Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Chang, Xinzhuang City
Ching-Hsu Chang, Xinzhuang City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120045712 | EXTREME ULTRAVIOLET LIGHT (EUV) PHOTOMASKS, AND FABRICATION METHODS THEREOF - Embodiments of EUV photomasks and methods for forming a EUV photomask are provided. The method comprises providing a substrate, a reflective layer, a capping layer, a hard mask layer, and forming an opening therein. An absorber layer is then filled in the opening and over the top surface of the hard mask layer. A planarizing process is provided to remove the absorber layer above the top surface of the hard mask layer and form an absorber in the opening, wherein the absorber is substantially co-planar with the top surface of the hard mask layer. | 02-23-2012 |
Chun-Chi Chang, Xinzhuang City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110062996 | POWER ON DETECTION CIRCUIT - A power-on-detection (POD) circuit includes first and second comparators, a voltage divider, a detection circuit coupled to a first voltage source node and the voltage divider, and logic circuitry coupled to outputs of the first and second comparators. The detection circuit outputs a control signal identifying if a first voltage source node has a voltage potential that is higher than ground. The control signal turns on and off the first and second comparators, which are respectively coupled to first and second nodes of the voltage divider and to a reference voltage node. The logic circuitry outputs a power identification signal based on the signals received from the outputs of the first and second comparators. | 03-17-2011 |
Chyh-Yih Chang, Xinzhuang City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110031820 | RENEWABLE ENERGY TRANSMISSION, GENERATION, AND UTILIZATION DEVICE AND METHOD - The power generation and transmission device and method is able to be used to harness power such as solar and/or wind power and then transmit the power to a device on the other side of a physical structure such as a house, a car, a umbrella, a tent, and an awning. | 02-10-2011 |
Hong-Wen Chang, Xinzhuang City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100304399 | METHOD FOR CONTINUOUSLY DETECTING GLUCOSE CONCENTRATION IN SAMPLE, KIT THEREOF AND METHOD FOR USING BIOSENSOR - The invention provides a method for continuously detecting glucose concentration in a sample, including: (a) providing a biosensor comprising a transducer and a polysaccharide covered on the surface of the transducer; (b) providing a carbohydrate binding protein solution, wherein the carbohydrate binding protein has at least one receptor, and the receptor is capable of binding to the polysaccharide and glucose; (c) mixing a sample and the carbohydrate binding protein solution to form a mixture; (d) contacting the mixture with the biosensor; (e) detecting the amount of carbohydrate binding proteins bound to the polysaccharide by the biosensor, wherein glucose concentration of the sample is inversely proportional to the amount of carbohydrate binding proteins bound to the polysaccharide; and (f) refreshing the surface of the biosensor with a high concentration glucose solution. | 12-02-2010 |
Jung-Chien Chang, Xinzhuang City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080230264 | INTERCONNECTION STRUCTURE AND METHOD THEREOF - The present invention discloses an interconnection structure which is formed by a method comprising providing a first conductive substrate, a second conductive substrate, and an insulating substrate; respectively forming a first circuit and a second circuit on the first conductive substrate and the second conductive substrate; forming a conductive bump on the second circuit; and connecting the insulating substrate with the first circuit and the second circuit by pressing the first conductive substrate, the insulating substrate and the second conductive substrate, wherein the conductive bump penetrates the insulating substrate to contact the first circuit. | 09-25-2008 |
| 20090061552 | LIGHT EMITTING APPARATUS AND METHOD FOR THE SAME - A light emitting apparatus includes a patterned conductive layer, a light emitting component, and a first light diffusion layer, wherein the light emitting component is disposed on the patterned conductive layer and the light emitting component and the patterned conductive layer are embedded into the first light diffusion layer. The method for manufacturing the light emitting apparatus is also disclosed. | 03-05-2009 |
| 20090266596 | PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENTS AND METHODS FOR THE SAME - The present invention discloses a printed circuit board. The printed circuit board is made by the method of providing a substrate; forming a first circuit on the substrate; depositing a thin film on the substrate; building an electronic component on the substrate by the thin film and allowing the electronic component to electrically connect the first circuit; forming a blanket dielectric layer enclosing the electronic component; and removing the substrate. | 10-29-2009 |
