| Patent application number | Description | Published |
|---|
| 20090264055 | ROLLING MACHINE - A rolling machine includes a first clipping component, a second clipping component, a lifting component, and a holding assembly. The first clipping component has a first surface and a second surface opposite to the first surface. The second clipping component has a third surface configured to contact the first surface and a fourth surface opposite to the third surface. The lifting component is connected to the first clipping component and configured to drive the first clipping component to move back and forth. The holding assembly has a first and second holders configured to be symmetrically positioned on both sides of the first clipping component. | 10-22-2009 |
| 20110031108 | SPUTTERING DEPOSITION METHOD AND APPARATUS - A sputtering deposition method is utilized by a sputtering deposition apparatus including a first chamber, a second chamber, a first carrier, and a second carrier. Some first substrates are positioned in the first carriers in the first chamber for heating. The first carriers in the first chamber and the second carriers in the second chamber are exchanged. The first substrates in the second chamber are sputtered. The second carriers in the first chamber and the first carriers in the second chamber are exchanged. The first substrates in the first chamber are taken out. | 02-10-2011 |
| 20110036708 | MAGNETRON SPUTTERING DEVICE - An exemplary magnetron sputtering device includes a target, a magnet arrangement, and a driving system. The target defines a magnet-receiving space therein. The magnet arrangement is received within the magnet-receiving space. The driving system is configured for driving the magnet arrangement to spin and move back and forth. | 02-17-2011 |
| 20110174607 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes at least one metal layer. A portion of the color layer corresponding to and located over the smooth region has a value for L* in a range from about 70.44 to about 72.44, a value for a* in a range from about −7.84 to about −6.84 and a value for b* in a range from about −8.57 to about −7.57 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
| 20110174661 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and the color layer together. The color layer includes at least one metal layer. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 40.34 to about 42.34, a value of a* in a range from about 0.11 to about 1.11 and a value of b* in a range from about 2.24 to about 3.24 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
| 20110174662 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes at least one metal layer. Portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 17.93 to about 19.93, a value of a* in a range from about 23.74 to about 24.74 and a value of b* in a range from about 2.20 to about 3.20 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
| 20110174663 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and the color layer together. The color layer includes at least one metal layer. Portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 57.57 to about 59.57, a value of a* in a range from about 1.04 to about 2.04 and a value of b* in a range from about 6.64 to about 7.64 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
| 20110174664 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and the color layer together. The color layer includes at least one metal layer. Portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 81.59 to about 83.59, a value of a* in a range from about −0.55 to about 0.45 and a value of b* in a range from about −0.60 to about 0.40 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
| 20110174666 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region, and the color layer is located over the smooth region of the base. The color layer includes titanium, and has a value for L* in the range from 51.55 to 52.55, a value for a* in the range from 13.12 to 14.12 and a value for b* in the range from 6.27 to 7.27 according to the Commission Internationale del'Eclairage, (CIE, International Commission on Illumination) LAB system. The bonding layer is located between the substrate and the color layer, providing adhesion therebetween. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
| 20110174667 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes at least one metal layer. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 32.51 to about 34.51, a value of a* in a range from about −8.74 to about −7.74 and a value of b* in a range from about −12.39 to about −11.39 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
| 20110174668 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes at least one metal layer. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 50.77 to about 52.77, a value of a* in a range from about −0.93 to about 0.07 and a value of b* in a range from about −1.26 to about −0.26 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
| 20110174669 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes at least one metal layer. Portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 59.12 to about 61.12, a value of a* in a range from about 0.17 to about 1.17 and a value of b* in a range from about 2.40 to about 3.40 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
| 20110174670 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 81.43 to about 83.43, a value of a* in a range from about 0.30 to about 1.30 and a value of b* in a range from about 2.11 to about 3.11 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
| 20110174671 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 36.54 to about 38.54, a value of a* in a range from about 0.04 to about 1.04 and a value of b* in a range from about 1.88 to about 2.88 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
| 20110174672 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 49.07 to about 51.07, a value of a* in a range from about 0.19 to about 1.19 and a value of b* in a range from about 1.94 to about 2.94 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
| 20110174673 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 81.76 to about 83.76, a value of a* in a range from about −0.63 to about 0.37 and a value of b* in a range from about −1.04 to about −0.04 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
| 20110174674 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 51.00 to about 53.00, a value of a* in a range from about −1.04 to about −0.04 and a value of b* in a range from about 1.88 to about 2.88 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
| 20110175500 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 75.26 to about 77.26, a value of a* in a range from about 0.42 to about 1.42 and a value of b* in a range from about 9.36 to about 10.36 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
