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Chao-Hsiung
Chao-Hsiung Chang, Hukou TW
| Patent application number | Description | Published |
|---|---|---|
| 20120061692 | LIGHT EMITTING DIODE PACKAGE HAVING INTERCONNECTION STRUCTURES - A light emitting diode (LED) package includes a substrate, a first LED chip and a second LED chip. The substrate includes first to fourth electrodes, and an interconnection electrode. A mounting area is defined at center of a top surface of the substrate. The first to fourth electrodes are respectively in four corners of the substrate out of the mounting area. The first interconnection electrode is embedded in the substrate to electrically connect the first and the third electrodes. The first LED chip and the second LED chip are arranged in the mounting area. Each LED chip includes an anode pad and a cathode pad. The first to fourth electrodes are respectively connected to the four pads of the first and the second LED chips via a plurality of metal wires, and no metal wire connection is formed between the first and the second LED chips. | 03-15-2012 |
| 20120077292 | METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE - An exemplary method of manufacturing an LED package includes providing a base, the base having a reflecting cup with a receiving recess defined therein; an LED chip is then mounted on the base and secured in a bottom of the receiving recess; thereafter, a dispensing nozzle is used to apply an encapsulating material into the receiving recess to encapsulate the LED chip; finally, the encapsulating material is baked to form an encapsulating layer. The dispensing nozzle moves relative to the receiving recess during the application of the encapsulating material. A depth of the receiving recess is varied. Parameters of the application of the encapsulating material into the receiving recess by the dispensing nozzle vary in response to a change of the depth of the receiving recess. | 03-29-2012 |
Chao-Hsiung Chang, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20120080700 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode package comprises a substrate, a light emitting diode chip, an encapsulating layer and a transparent surrounding layer. The surrounding layer is disposed on the substrate and encompasses the encapsulating layer, wherein the hardness of the surrounding layer is greater than the encapsulating layer. A method for manufacturing the light emitting diode package is also provided. | 04-05-2012 |
Chao-Hsiung Lin, Taoyuan County TW
| Patent application number | Description | Published |
|---|---|---|
| 20100019608 | THREE PHASE ROTARY GENERATOR - A generator includes a stator and a rotor. An inner side of the stator has a plurality of wire slots which are arranged in parallel. Coils are wound in the wire slots. The stator has a shape of a round ring with a central axis. Each wire slot is inclined to the central axis of the stator. Such a structure serves to increase the induction area to prevent from magnetic saturation so as to have preferred induction voltage and current. The coil is wound from a first one of the wire slots to a second one of the wire slots, where the first and second wire slots are spaced by another wire slot. | 01-28-2010 |
Chao-Hsiung Tseng, Miaoli County TW
| Patent application number | Description | Published |
|---|---|---|
| 20090278758 | Dipole Antenna Capable of Supporting Multi-band Communications - According to one embodiment of the present invention, a dipole antenna capable of supporting multi-band communications, includes a first portion of the antenna in a folded structure, a second portion of the antenna that includes a first coupling pad and a second coupling pad physically separated by a distance, and a current path along the first portion of the antenna and the second portion of the antenna, wherein a first portion of the current path that includes the first coupling pad and the second coupling pad is configured to introduce a slow wave effect if electric current flows through the first portion of the current path. | 11-12-2009 |
Chao-Hsiung Wang, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110059590 | METHOD FOR FORMING A REDUCED ACTIVE AREA IN A PHASE CHANGE MEMORY STRUCTURE - A phase change memory structure and method for forming the same, the method including providing a substrate comprising a conductive area; forming a spacer having a partially exposed sidewall region at an upper portion of the spacer defining a phase change memory element contact area; and, wherein the spacer bottom portion partially overlaps the conductive area. Both these two methods can reduce active area of a phase change memory element, therefore, reducing a required phase changing electrical current. | 03-10-2011 |
| 20110233575 | SINGLE PHOSPHOR LAYER PHOTONIC DEVICE FOR GENERATING WHITE LIGHT OR COLOR LIGHTS - A photonic device generates light from a full spectrum of lights including white light. The device includes two or more LEDs grown on a substrate, each generating light of a different wavelength and separately controlled. A light-emitting structure is formed on the substrate and apportioned into the two or more LEDs by etching to separate the light-emitting structure into different portions. At least one of the LEDs is coated with a phosphor material so that different wavelengths of light are generated by the LEDs while the same wavelength of light is emitted from the light-emitting structure. | 09-29-2011 |
Chao-Hsiung Wu, New Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120056053 | FIXING MECHANISM - A fixing mechanism used to fasten an object on a case includes a clamping structure, a positioning pillar and a buffering structure. The clamping structure is provided with a through hole and connected to the object. The positioning pillar is connected to the case. The buffering structure is provided with a positioning hole and has a trench surrounding the buffering structure, and a plurality of protruding parts disposed on a sidewall of the positioning hole. The through hole of the clamping structure can be engaged with the trench, and the positioning pillar can be inserted into the positioning hole, so that the protruding parts and the positioning pillar engage with each other. Accordingly, the object can be fixed on the case. | 03-08-2012 |
Chao-Hsiung Wu, Wugu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110290974 | RETAINING STRUCTURE HAVING LOCKING APPARATUS - A retaining structure is described. The retaining structure includes a supporting part and a plurality of locking apparatuses. The supporting part has a plurality of position portions and each of the position portions has an annular portion. The locking apparatuses are deposed between the in the component and the supporting part and are corresponding to the position portions of the supporting part. Each of the locking apparatuses includes a main body and a fastening portion. The main body has a first portion, a second portion, and an annular region. The first portion is joined to the annular portion of the position portion and the second portion is joined to the opening of the component. The fastening portion is joined to the annular region of the main body to allow the fastening portion to contact the annular region for fastening the component on the supporting part. | 12-01-2011 |
Chao-Hsiung Wu, Taipei County TW
| Patent application number | Description | Published |
|---|---|---|
| 20110017898 | STAND AND ELECTRONIC DEVICE USING THE SAME - A stand is provided. The stand is connected to a back cover of an object, and comprises a holding element; a positioning element disposed on the holding element; an elastic element having a hole and a first positioning portion, wherein the first positioning portion is engaged with a positioning slot of the back cover; and a fixing element fixing the elastic element to the holding element through the hole. | 01-27-2011 |