Patent application number | Description | Published |
20120045712 | EXTREME ULTRAVIOLET LIGHT (EUV) PHOTOMASKS, AND FABRICATION METHODS THEREOF - Embodiments of EUV photomasks and methods for forming a EUV photomask are provided. The method comprises providing a substrate, a reflective layer, a capping layer, a hard mask layer, and forming an opening therein. An absorber layer is then filled in the opening and over the top surface of the hard mask layer. A planarizing process is provided to remove the absorber layer above the top surface of the hard mask layer and form an absorber in the opening, wherein the absorber is substantially co-planar with the top surface of the hard mask layer. | 02-23-2012 |
20130258304 | ENHANCED EUV LITHOGRAPHY SYSTEM - The present disclosure provides a semiconductor lithography system. The lithography system includes a projection optics component. The projection optics component includes a curved aperture. The lithography system includes a photo mask positioned over the projection optics component. The photo mask contains a plurality of elongate semiconductor patterns. The semiconductor patterns each point in a direction substantially perpendicular to the curved aperture of the projection optics component. The present disclosure also provides a method. The method includes receiving a design layout for a semiconductor device. The design layout contains a plurality of semiconductor patterns each oriented in a given direction. The method includes transforming the design layout into a mask layout. The semiconductor patterns in the mask layout are oriented in a plurality of different directions as a function of their respective location. | 10-03-2013 |
20140248555 | EXTREME ULTRAVIOLET LIGHT (EUV) PHOTOMASKS, AND FABRICATION METHODS THEREOF - An extreme ultraviolet photomask comprises a reflective layer over a substrate, a capping layer over the reflective layer, a hard mask layer over the capping layer, and an absorber. The absorber is in the hard mask layer, the capping layer and the reflective layer. | 09-04-2014 |
Patent application number | Description | Published |
20080230264 | INTERCONNECTION STRUCTURE AND METHOD THEREOF - The present invention discloses an interconnection structure which is formed by a method comprising providing a first conductive substrate, a second conductive substrate, and an insulating substrate; respectively forming a first circuit and a second circuit on the first conductive substrate and the second conductive substrate; forming a conductive bump on the second circuit; and connecting the insulating substrate with the first circuit and the second circuit by pressing the first conductive substrate, the insulating substrate and the second conductive substrate, wherein the conductive bump penetrates the insulating substrate to contact the first circuit. | 09-25-2008 |
20090061552 | LIGHT EMITTING APPARATUS AND METHOD FOR THE SAME - A light emitting apparatus includes a patterned conductive layer, a light emitting component, and a first light diffusion layer, wherein the light emitting component is disposed on the patterned conductive layer and the light emitting component and the patterned conductive layer are embedded into the first light diffusion layer. The method for manufacturing the light emitting apparatus is also disclosed. | 03-05-2009 |
20090266596 | PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENTS AND METHODS FOR THE SAME - The present invention discloses a printed circuit board. The printed circuit board is made by the method of providing a substrate; forming a first circuit on the substrate; depositing a thin film on the substrate; building an electronic component on the substrate by the thin film and allowing the electronic component to electrically connect the first circuit; forming a blanket dielectric layer enclosing the electronic component; and removing the substrate. | 10-29-2009 |
20100276718 | LIGHT EMITTING APPARATUS AND METHOD FOR THE SAME - A light emitting apparatus includes a patterned conductive layer, a light emitting device on the patterned conductive layer, and a first light diffusion layer. The light emitting device and the patterned conductive layer are embedded in the first light diffusion layer. A method of forming such a light emitting apparatus is also disclosed. | 11-04-2010 |
20110108317 | PACKAGED STRUCTURE HAVING MAGNETIC COMPONENT AND METHOD THEREOF - A packaged structure having a magnetic component and a method of manufacturing the same are provided. The packaged structure includes an insulating substrate having a ring-typed recess, an island portion and a surrounding portion defined by the ring-typed recess, wherein the ring-typed recess is laterally between the island portion and the surrounding portion. The packaged structure further includes a ring-typed magnetic component placed in the ring-typed recess; an upper wiring layer above the insulating substrate and a lower wiring layer under the insulating substrate; an inner plated through hole vertically passing through the island portion and connecting the upper wiring layer and the lower wiring layer; an outer plated through hole vertically passing through the surrounding portion and connecting the upper wiring layer and the lower wiring layer, wherein the inner plated through hole, the outer plated through hole, the upper wiring layer and the lower wiring layer form a coil of wire surrounding the ring-typed magnetic component. | 05-12-2011 |
20110168438 | INTERCONNECTION STRUCTURE AND METHOD THEREOF - The present invention discloses an interconnection structure which is formed by a method comprising providing a first conductive substrate, a second conductive substrate, and an insulating substrate; respectively forming a first circuit and a second circuit on the first conductive substrate and the second conductive substrate; forming a conductive bump on the second circuit; and connecting the insulating substrate with the first circuit and the second circuit by pressing the first conductive substrate, the insulating substrate and the second conductive substrate, wherein the conductive bump penetrates the insulating substrate to contact the first circuit. | 07-14-2011 |
20110216514 | COMBINED MULTILAYER CIRCUIT BOARD HAVING EMBEDDED COMPONENTS AND MANUFACTURING METHOD OF THE SAME - A combined multilayered circuit board is provided. The combined multilayered circuit board includes a plurality of multilayered circuit boards, at least one of the plurality circuit boards being formed with an embedded electronic component and an internal chamber receiving the embedded electronic component. The internal chamber is full of air. The combined multilayered circuit board further includes at least one glue layer interposed between each of the plurality of multiple circuit boards for bonding the plurality of multilayered circuit boards together. | 09-08-2011 |
20120314390 | MULTILAYER CIRCUIT BOARD - A multilayer circuit board includes a first circuit layer, an insulating layer, a second circuit layer, an intermediate frame, an electronic element, and a third circuit layer. The insulating layer is disposed on the first circuit layer, and the second circuit layer is disposed on the insulating layer. The intermediate frame is disposed on the second circuit layer and has an accommodating space. The electronic element is disposed on the second circuit layer, electrically connected to the second circuit layer and located in the accommodating space. The third circuit layer is disposed on the intermediate frame. | 12-13-2012 |