| 20110177351 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes at least one metal layer. Portion of the color layer corresponding to and located over the smooth region has a value for L* in a range from about 18.14 to about 19.14, a value for a* in a range from about 13.39 to about 14.39 and a value for b* in a range from about −32.46 to about −31.46 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
| 20110177357 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes titanium. Portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 39.68 to about 41.68, a value of a* in a range from about 4.80 to about 5.80 and a value of b* in a range from about 6.88 to about 7.88 according to the Commission Internationale del'Eclairage, (CIE, International Commission on Illumination) LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
| Patent application number | Description | Published |
|---|
| 20110262767 | SURFACE HARDENED SUBSTRATE AND METHOD MAKING SAME - A surface hardened substrate includes a base, a transition layer disposed on a surface of the base, and a hard layer disposed on the transition layer. The transition layer includes at least two kinds of transition metals. The hard layer includes an alloy and a nonmetal. The alloy includes the at least two kinds of transition metals. | 10-27-2011 |
| 20110262769 | SURFACE HARDENED SUBSTRATE AND METHOD MAKING SAME - A surface hardened substrate includes a base, a transition layer disposed on a surface of the base, and a hard layer disposed on the transition layer. The transition layer includes at least two kinds of transition metals. The hard layer includes a composite that comprises the at least two kinds of transition metals and a nonmetal. | 10-27-2011 |
| 20110305893 | ALUMINUM ALLOY-AND-RESIN COMPOSITE AND METHOD FOR MAKING THE SAME - An aluminum alloy-and-resin composite includes an aluminum alloy substrate and resin composition formed on the substrate. The substrate is subjected to electrochemically etched and formed with nano-pores on its surface. The resin composition integrally couples to the surface of the aluminum alloy substrate by filling the nano-pores. The resin composition contains crystalline thermoplastic synthetic resins. | 12-15-2011 |
| 20110318558 | COATING, ARTICLE COATED WITH COATING, AND METHOD FOR MANUFACTURING ARTICLE - A coating includes a bonding layer comprised of TiNbN, a transition layer comprised of TiSiNbN formed on the bonding layer, and an outmost layer comprised of TiSiNbN formed on the transition layer. The percentage of atomics Ti and Nb in the outmost layer are respectively lower than the percentage of atomics Ti and Nb in the transition layer, and the percentage of atomic Si in the outmost layer are higher than the percentage of atomic Si in the transition layer. | 12-29-2011 |
| 20120009398 | HOUSING AND METHOD FOR MANUFACTURING HOUSING - A housing includes a substrate; a corrosion resistance layer deposited on the substrate; a bonding layer deposited on the corrosion resistance layer; and an abrasion resistance layer deposited on the bonding layer | 01-12-2012 |
| 20120018296 | CONTINUOUS VACUUM SPUTTERING METHOD - A continuous vacuum sputtering method includes the steps of providing a substrate; providing a continuous vacuum sputtering machine comprising a depositing chamber. The depositing chamber comprising at least one vacuum chamber, each vacuum chamber having a cathodic arc emitting source located therein; the substrate being loaded in the continuous vacuum sputtering machine; depositing a coating on the substrate by cathodic arc deposition using the cathodic arc emitting source. | 01-26-2012 |
| 20120018340 | DEVICE HOUSING AND METHOD FOR MAKING THE SAME - A device housing is provided. The device housing includes a substrate, a silicon dioxide film formed on the substrate, and a zinc oxide film formed on the silicon dioxide film. The silicon dioxide film has micrometer sized structures. The zinc oxide film has nanometer sized structures. A method for making the device housing is also described there. | 01-26-2012 |
| 20120021210 | ARTICLE AND METHOD FOR MANUFACTURING SAME - A article made by vacuum deposition, includes a substrate; and a color layer deposited on the substrate, wherein the color layer has an L* value between about 75 to about 80, a a* value between about −5 to about −10, and a b* value between about 15 to about 20 in the CIE LAB color space. | 01-26-2012 |
| 20120021244 | PROCESS FOR JOINING STAINLESS STEEL PART AND ALUMINA CERAMIC PART AND COMPOSITE ARTICLES MADE BY SAME - A process for joining a stainless steel part and a alumina ceramic part, comprising steps of: providing a metal part made of stainless steel, a ceramic part made of alumina ceramic, and a nickel foil; bring the metal part, ceramic part, and nickel foil into contact, with the nickel foil inserted between the metal part and ceramic part; applying a joining pressure of about 20˜60 MPa to the parts to be joined; and simultaneously applying a pulse electric current to the parts while the joining pressure is applied for heating up the parts to a joining temperature of about 950° C. to about 1150° C. at a rate of about 50˜300° C./min, maintaining the joining temperature for about 20˜40 minutes. | 01-26-2012 |
| 20120021245 | PROCESS FOR JOINING CARBON STEEL PART AND ZIRCONIA CERAMIC PART AND COMPOSITE ARTICLES MADE BY SAME - A process for joining a carbon steel part and a zirconia ceramic part, comprising steps of: providing a metal part made of carbon steel, a ceramic part made of zirconia ceramic, and a titanium foil; bringing the metal part, ceramic part, and titanium foil into contact, with the titanium foil inserted between the metal part and ceramic part; applying a joining pressure of about 10˜50 MPa to the parts to be joined; and simultaneously applying a pulse electric current to the parts while the joining pressure is applied for heating up the parts to a joining temperature of about 800° C. to about 1100° C. at a rate of about 50˜600° C./min, maintaining the joining temperature for about 10˜50 minutes. | 01-26-2012 |
| 20120024699 | COMPOSITE TARGET MATERIAL AND METHOD FOR PRODUCING THE SAME - A composite target material includes titanium oxide in a range between about 50 wt % and about 85 wt % and the remaining comprising stannic oxide or aluminum oxide or a combination of stannic oxide and aluminum oxide. A method for manufacturing composite target material includes the steps of: providing a mixture made of titanium oxide power in a range between about 40 wt % and about 80 wt %, stannic oxide powder or aluminum oxide in a range between about 15 wt % and about 50 wt %, binder in a range between about 5 wt % and about 10 wt %; pressing the mixture to form a blank; sintering the blank; cooling the blank. | 02-02-2012 |
