Patent application number | Description | Published |
20120047358 | METHOD AND SYSTEM FOR ACCELERATING BOOTING PROCESS - A method and a system for accelerating booting process are provided. The method is adapted to an electronic device having a processor, an embedded controller, and a system memory, in which program codes of a basic input/output system (BIOS) and the embedded controller of the electronic apparatus are commonly stored in the system memory. In the method, when receiving a booting triggering signal of the electronic apparatus, the processor controls the embedded controller to cease accessing the system memory, so as to load the BIOS program code from the system memory to a cache memory and execute power-on self test (POST) procedure. After the program code is loaded, the processor controls the embedded controller to return to a normal mode so as to access the system memory and execute monitoring functions. | 02-23-2012 |
20130113724 | METHOD FOR SETTING AND METHOD FOR DETECTING VIRTUAL KEY OF TOUCH PANEL - A method for setting and a method for detecting a virtual key of a touch panel are provided. The method for setting the virtual key of the touch panel includes the following steps. A setting interface is provided. A key function is received via the setting interface by a processor. A key area is received via the setting interface by the processor. The key function and the key area are stored in a register. The register corresponds to the virtual key. | 05-09-2013 |
20140350698 | Status Controlling System, Computer System, and Status Detecting Method Thereof - A status controlling system, a computer system, and a status detecting method thereof are disclosed. The status controlling system is used in the computer system. A main control module is used for indicating a shutdown status or an active status by a first level of an active-shutdown indicating interface. The status controlling system includes a basic input output system and an embedded control module. The basic input output system is used for indicating whether the computer system is in a sleep status by a second level of a system controlling interface, wherein when the computer system is in the sleep status, the basic input output system changes the second level. The embedded control module determines whether the computer system is in the shutdown or the active status by the first level and in the sleep status by the second level. | 11-27-2014 |
Patent application number | Description | Published |
20080197473 | CHIP HOLDER WITH WAFER LEVEL REDISTRIBUTION LAYER - A chip holder formed of silicon, glass, other ceramics or other suitable materials includes a plurality of recesses for retaining semiconductor chips. The bond pads of the semiconductor chip are formed on or over an area of the chip holder that surrounds the semiconductor chip thus expanding the bonding area. The bond pads are coupled, using semiconductor wafer processing techniques, to internal bond pads formed directly on the semiconductor chip. | 08-21-2008 |
20120206160 | TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS - Test structures for performing electrical tests of devices under one or more microbumps are provided. Each test structure includes at least one microbump pad and a test pad. The microbump pad is a part of a metal pad connected to an interconnect for a device. A width of the microbump pad is equal to or less than about 50 μm. The test pad is connected to the at least one microbump pad. The test pad has a size large enough to allow circuit probing of the device. The test pad is another part of the metal pad. A width of the test pad is greater than the at least one microbump pad. | 08-16-2012 |
20140327464 | TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS - A test structure including an array of microbumps electrically connecting a chip and a substrate, wherein a width of each microbump of the array of microbumps is equal to or less than about 50 microns (μm). The test structure further includes an interconnect structure connected to the array of microbumps. The test structure further includes an array of test pads around a periphery of the array of microbumps, wherein a test pad of the array of test pads is connected to a corresponding microbump of the array of microbumps through the interconnect structure. A width of the test pad is greater than a width of the corresponding microbump, and the test pad is adapted to be covered after circuit probing by a passivation material to prevent particle and corrosion issues. | 11-06-2014 |
Patent application number | Description | Published |
20130010375 | MINIATURIZED LENS ASSEMBLY - A miniaturized lens assembly includes a first lens, a stop, a second lens, a third lens, a fourth lens and a fifth lens, all of which are arranged in sequence from an object side to an image side along an optical axis. The first lens is made of plastic material, is a meniscus lens with negative refractive power, and includes a convex surface facing the object side. The second lens is made of plastic material and is a biconvex lens with positive refractive power. The third lens is made of glass material and is a biconvex lens with positive refractive power. The fourth lens is made of glass material, is a biconcave lens with negative refractive power, and is adhered to the third lens to form a compound lens. The fifth lens is made of plastic material, is provided with positive refractive power, and includes an aspheric surface. | 01-10-2013 |
20140334018 | IMAGING LENS ASSEMBLY - An imaging lens assembly includes first, second and third optical lenses that are arranged sequentially from an object side to an image side along an optical axis, and a constant-aperture diaphragm disposed between the second optical lens and the object side. Each of the first and second optical lenses has a positive refractive power near the optical axis. The third optical lens has a negative refractive power near the optical axis and has an object-side surface and an image-side surface, at least one of which has at least an inflection point. The imaging lens assembly satisfies: 0.5511-13-2014 | |
20140376111 | WIDE-ANGLE IMAGING LENS ASSEMBLY WITH THREE LENSES - A wide-angle imaging lens assembly comprises a fixing diaphragm and an optical set including three lenses. An arranging order from an object side to an image side is: a first lens; a second lens; a third lens. Two surfaces of the third lens have at least one inflection point from the optical axis to an end point of the aspheric surfaces. At least one surface of the three lenses are aspheric. The fixing diaphragm is disposed at any position between an object and the second lens. By the concatenation between the lenses and the adapted curvature radius, thickness, interval, refractivity, and Abbe numbers, the assembly attains a big diaphragm with ultra-wide-angle, a shorter height, and a better optical aberration. | 12-25-2014 |
20150062724 | LENS ASSEMBLY - A lens assembly includes a lens set which includes a first lens, a second lens, a third lens and a fourth lens arranged in sequence along an optical axis. The first lens has a positive optical power. The second lens has a positive optical power. The third lens has a negative optical power. The fourth lens has a positive optical power, and has an image-side surface, an object-side surface, and a peripheral surface interconnecting the two. At least one of the object-side and image-side surfaces has an inflection point located between the optical axis and the peripheral surface. The lens assembly satisfies 1503-05-2015 | |