| 20100276718 | LIGHT EMITTING APPARATUS AND METHOD FOR THE SAME - A light emitting apparatus includes a patterned conductive layer, a light emitting device on the patterned conductive layer, and a first light diffusion layer. The light emitting device and the patterned conductive layer are embedded in the first light diffusion layer. A method of forming such a light emitting apparatus is also disclosed. | 11-04-2010 |
| 20110108317 | PACKAGED STRUCTURE HAVING MAGNETIC COMPONENT AND METHOD THEREOF - A packaged structure having a magnetic component and a method of manufacturing the same are provided. The packaged structure includes an insulating substrate having a ring-typed recess, an island portion and a surrounding portion defined by the ring-typed recess, wherein the ring-typed recess is laterally between the island portion and the surrounding portion. The packaged structure further includes a ring-typed magnetic component placed in the ring-typed recess; an upper wiring layer above the insulating substrate and a lower wiring layer under the insulating substrate; an inner plated through hole vertically passing through the island portion and connecting the upper wiring layer and the lower wiring layer; an outer plated through hole vertically passing through the surrounding portion and connecting the upper wiring layer and the lower wiring layer, wherein the inner plated through hole, the outer plated through hole, the upper wiring layer and the lower wiring layer form a coil of wire surrounding the ring-typed magnetic component. | 05-12-2011 |
| 20110168438 | INTERCONNECTION STRUCTURE AND METHOD THEREOF - The present invention discloses an interconnection structure which is formed by a method comprising providing a first conductive substrate, a second conductive substrate, and an insulating substrate; respectively forming a first circuit and a second circuit on the first conductive substrate and the second conductive substrate; forming a conductive bump on the second circuit; and connecting the insulating substrate with the first circuit and the second circuit by pressing the first conductive substrate, the insulating substrate and the second conductive substrate, wherein the conductive bump penetrates the insulating substrate to contact the first circuit. | 07-14-2011 |
| 20110216514 | COMBINED MULTILAYER CIRCUIT BOARD HAVING EMBEDDED COMPONENTS AND MANUFACTURING METHOD OF THE SAME - A combined multilayered circuit board is provided. The combined multilayered circuit board includes a plurality of multilayered circuit boards, at least one of the plurality circuit boards being formed with an embedded electronic component and an internal chamber receiving the embedded electronic component. The internal chamber is full of air. The combined multilayered circuit board further includes at least one glue layer interposed between each of the plurality of multiple circuit boards for bonding the plurality of multilayered circuit boards together. | 09-08-2011 |
Po-Ling Chang, Xinzhuang City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100193357 | QUANTITATIVE ANALYSIS METHOD FOR MICRORNAS - The present invention discloses a quantitative analysis method for microRNAs, wherein a fluorescence-labeled DNA probe, which is equinumerous and completely complementary to a microRNA, hybridize with the microRNA. The products of hybridization include the fluorescence-labeled DNA probe containing 22 nucleotides and the probe-microRNA duplex containing 22 base pairs. The products of hybridization is introduced into a capillary by the pressure difference between two ends of the capillary and the siphon effect and separated by electrophoresis. A laser is used to induce fluorescence from the products of hybridization. Then, the intensities of fluorescence are measured and analyzed. | 08-05-2010 |
| 20110159482 | METHOD FOR DETECTING MULTIPLE SMALL NUCLEIC ACIDS - The present invention discloses a method for simultaneously detecting multiple small nucleic acids, which comprises steps: mixing a specimen, fluorescent probes, and bridge nucleic acids having different lengths to form a tested liquid; hybridizing the mixed short nucleic acid molecules, probes and bridge nucleic acids; adding ligases to enable the ligations of the short nucleic acid molecules and the fluorescent probes with the bridge nucleic acids being the templates; injecting the tested liquid into a capillary, and applying a voltage to the capillary to generate an electrophoresis effect and separate the hybridization products; and using laser to induce different fluorescent rays from different reaction products, and measuring the fluorescent rays, whereby the present invention can simultaneously detect multiple types of short nucleic acid molecules in a single capillary. | 06-30-2011 |