| 20120027968 | DEVICE HOUSING AND METHOD FOR MAKING THE SAME - A device housing is provided. The device housing includes a substrate, and an anti-fingerprint film formed on the substrate. The anti-fingerprint film is a metal-nitrogen-oxygen compound coating. A method for making the device housing is also described there. | 02-02-2012 |
| 20120028030 | COATED ARTICLE AND METHOD FOR MANUFACTURING SAME - A coated article includes a substrate, and a coating deposited on the substrate by magnetron sputtering. The coating includes micropores, and each micropore is sealed by a sealing element. | 02-02-2012 |
| 20120028072 | COATING, ARTICLE COATED WITH COATING, AND METHOD FOR MANUFACTURING ARTICLE - A coating includes a deposited layer. The deposited layer is a nickel-titanium carbonitride layer. | 02-02-2012 |
| 20120028074 | COATING, ARTICLE COATED WITH COATING, AND METHOD FOR MANUFACTURING ARTICLE - A coating includes a nano-composite base comprising a number of films, the films stacked together one after another. Each film includes a nickel-titanium carbonitride layer and a titanium carbonitride layer. | 02-02-2012 |
| 20120034438 | COATED ARTICLE AND METHOD FOR MANUFACTURING SAME - A coated article comprises a substrate; a bonding layer deposited on the substrate; and a composite layer deposited on the bonding layer. The composite layer includes an equal number of alternating chromium-nitride layers and aluminum-nitride layers. | 02-09-2012 |
| 20120034452 | ARTICLE AND METHOD FOR MANUFACTURING SAME - An article includes a substrate and a color layer deposited on the substrate. The color layer has an L* value between about 36 to about 48, an a* value between about 4 to about 5, and a b* value between about 2 to about 4 in the CIE L*a*b* color space. | 02-09-2012 |
| 20120034487 | COATING, ARTICLE COATED WITH COATING, AND METHOD FOR MANUFACTURING ARTICLE - A coating includes a nano-composite layer including an equal number of films. The films are stacked on top of each other one after another. Each film includes a zirconium-copper carbonitride layer and a zirconium carbonitride layer. | 02-09-2012 |
| 20120034489 | COATING, ARTICLE COATED WITH COATING, AND METHOD FOR MANUFACTURING ARTICLE - A coating includes a nano-composite layer including a plurality of films. The films are stacked together one after another. Each film includes a zirconium-copper carbonitride layer and a zirconium carbonitride layer. | 02-09-2012 |
| 20120040116 | DEVICE HOUSING AND METHOD FOR MAKING THE SAME - A device housing is provided. The device housing includes a substrate, and a photochromic coating formed on the substrate. The photochromic coating includes at least one of a silver chloride-cuprous chloride mixture, a silver bromide-cuprous bromide mixture, and a silver chloride-cuprous chloride-silver bromide-cuprous bromide mixture. A method for making the device housing is also described therein. | 02-16-2012 |
| 20120040163 | COATING, ARTICLE COATED WITH COATING, AND METHOD FOR MANUFACTURING ARTICLE - A coating includes a zirconium yttrium carbon-nitride layer including a first surface and an opposite second surface, the atomic carbon content and the atomic nitrogen content in the zirconium yttrium carbon-nitride layer gradually increasing from the first surface to the second surface. | 02-16-2012 |
| 20120042991 | PROCESS FOR SURFACE TREATING ALUMINUM OR ALUMINUM ALLOY AND HOUSING MADE BY SAME - A housing includes a substrate made of aluminum or aluminum alloy, an ion implantation layer formed on the substrate, and a vacuum coated layer formed on the ion implantation layer. The ion implantation layer is implanted with one or more ion species selected from the group consisting of nitrogen ion, oxygen ion, and boron ion and is substantially comprised of one or more selected from the group consisting of aluminum nitride, aluminum oxide, and aluminum boride. The implanted ions can improve the compactness of the ion implantation layer. Thus, the corrosion resistance of the housing can be improved. | 02-23-2012 |
| 20120043299 | METHOD FOR MANUFACTURING COMPOSITE OF METAL AND RESIN - A method for manufacturing a composite of metal and resin including following steps: providing a metal piece; cleaning the metal piece in a degreasing agent solution; etching the surface of the metal piece by focused ion beam to form a pattern of nanopores; inserting the metal piece into a mold and heating the metal piece to reach a temperature in a range of 100° C. to 350° C.; and injecting molten resin material on the metal piece. The resin material is combined with the metal piece when the resin material is cool. | 02-23-2012 |
| 20120043689 | METHOD FOR MANUFACTURING COMPOSITE OF METAL AND RESIN - A method for manufacturing a composite of metal and resin includes steps of: providing a metal piece; cleaning the metal piece in a degreasing agent solution; partially shielding the metal piece and remaining portions of the metal surface uncovered; blasting the metal piece with hard particles to form a plurality of micro pores in the uncovered portion; inserting the metal piece into a mold; injecting molten resin material on the metal piece, the resin material combined with the metal piece when the resin material is cool. | 02-23-2012 |
| 20120045614 | COATING, ARTICLE COATED WITH COATING, AND METHOD FOR MANUFACTURING ARTICLE - A coating includes an anti-fingerprint layer. The anti-fingerprint layer comprises tin dioxide-aluminum oxide, and defines a plurality of nano scale concavities therein. | 02-23-2012 |
| 20120045621 | COATING, ARTICLE COATED WITH COATING, AND METHOD FOR MANUFACTURING ARTICLE - A coating includes a anti-fingerprint layer. The anti-fingerprint layer comprises zinc oxide-aluminum oxide, the anti-fingerprint layer comprises a plurality of nano scale concavities therein. | 02-23-2012 |
| 20120045640 | ARTICLE AND METHOD FOR MANUFACTURING SAME - An article includes a substrate; and a color layer deposited on the substrate, wherein the color layer has an L* value between about 28 to about 32, an a* value between about −1 to about 1, and a b* value between about −1 to about 1 in the CIE L*a*b* color space. | 02-23-2012 |
| 20120045659 | PROCESS FOR SURFACE TREATING ALUMINUM OR ALUMINUM ALLOY AND ARTICLE MADE WITH SAME - An article, includes a substrate made of aluminum or aluminum alloy and a AlON coating formed on the substrate. The AlON coating comprises, between about 50% and about 80% of atomic Al; between about 15% and about 40% of atomic O; and between about 5% and about 10% atomic N. | 02-23-2012 |
| 20120055691 | HOUSING AND METHOD FOR MANUFACTURING HOUSING - A housing includes a substrate; an aluminum layer deposited on the substrate; and an oxygen ion implantation layer deposited on the aluminum layer. The oxygen ion implantation layer comprising saturated aluminum oxide. The saturated Al | 03-08-2012 |
