank is located in the hermetic chamber, and is electrically connected to the IC chip. Furthermore, a method for manufacturing a crystal oscillator is also provided. | 06-21-2012 |
20120160027 | MICRO-ELECTROMECHANICAL SYSTEM DEVICE HAVING ELECTRICAL INSULATING STRUCTURE AND MANUFACTURING METHODS - The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected. | 06-28-2012 |
20130167632 | MICROELECTROMECHANICAL SYSTEM DEVICE WITH ELECTRICAL INTERCONNECTIONS AND METHOD FOR FABRICATING THE SAME - A microelectromechanical system device including anchors and mass is provided. Electrical interconnections are formed on the mass by using a insulation layer of mass, an electrical insulation trench and conductive through hole. The electrical interconnections replace the cross-line structure without adding additional processing steps, thereby reducing the use of the conductive layer and the electrical insulation layer. A method for fabricating the microelectromechanical system device is also provided. | 07-04-2013 |
20130167635 | MICRO-ELECTRO-MECHANICAL-SYSTEM DEVICE WITH OSCILLATING ASSEMBLY - A micro-electro-mechanical-system (MEMS) device comprising two proof masses disposed in the first frame, such that the MEMS device with oscillating assemblies senses the angular velocity in the two axes, respectively. The MEMS device with oscillating assemblies further comprises a lever structure and two oscillating assemblies connecting at two opposite ends of the lever structure, such that the oscillating assemblies move in opposite directions synchronously. The MEMS device with oscillating assemblies further comprises a spring assembly connected between the proof mass and a movable electrode, restricting the proof mass to drive the movable electrode to only move in a specific direction. | 07-04-2013 |
20140175572 | MEMS DEVICE WITH MULTIPLE ELECTRODES AND FABRICATING METHOD THEREOF - A MEMS device with a first electrode, a second electrode and a third electrode is disclosed. These electrodes are disposed on a substrate in such a manner that (1) a pointing direction of the first electrode is in parallel with a normal direction of the substrate, (2) a pointing direction of the third electrode is perpendicular to the pointing direction of the first electrode, (3) the second electrode includes a sensing portion and a stationary portion, (4) the first electrode and the sensing portion are configured to define a sensing capacitor, and (5) the third electrode and the stationary portion are configured to define a reference capacitor. This arrangement facilitates the MEMS device such as a differential pressure sensor, differential barometer, differential microphone and decoupling capacitor to be miniaturized. | 06-26-2014 |
20140186987 | MANUFACTURING METHODS FOR MICRO-ELECTROMECHANICAL SYSTEM DEVICE HAVING ELECTRICAL INSULATING STRUCTURE - The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected. | 07-03-2014 |
20140245832 | MICRO-ELECTRO MECHANICAL APPARATUS WITH INTERDIGITATED SPRING - A micro-electro mechanical apparatus with interdigitated spring including a substrate, at least one first mass, a movable electrode, a stationary electrode, an anchor and an interdigitated spring is provided. The movable electrode is disposed on the mass along an axial direction. The stationary electrode is disposed on the substrate along the axial direction, and the movable electrode and the stationary electrode have a critical gap there between. The interdigitated springs connects the mass and the anchor along the axial direction. The interdigitated spring includes first folded portions, first connecting portions, second folded portions, and second connecting portions. Each first folded portion includes two first spans and a first head portion. Each second folded portion includes two second spans and a second head portion. A width of the first span and a width of the second span are greater than the critical gap respectively. | 09-04-2014 |
20140248731 | APPARATUS INTEGRATING MICROELECTROMECHANICAL SYSTEM DEVICE WITH CIRCUIT CHIP AND METHODS FOR FABRICATING THE SAME - One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which includes a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip. | 09-04-2014 |
20140284603 | COMPOSITE MICRO-ELECTRO-MECHANICAL-SYSTEM APPARATUS AND MANUFACTURING METHOD THEREOF - A MEMS apparatus comprising composite vibrating unit and the manufacturing method thereof are disclosed. The vibrating unit includes a stiffness element on which a first material is disposed. A second material being a conductive material is disposed on the first material and is extended to the stiffness element to remove electric charge on first material. When a temperature is changed, a variation direction of a Young's modulus of the first material is opposite to a variation direction of a Young's modulus of the stiffness element. The unique attributes above allow vibrating unit of the MEMS apparatus such as resonator and gyroscope to have stable resonance frequency against the change of temperature. | 09-25-2014 |