Chao-Chen
Chao-Chen Chen, Hsinchu City TW
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20110117283 | SPRAY COATING SYSTEM - A spray coating system is provided. The spray coating system includes a spin support for supporting and spinning the substrate; a sprayer for applying a material to an upper surface of the substrate; a cup surrounding a lateral and lower region of the spin support, wherein an opening is located in an upper central region of the cup; an air supply mechanism for supplying air flows to a back surface of the substrate to prevent the material from adhering thereto, and an exhaust zone disposed below a slanted surface of the cup for exhausting the air flow and material. | 05-19-2011 |
Chao-Chen Chen, Hsinchu TW
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20090104545 | Color filter and fabrication method thereof - Embodiments disclose a method for fabricating a color filter, comprising: providing a substrate; forming a planarization layer on the substrate; forming a first color layer over the planarization layer; exposing and developing the first color layer to form a patterned first color filter unit over the planarization layer; forming a second color layer over the planarization layer and the patterned first color filter unit; exposing and developing the second color layer to form a patterned second color filter unit over the planarization layer; forming a third color layer over the planarization layer and the patterned first and second color filter units; and etching back or chemical mechanical polishing (CMP) the third color layer to form a patterned third color filter unit over the planarization layer. | 04-23-2009 |
20090121303 | Semiconductor package - A semiconductor package. The semiconductor package of the invention comprises: a substrate comprising at least one exposed area with photosensitive devices; a cover for isolating the exposed area from the external atmosphere, wherein one of either the substrate or the cover is a base, and the other is a top structure; and a dam formed on the base to form a cavity, wherein the top of the dam has a recess, the dam is attached the top structure by an adhesive, and the cavity corresponds to the exposed area. | 05-14-2009 |
Chao-Chen Cheng, Miao-Li County TW
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20140061585 | LIGHT EMITTING DIODE - The present invention provides a light emitting diode, which comprises a first LED die and a second LED die, each die comprising a first semi-conductive layer, a second semi-conductive layer, and a multiple quantum well layer disposed between the first and the second semi-conductive layers, wherein the first semi-conductive layer of the first LED die is coupled to the second semi-conductive layer of the second LED die so as to form a serially connected structure whereby the consuming current and heat generation of the light emitting diode are lowered so that the size of heat dissipating device for the light emitting diode can be reduced and illumination of the light emitting diode can be enhanced. | 03-06-2014 |
20140070164 | LIGHT EMITTING DIODE - The present invention provides a light emitting diode, which comprises a first LED die, a second LED die, and a dummy LED die, wherein the second LED die is disposed between the first LED die and the dummy LED die, and each die comprises a first semi-conductive layer, a second semi-conductive layer, and a multiple quantum well layer disposed between the first and the second semi-conductive layers. The first semi-conductive layer of the first LED die is coupled to the second semi-conductive layer of the second LED die, and the first semi-conductive layer of the second LED die is coupled to the first and second semi-conductive layers of the dummy LED die. | 03-13-2014 |
Chao-Chen Cheng, Hsinchu City 300 TW
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20140154821 | METHOD FOR FABRICATING VERTICAL LIGHT EMITTING DIODE (VLED) STRUCTURE USING A LASER PULSE TO REMOVE A CARRIER SUBSTRATE - A method for fabricating a vertical light-emitting diode (VLED) structure includes the steps of providing a carrier substrate, and forming a semiconductor structure on the carrier substrate having a p-type confinement layer, a multiple quantum well (MQW) layer in electrical contact with the p-type confinement layer configured to emit electromagnetic radiation, and an n-type confinement layer in electrical contact with the multiple quantum well (MQW) layer. The method also includes the steps of removing the carrier substrate using a laser pulse to expose an inverted surface of the n-type confinement layer, and forming a metal contact on the surface of the n-type confinement layer. | 06-05-2014 |
Chao-Chen Huang, Pingjhen City TW
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20080276820 | Styling pyrotechnic device - A styling pyrotechnic device comprising multiple, two preferred, bearing members with each disposed with multiple locating holes to receive insertion of multiple pyrotechnic tubes; each pyrotechnic tube being erected at a certain inclination; multiple locating holes on each bearing member being arranged in a circle; each circle having its circumference same as or different from that of another circle for multiple pyrotechnic tubes to be erected at different inclinations to produce various styling effects when fired into the skies. | 11-13-2008 |
Chao-Chen Kuo, Xinzhuang City TW
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20110277957 | DAMPING ELEMENT FOR HEAT DISSIPATING FAN - A damping element for a heat dissipating fan is made of a silica gel and includes a body member and a foot column extended from a first side surface of the body member. The foot column has a base portion extended from the body member, a column portion extended from the base portion and a head portion disposed at a free end of the foot column. A diameter of the base portion is larger than that of the column portion and a diameter of the head portion is larger than that of the column portion. The first side surface may include bumps. The damping element connects with the heat dissipating fan and the foot column is inserted into a hole of a computer casing. The bumps are contacted with the casing for absorbing the vibration of the fan and eliminating noise. | 11-17-2011 |
Chao-Chen Yang, Taichung City TW
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20120282148 | REGENERATION AND RECYCLING EQUIPMENT FOR FERROUS METAL - The present invention discloses ferrous metal recycling and regeneration equipment. In the equipment, the recycled ferrous metal is stored in recycled material storage tank, and in acid dissolving tank, acidic solution is added, then ferrous metal is poured in to remove non-ferrous metal impurity, then impurity is filtered through first filtering device, ferrous metal solution is then led to mixing tank, then in mixing tank, element phosphorus (P) is added so that P and Fe can compound into Ferric Phosphate (FePO | 11-08-2012 |