| 20120058361 | DEVICE HOUSING AND METHOD FOR MAKING THE SAME - A device housing is provided. The device housing includes a substrate, a barrier layer formed on the substrate, an illuminating layer formed on the barrier layer, and a protective layer formed on the illuminating layer. The barrier layer is made of titanium. The illuminating layer is made of rare-earth aluminates. The protective layer is made of silica dioxide. A method for making the device housing is also described there. | 03-08-2012 |
| 20120062081 | HOUSING AND METHOD FOR MANUFACTURING HOUSING - A housing includes a substrate; an aluminum layer deposited on the substrate; and an ion implantation layer formed on the aluminum layer, the ion implantation layer comprising aluminum(II) oxide solid solution phase and aluminum oxide solid solution phase. The disclosure further includes a method for manufacturing the housing. The method includes the following steps: providing a substrate made of aluminum alloy; depositing an aluminum layer on the substrate, the aluminum layer is deposited on the substrate with an aluminum target by magnetron sputtering process; and forming an ion implantation layer on the aluminum layer, the ion implantation layer is formed on the aluminum layer by implanting ions of oxygen into the aluminum layer, and the ion implantation layer comprising aluminum(II) oxide solid solution phase and aluminum oxide solid solution phase. | 03-15-2012 |
| 20120064266 | HOUSING AND METHOD FOR MANUFACTURING HOUSING - A housing includes a substrate; and a corrosion resistance layer deposited on the substrate. The corrosion resistance layer is a cerium oxide doped silicon nitride layer. | 03-15-2012 |
| 20120064363 | COATED ARTICLE AND METHOD OF MAKING THE SAME - A coated article includes a substrate, a catalyst layer, a bonding layer and a hydrophobic layer. The catalyst layer made of tin is formed on the substrate. The bonding layer is formed on the catalyst layer, including titanium, tin, stannic oxide and titanium dioxide. The hydrophobic layer made of silicon-nitrogen is formed on the bonding layer. | 03-15-2012 |
| 20120064364 | COATED ARTICLE - A coated article includes a substrate, and a coating deposited on the substrate that comprises an equal number of alternating densification layers and corrosion resistance layers. The densification layers are made of tin or aluminum; the corrosion resistance layers are made of chromium, niobium, vanadium, zirconium, titanium, or manganese. | 03-15-2012 |
| 20120064366 | HOUSING AND METHOD FOR MANUFACTURING HOUSING - A housing includes a substrate, an aluminum layer deposited on the substrate, and an aluminum oxynitride layer deposited on the aluminum layer. The aluminum layer includes aluminum. The aluminum oxynitride layer includes aluminum, nitride, and oxygen. A method for manufacturing the housing comprises providing a substrate, depositing an aluminum layer on the substrate, and depositing an aluminum oxynitride layer on the aluminum layer. | 03-15-2012 |
| 20120064368 | COATED ARTICLE AND METHOD OF MAKING THE SAME - A coated article includes a substrate, a catalyst layer and a self-cleaning layer. The catalyst layer made of nickel is formed on the substrate. The self-cleaning layer is formed on the catalyst layer, including titanium, nickel, nickel oxide and titanium dioxide. | 03-15-2012 |
| 20120067721 | TARGET ASSEMBLY - A target assembly includes a base comprising a first surface and a second surface opposite to the first surface. The base defining a threaded hole; a magnetron mounted on a first surface; a target movably mounted to the second surface, the target defining an opening corresponding to the threaded hole, the opening including a first end and a second end; and a screw. The screw can slide in the opening from the first end to the second end so the position between magnetron and the target is adjusted to adjust the bombarded area of the target. | 03-22-2012 |
| 20120070653 | COATED ARTICLE AND METHOD FOR MAKING THE SAME - A coated article is provided. The coated article includes a substrate, and an anti-fingerprint layer formed on the substrate. The anti-fingerprint layer is a nano aluminum-oxygen-carbon-nitrogen (Al—O—C—N) layer. A method for making the coated article is also described there. | 03-22-2012 |
| 20120077002 | COATED ARTICLE AND METHOD FOR MAKING THE SAME - A coated article is provided. The coated article includes a substrate, a first anti-fingerprint layer formed on the substrate, and a second anti-fingerprint layer formed on the first anti-fingerprint layer. The first anti-fingerprint layer is a polytetrafluoroethylene layer. The second anti-fingerprint layer is a compound layer of polytetrafluoroethylene and aluminum-oxygen-nitrogen. A method for making the coated article is also described therein. | 03-29-2012 |
| 20120077009 | COATING, ARTICLE COATED WITH COATING, AND METHOD FOR MANUFACTURING ARTICLE - A coating includes a deposited layer. The deposited layer is a zirconium yttrium nitride layer. | 03-29-2012 |
| 20120077024 | HOUSING AND MANUFACTURING METHOD THEREOF - A housing includes a substrate and a nano-composite layer deposited on the substrate. The nano-composite layer includes a number of metal oxide nitride layers and a number of Ce layers. Each metal oxide nitride layer alternates with a Ce layer, and the outermost nano-composite layer is a metal oxide nitride layer. The metal in the metal oxide nitride layer aluminum, titanium, silicon, chromium, or zirconium. | 03-29-2012 |
| 20120088081 | COATED ARTICLE AND METHOD OF MAKING THE SAME - A coated article includes a substrate and a pattern layer formed on the substrate. The pattern layer includes a plurality of strips. Each area of these strips is in a range of about 0.001 mm | 04-12-2012 |
| 20120088083 | COATING, ARTICLE COATED WITH COATING, AND METHOD FOR MANUFACTURING ARTICLE - A coating includes a nano-composite layer including a plurality of stacked films. Each film includes a zirconium nitride layer and a zirconium yttrium nitride layer. | 04-12-2012 |
| 20120090868 | HOUSING AND METHOD FOR MAKING THE SAME - A housing for an electronic device includes a metal substrate and a luminous layer formed on the metal substrate, the luminous layer mainly comprises ZnO mixed with In. The disclosure also described a method to make the housing. | 04-19-2012 |
| 20120094095 | COATED ARTICLE AND METHOD FOR MAKING THE SAME - A coated article is described. The coated article includes a substrate, a combining layer formed on the substrate, a plurality of chromium nitride layers and a plurality of copper-zinc alloy layers formed on the combining layer. The combining layer is a chromium layer. Each chromium nitride layer interleaves with one copper-zinc alloy layer. A method for making the coated article is also described. | 04-19-2012 |
