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Chao-Hsuan
Chao-Hsuan Hsu, Toufen Townshop TW
| Patent application number | Description | Published |
|---|---|---|
| 20080250369 | Method of estimating the signal delay in a VLSI circuit - This invention relates to a method of estimating the signal delay in a VLSI circuit and accurately estimating the delay and conversion time of a transmission signal in the circuit in order to prevent a designer of the VLSI circuit from erroneously judging the logic made by the designed circuit. | 10-09-2008 |
Chao-Hsuan Liu, Tanzi Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20110061430 | MULTISTAGE LOCK APPARATUS - A multistage lock apparatus has a base, a disk holder, two selecting devices, two disk sets and at least one interfering element. The base has a mounting panel and a central tube. The disk holder is connected to the base and has a mounting beam, two extending beams, a middle beam, a connecting beam and two mounting spaces. The selecting devices are rotatably connected to the base. The disk sets are respectively mounted on the selecting devices in the mounting specs of the disk holder and each disk set has a driving disk and at least one driven disk. The at least one interfering element is mounted securely on the disk holder and each of the at least one interfering element has a mounting tab and two elastic panels. | 03-17-2011 |
Chao-Hsuan Su, Tucheng City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100219422 | PHOTO-COUPLER - A photo-coupler is provided. The photo-coupler comprises a light emitting chip, a light-sensing chip, a light-transmissive inner encapsulant package and an outer package. Both the light emitting chip and the light-sensing chip face the same direction, while the light-sensing chip receives a light beam emitted by the light emitting chip. The light-transmissive inner encapsulant package encloses the light emitting chip and the light-sensing chip, while the outer package encloses the light-transmissive inner encapsulant package. An interface is formed between the light-transmissive inner encapsulant package and the outer package for reflecting the light beam. A reflective curve surface adjacent to the light emitting chip is formed on the interface of the light-transmissive inner encapsulant package for reflecting and converging the first portion of the light beam to the light-sensing chip. | 09-02-2010 |