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Chao-Sheng
Chao-Sheng Huang, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20080217656 | I/O CIRCUIT WITH ESD PROTECTING FUNCTION - For ensuring the complete turn-off state of an ESD protecting device and preventing leakage current from a chip, an alternative conducting path is formed in the chip for bypassing an external current. The chip further includes an internal circuit and a conducting circuit. | 09-11-2008 |
Chao-Sheng Huang, Hsin-Tien TW
| Patent application number | Description | Published |
|---|---|---|
| 20080204077 | LEVEL SHIFTER - A level shifter for shifting an input signal to an output signal. The level shifter includes an input buffer biased a first voltage and a ground voltage; an output buffer and a level-processing unit both biased between a second voltage and the ground voltage; and a voltage-drop unit coupled to the level-processing unit and biased between the first voltage and the second voltage. While the first voltage is in an OFF state and the second voltage is switched on, the voltage-drop unit provides an initializing voltage for the level-processing unit according to the second voltage to shift the input signal to provide the output signal. | 08-28-2008 |
Chao-Sheng Tseng, Chiayi County TW
| Patent application number | Description | Published |
|---|---|---|
| 20090126183 | METHOD OF FABRICATING A POLYMER-BASED CAPACITIVE ULTRASONIC TRANSDUCER - A method of fabricating a polymer-based capacitive ultrasonic transducer, which comprises the steps of: (a) providing a substrate; (b) forming a first conductor on the substrate; (c) coating a sacrificial layer on the substrate while covering the first conductor by the same; (d) etching the sacrificial layer for forming an island while maintaining the island to contact with the first conductor; (e) coating a first polymer-based material on the substrate while covering the island by the same; (f) forming a second conductor on the first polymer-based material; (g) forming a via hole on the first polymer-based material while enabling the via hole to be channeled to the island; and (h) utilizing the via hole to etch and remove the island for forming a cavity. | 05-21-2009 |