| 20120094096 | COATED ARTICLE AND METHOD FOR MAKING THE SAME - A coated article is described. The coated article includes a substrate, a combining layer formed on the substrate, a plurality of chromium nitride layers and a plurality of copper-titanium alloy layers formed on the combining layer. The combining layer is a chromium layer. Each chromium nitride layer interleaves with one copper-titanium alloy layer. A method for making the coated article is also described. | 04-19-2012 |
| 20120094097 | COATED ARTICLE AND METHOD FOR MAKING THE SAME - A coated article is described. The coated article includes a substrate, a combining layer formed on the substrate, a plurality of titanium dioxide layers and a plurality of copper-zinc alloy layers formed on the combining layer. The combining layer is a titanium layer. Each titanium dioxide layer interleaves with one copper-zinc alloy layer. A method for making the coated article is also described. | 04-19-2012 |
| 20120094098 | COATED ARTICLE AND METHOD FOR MAKING THE SAME - A coated article is described. The coated article includes a substrate, a combining layer formed on the substrate, a plurality of silicon dioxide layers and a plurality of copper-zinc alloy layers formed on the combining layer. The combining layer is a silicon layer. Each silicon dioxide layer interleaves with one copper-zinc alloy layer. A method for making the coated article is also described. | 04-19-2012 |
| 20120094108 | COMPOSITE OF METAL AND RESIN AND MANUFACTURING METHOD THEREOF - A composite of metal and resin includes a metal piece and a resin piece. The metal piece includes a surface. Micropores are formed on the surface. The micropores have inlet diameters smaller than bottom diameters thereof. The resin piece is partially inserted into the micropores to combine with the metal piece. | 04-19-2012 |
| 20120094145 | PROCESS FOR JOINING STAINLESS STEEL PART AND ZIRCONIA CERAMIC PART AND COMPOSITE ARTICLES MADE BY SAME - A process for joining a stainless steel part and a zirconia ceramic part comprising: providing a SUS part, a ZrO | 04-19-2012 |
| 20120100381 | PROCESS FOR JOINING STAINLESS STEEL PART AND SILICON CARBIDE CERAMIC PART AND COMPOSITE ARTICLES MADE BY SAME - A process for joining a stainless steel part and a silicon carbide ceramic part comprising: providing a SUS part, a SiC ceramic part, a Mo foil and a Ti foil; placing the SiC ceramic part, the Mo foil, the Ti foil, and the SUS part into a mold, the Mo foil and the Ti foil located between the SiC ceramic part and the SUS part, the Mo foil abutting the SiC ceramic part, the Ti foil abutting the SUS part and the Mo foil; placing the mold into a chamber of an hot press sintering device, heating the chamber and pressing the SUS part, the SiC ceramic part, the Mo foil, and the Ti foil at least until the SUS part, the SiC ceramic part, the Mo foil and the Ti foil form a integral composite article. | 04-26-2012 |
| 20120100388 | PROCESS FOR JOINING STAINLESS STEEL PART AND TITANIUM CARBIDE CERAMIC PART AND COMPOSITE ARTICLES MADE BY SAME - A process for joining a stainless steel part and a titanium carbide ceramic part comprising: providing a SUS part, a TiC ceramic part, a Ti foil and a Fe foil; placing the TiC ceramic part, the Ti foil, the Fe foil, and the SUS part into a mold, the Ti foil and the Fe foil located between the TiC ceramic part and the SUS part, the Ti foil abutting the TiC ceramic part, the Fe foil abutting the SUS part and the Ti foil; placing the mold into a chamber of an hot press sintering device, heating the chamber and pressing the SUS part, the TiC ceramic part, the Ti foil, and the Fe foil at least until the SUS part, the TiC ceramic part, the Ti foil and the Fe foil form a integral composite article. | 04-26-2012 |
| 20120100389 | COATED ARTICLE AND METHOD FOR MAKING THE SAME - A coated article includes a substrate, an anti-corrosion layer formed on the substrate and a decorative layer formed on the anti-corrosion layer. The substrate is made of aluminum or aluminum alloy. The anti-corrosion layer is an aluminum layer. The coated article has improved corrosion resistance. | 04-26-2012 |
| 20120103819 | ALUMINUM ARTICLE AND PROCESS FOR MAKING SAME - An aluminum article includes a substrate made of aluminum or aluminum alloy, a porous aluminum oxide layer formed on the substrate, and a transparent vacuum coated layer formed on the aluminum oxide layer. The aluminum oxide layer has a top surface and a plurality of pores defined therein. The pores run through the top surface and each pore is formed by peripheral wall and bottom wall. The vacuum coated layer covers the top surface as well as the peripheral walls and bottom walls of the pores, thereby forming a profile corresponding to the aluminum oxide layer. | 05-03-2012 |
| 20120107606 | ARTICLE MADE OF ALUMINUM OR ALUMINUM ALLOY AND METHOD FOR MANUFACTURING - An article includes a substrate made of aluminum or aluminum alloy, an insulating coating formed on the substrate, and an anticorrosive coating formed on the insulating coating. The insulating coating is composed of electrically insulating ceramic material or polymer. The anticorrosive coating is a ceramic coating formed by physical vapor deposition. | 05-03-2012 |
| 20120107640 | PROCESS FOR JOINING CARBON STEEL PART AND SILICON CARBIDE CERAMIC PART AND COMPOSITE ARTICLES MADE BY SAME - A process for joining a carbon steel part and a silicon carbide ceramic part, comprising steps of: providing a carbon steel part, a SiC ceramic part, and a Ni foil; bringing surfaces of the carbon steel part, SiC ceramic part, and Ni foil into contact, with the Ni foil inserted between the carbon steel part and SiC ceramic part; applying a pulsed electric current to the parts to be joined, heating the parts to a joining temperature of about 800-1100° C., and simultaneously applying a joining pressure of about 20-60 MPa to the parts while the current is applied, and maintaining the joining temperature and the joining pressure for about 10-30 minutes. | 05-03-2012 |
| 20120107641 | PROCESS FOR JOINING STAINLESS STEEL PART AND SILICON CARBIDE CERAMIC PART AND COMPOSITE ARTICLES MADE BY SAME - A process for joining a stainless steel part and a silicon carbide ceramic part comprising: providing a SUS part, a SiC ceramic part, a Mo foil and a Ni foil; depositing a nickel coating on a surface of the SiC ceramic part; placing the SiC ceramic part, the Mo foil, the Ni foil, and the SUS part into a mold, the Mo foil and the Ni foil located between the SiC ceramic part and the SUS part; placing the mold into a chamber of an hot press sintering device, heating the chamber and pressing the SUS part with the nickel coating, the SiC ceramic part, the Mo foil, and the Ni foil at least until the SUS part, the SiC ceramic part, the Mo foil and the Ni foil form a integral composite article. | 05-03-2012 |
| 20120107643 | COATED ARTICLE AND METHOD FOR MAKING SAME - A coated article includes a substrate, an anti-corrosion layer formed on the substrate, and a decorative layer formed on the anti-corrosion layer. The substrate is made of magnesium or magnesium alloy. The anti-corrosion layer is a magnesium layer. The coated article has improved corrosion resistance. | 05-03-2012 |
| Patent application number | Description | Published |
|---|
| 20100259900 | HEAT SINK - A heat sink includes a cooling member to dissipate heat, and a fixing member for mounting fasteners. The cooling member includes a base and a number of fins extending from the base. The cooling member and the fixing member are independently formed, and the fixing member is fixed to a bottom of the base of the cooling member via fixing means. | 10-14-2010 |
| 20110069438 | COMPUTER ENCLOSURE - A computer enclosure includes a chassis, a mounting frame, two air-guiding members, and a fan. The chassis includes a ventilation area defining a plurality of ventilation through holes. The mounting frame is fixed to the chassis and faces the ventilation through holes. The mounting frame configured for receiving electronic components. The two air-guiding members respectively connect two opposite sides of the mounting frame to the chassis. The two air-guiding members incline relative to the mounting frame and the chassis to form an air passage. The fan is configured for exhausting air passing through the ventilation through holes and the mounting frame. | 03-24-2011 |
| 20110102998 | DISK DRIVE ASSEMBLY AND ELECTRONIC DEVICE HAVING THE SAME - A disk drive assembly includes a disk drive, a carrier containing the disk drive and a pad. The carrier includes a bottom frame and two opposite sidewalls connected to two opposite edges of the bottom frame. The pad is sandwiched between the disk drive and each of the two sidewalls. | 05-05-2011 |
| 20110228466 | ELECTRONIC DEVICE - An electronic device includes a housing, at least one expansion card, a motherboard and a fixing member. The motherboard is assembled into the housing, and includes at least one socket member. The socket member defines at least one expansion slot to receive the expansion card. The housing includes a bottom plate and a side plate extending substantially perpendicular to the bottom plate. The fixing member is rotatably connected to the side plate. The fixing member resists an end of the expansion card away from the motherboard, such that the fixing member and the motherboard cooperatively defining an airflow channel therebetween. | 09-22-2011 |
| 20110235273 | CASE AND ELECTRONIC DEVICE HAVING THE SAME - A case includes a box, a top cover, a first airflow guide member, and a second airflow guide member. The box has an opening sealed by the top cover. The first airflow guide member and the second airflow guide member are fixed on at least one of the top cover and a side plate of the box. The first airflow guide member and the second airflow guide member are spaced from each other, and cooperatively define a guide channel. The box defines an inlet and an outlet communicating with the guide channel. | 09-29-2011 |
| 20110310567 | HEAT SINK AND ELECTRONIC DEVICE USING THE SAME - An electronic device includes a chassis, a circuit board installed in the chassis, a memory card coupled to the circuit board, and a heat sink for cooling the memory card. The heat sink includes a first cooling plate, a second cooling plate, and a connection member connected between corresponding sides of the first cooling plate and the second cooling plate. A conducting member extends from the connection member, and contacts the chassis. | 12-22-2011 |
| 20110317359 | FAN DUCT FOR ELECTRONIC COMPONENTS OF ELECTRONIC DEVICE - A fan duct includes a top plate, two side plates extending downward from opposite sides of the top plate, and plural guiding plates extending downward from the top plate. The side plates and the top plates cooperatively define an air inlet and an air outlet. The air inlet and the air outlet are located at another two opposite sides of the top plates, respectively. The guiding plates are located between the side plates and adjacent to the air outlet. Each of the guiding plates forms a guiding face facing the air inlet. The guiding face is obliquely oriented with respect to the top plate. An electronic device incorporating the fan duct is also provided. | 12-29-2011 |
| 20120002371 | ELECTRONIC DEVICE WITH HEAT DISSIPATION APPARATUS - An electronic device includes an enclosure, a circuit board disposed within the enclosure, a heat sink, and a thermally conductive member. A heat-generating electronic component is fixed to the circuit board. The heat sink is in contact with the heat-generating electronic component. Two ends of the thermally conductive member are respectively fixed to the enclosure and the heat sink. | 01-05-2012 |
| 20120013188 | POWER SUPPLY SYSTEM AND CONTAINER DATA CENTER INCLUDING THE SAME - A power supply system includes a road electricity generating apparatus, a battery, and a voltage converter. The road electricity generating apparatus is installed in a road. The road electricity generating apparatus includes a number of piezoelectric crystals connected in series to convert potential energy of passing vehicles to electricity. The battery stores the electricity generated by the piezoelectric crystals. The voltage converter converts the electricity of the battery to a desired working voltage for the container data center. | 01-19-2012 |
| 20120013195 | POWER SUPPLY SYSTEM AND CONTAINER DATA CENTER INCLUDING SAME - A power supply system includes a number of aerogenerators, a number of rectifiers, and a direct current to direct current (DC/DC) converter. A first terminal of each rectifier is connected to a corresponding one of the aerogenerators. A first terminal of the DC/DC converter is connected to second terminals of the rectifiers. A second terminal of the DC/DC converter is connected to a power unit of a container data center. Each rectifier converts the alternating current (AC) generated by the corresponding aerogenerator to a pulsating direct current (DC). The DC/DC converter converts the pulsating DC to a constant voltage DC and supplies power to the power unit. | 01-19-2012 |
| 20120020011 | DATA CENTER AND SERVER MODULE OF THE SAME - A data center includes a rack mounted with two first slide rails, a server module arranged in the rack. Two second slide rails are mounted on the top and bottom sidewalls of the server module, to mate with the first slide rails, thereby slidably attaching the server module to the rack. | 01-26-2012 |
| 20120020014 | DATA CENTER AND SERVER MODULE OF THE SAME - A data center includes a server module. The server module includes a housing, and a number of heat-generating elements arranged in the housing. The housing includes a front wall, a back wall, and left and right sidewalls. When the server module runs, cool air comes into the housing through the front wall and the back wall, for cooling the heat elements, then the heated air in the housing is vented out of the housing through the left and right sidewalls by a number of fans. | 01-26-2012 |
| 20120026676 | DATA CENTER - A data center includes a housing, a number of server modules arranged in the housing, a number of cooling units arranged in the housing and above the server modules, and a fan mounted in the housing near the cooling units. When the data center is operating, heated air is driven to the cooling units by fans, and then the cooled air is driven to enter the server modules. | 02-02-2012 |
| 20120026679 | DATA CENTER - A data center includes a housing, a number of heat units arranged in the housing, and a fan mounted in the housing. When the data center runs, cool air comes into the housing through the front wall, the back wall, and the bottom wall of the housing, for cooling the heat units. The heated air is vented out of the housing through the top wall by the fan. | 02-02-2012 |
| 20120031125 | ENERGY-SAVING SYSTEM AND CONTAINER DATA CENTER INCLUDING THE SAME - An energy-saving system includes first and second infrared emitters, first and second infrared receivers, an air conditioner, and a controller. The infrared receivers send out detecting signals when the infrared receivers do not receive infrared signals of the infrared emitters. The controller controls the air conditioner to adjust temperature in a container data center according to the order of receiving the detecting signals of the first infrared receiver and the second infrared receiver. | 02-09-2012 |
| 20120035769 | SYSTEM AND METHOD FOR CONTROLLING AN ELECTRONIC DEVICE FAN - An electronic device and a method for controlling fan speed of the electronic device include setting a speed range corresponding to a variety of pulse-width modulation (PWM) duty cycles of the fan, and setting a speed variation value of the fan. The method further includes reading the PWM duty cycle and detecting an actual speed of the fan, and adjusting the PWM duty cycle in the PWM duty cycle instruction according to the speed variation value. | 02-09-2012 |
| 20120035782 | SYSTEM AND METHOD FOR COOLING AN ELECTRONIC DEVICE - An electronic device and a method for controlling heat reflux of the electronic device include setting a speed decrease value and standard temperatures for each of the first device and the second device. The control method further includes detecting a working temperature of the second device using a temperature sensor of the electronic device, if a speed of the second fan is at a full speed. The control method further includes reducing a speed of the first fan according to the speed decrease value, if the speed of the second fan is at the full speed and the detected working temperature exceeds the standard temperature of the second device. | 02-09-2012 |
| 20120041597 | FAN SPEED CONTROL SYSTEM AND METHOD - A fan speed control system includes a fan, a hardware device, and a basic input/output system (BIOS) module. The BIOS module includes a memory unit, an initial power detecting unit, a searching unit, and a control unit. The memory unit stores a matching table between of initial power ranges and corresponding fan speed control curves. The initial power detecting unit is operable to detect the initial power of the hardware device. The searching unit is operable to read the matching table and search which fan speed control curve matches with the initial power of the hardware device. The control unit is operable to select the matching fan speed control curve to control a speed of the fan. | 02-16-2012 |
| 20120041614 | FAN SPEED CONTROL SYSTEM AND METHOD - A fan speed control system includes a fan, a hardware device, and a basic input/output system (BIOS) module. The BIOS module includes a memory unit, an edit unit, a searching unit, and a control unit. The memory unit stores a matching table of different hardware device numbers and corresponding fan speed control curves. The edit unit is operable to edit the matching table. The searching unit is operable to read the matching table and search which fan speed control curve matches with the hardware device number of the hardware device. The control unit is operable to select the matched fan speed control curve to control the fan speed of the fan. | 02-16-2012 |
| 20120041615 | FAN SPEED CONTROL SYSTEM - A fan speed control system includes a fan, a hardware device, a switch code module, and a basic input/output system (BIOS) module. The switch code module is operable to set a switch code. The BIOS module includes a memory unit, a switch code detecting unit, a searching unit, and a control unit. The memory unit stores a matching table of different switch codes and corresponding fan speed control curves. The switch code detecting unit is operable to detect the switch code set by the switch code module. The searching unit is operable to read the matching table and search which fan speed control curve matches with the switch code set by the switch code module. The control unit is operable to select the matched fan speed control curve to control the fan speed of the fan. | 02-16-2012 |
| 20120043287 | DATA CENTER - A data center includes a rack, and a server module installed in the rack. The server module includes a top surface, a bottom surface, and left and right surfaces. A number of closing members are positioned on the top surface, the bottom surface, and the left and right surfaces of the server module. The closing members resist against the rack to close the interstices between the rack and the server module, to avoid hot air vented from the server module flowing back through the interstice. | 02-23-2012 |
| 20120045982 | CONTAINER DATA CENTER - A container data center includes a container, a partition member received in the container, and a number of non-powered turbines installed on the top wall of the container. The container includes a top wall, a bottom wall opposite to the top wall, and a sidewall connected between the top wall and the bottom wall. The sidewall defines a number of vents. The partition member includes a first partition plate adjacent to the top wall of the container and a second partition plate extending down from sides of the first partition plate to connect to the bottom wall of the container. An air channel is formed between the partition member and the container. The cool air outside the container can flow into the air channel through the number of vents, and the hot air of the air channel flows out of the container through the number of non-powered turbines. | 02-23-2012 |
| 20120055940 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure of an electronic device includes a bottom wall and a sidewall. The sidewall includes at least two non-coplanar portions. Each of the non-coplanar portions defines a plurality of through holes for heat dissipation. | 03-08-2012 |
| 20120063082 | DATA CENTER - A data center includes a housing and a number of server module assemblies received in the housing. Airflow interspaces are formed between neighboring server module assemblies, and between the two outmost server module assemblies and corresponding sidewalls of the housing. The airflow interspaces are alternately used for cold aisles and hot aisles. An inside of each server module is communicated with one of the hot aisles and one of the cold aisles at opposite sides of the server module. A number of cooling units are installed in the housing over the server module assemblies. A number of fans are installed in the housing to draw hot air from the hot aisles to flow through the corresponding cooling units to be cooled, and the cooled air flow into the corresponding cold aisles, thereby creating air differences in air pressure between the cold aisles and the hot aisles. | 03-15-2012 |
| 20120063083 | SERVER SYSTEM WITH HEAT DISSIPATING DEVICE - An exemplary server system includes a server cabinet, two rows of racks arranged in the server cabinet, a number of servers mounted in the racks and a heat dissipating device. The server cabinet includes two side plates parallel to each other. The servers of each row are evenly distributed between the side plates. A channel is defined between the two rows of racks. The heat dissipating device includes an air conditioner arranged over the racks for generating cooling air and an air guiding mechanism. The air conditioner defines a number of apertures facing the passage. The guiding mechanism includes a number of tubes received in the passage and respectively coupled to the apertures of the air conditioner. Each of the tubes defines a number of air outlets for exhausting the cooling air towards the servers. | 03-15-2012 |
| 20120063086 | ELECTRONIC DEVICE - An electronic device includes a chassis, a blower, a first block, and a second block. The chassis includes a top surface and a bottom surface parallel to the top surface. The blower is received in the chassis. The blower includes an upper surface, a lower surface parallel to the upper surface, and an outlet defined between the upper surface and the lower surface. The first block is disposed between the upper surface and the top surface to seal a gap between the upper surface and the top surface. The second block is disposed between the lower surface and the bottom surface to seal a gap between the lower surface and the bottom surface. | 03-15-2012 |
| 20120067552 | CONTAINER DATA CENTER - A container data center includes a container having a top wall and a number of sidewalls, a water supply pipe arranged over the top wall, a gutter disposed adjacent to a bottom of the container, a cistern communicating with the gutter, a water pump connected between the cistern and the water supply pipe, and a cooler mounted to an end of the water supply pipe connected to the water pump. An inlet and an outlet of the water pump are correspondingly connected to the cistern and water supply pipe. The water supply pipe defines a number of water discharge holes. | 03-22-2012 |
| 20120069512 | POWER SUPPLY SYSTEM AND CONTAINER DATA CENTER INCLUDING SAME - A power supply system provides power to a container data center. The power supply system includes a solar energy panel, to receive solar energy and output a direct current (DC) voltage. A direct current to altering current (DC/AC) voltage converting unit is connected to the solar energy panel, to receive the DC voltage from the solar energy panel and converts the received DC voltages to an AC voltage, and outputs the converted AC voltage to the container data center. | 03-22-2012 |
| 20120075794 | CONTAINER DATA CENTER WITH POWER SUPPLY SYSTEM - A container data center includes a power storage device, a power distribution device, a number of server systems, a portable container, and a number of power supply systems each connected between two opposite server systems in two rows. The power supply system includes a blower, a number of wind turbines, and a generator. Cooled air is blown to rotate the wind turbines by the blower, to generate mechanical energy. The generator receives the mechanical energy from the wind turbines and converts the received mechanical energy to electricity, and provides the converted electricity to the power storage device or the power distribution device. | 03-29-2012 |
| 20120092831 | HEAT DISSIPATION STRUCTURE FOR PORTABLE ELECTRONIC DEVICE - A heat dissipation structure for removing heat generated by electronic elements of a portable electronic device includes a base unit for mounting the electronic elements thereon and a heat dissipation unit detachably mounted on the base unit. The heat dissipation unit includes a base board and a number of thermal fins connected to the base board. The base board defines a receiving space therein, and a depth of the receiving space is larger than a thickness of each electronic element. The base board covers the electronic elements and the receiving space receives the electronic elements therein, such that heat generated by the electronic elements is transmitted to the thermal fins through the base board and dissipated by the thermal fins. | 04-19-2012 |
| 20120097375 | FAN SYSTEM FOR ELECTRONIC DEVICE - A fan system for dissipating heat generated in an electronic device includes a processor unit, a speedometer unit connected to the processor unit, a governor unit connected to the processor unit, and a fan group including at least two fans. Each fan is connected to the speedometer unit and the governor unit and has at least two motors. The processor unit controls all the motors to rotate and thereby drives all the fans to rotate through the governor unit, and detects rotation speeds of all the motors through the speedometer unit. When a motor malfunctions, the processor unit adjusts the rotation speeds of all other motors to ensure that the fan having the malfunctioning motor and other fans are respectively provided with equal power and then rotate in equal speeds. | 04-26-2012 |
| 20120100793 | CONTAINER DATA CENTER - A container data center includes a housing for arranging servers therein, and an air purifier. The air purifier includes a hollow filtering barrel, an air outlet pipe connected between the filtering barrel and the housing, and an exhaust fan. The exhaust fan draws air from the filtering barrel through the air outlet pipe and exhausts air into the housing. | 04-26-2012 |
| 20120107120 | COOLING FAN AND ROTOR OF COOLING FAN - A cooling fan includes a frame and a rotor received in the frame. The rotor includes a hub, blades extending outwardly and radially from the hub, and a cover plate connected with the hub. The hub includes a top wall and a sidewall extending from a circumference of the top wall. The top wall of the hub defines a plurality of blind holes on an outer surface thereof, and the blind holes are shaded by the cover plate. | 05-03-2012 |
