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Chang-Sheng
Chang-Sheng Chen, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20100314233 | HIGH-FREQUENCY SWITCH IN MULTI-LAYER SUBSTRATE - A switch module consists of a build-up multi-layer structure and some passive devices. The build-up multi-layer structure has multitudes of conductive layers and dielectric layers laminated upon each another. At least one dielectric layer is interfered between any two conductive layers. Any one passive device is a portion of at least one conductive layer and electrically connects multitudes of conductive pads on the surface of the build-up multi-layer structure. | 12-16-2010 |
Chang-Sheng Chen, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090015488 | HIGH DIELECTRIC ANTENNA SUBSTRATE AND ANTENNA THEREOF - A high dielectric antenna substrate includes a first dielectric layer having a first dielectric constant, and a second dielectric layer having a second dielectric constant. The second dielectric layer is formed on one surface of the first dielectric layer. The second dielectric constant is lower than the first dielectric constant. Furthermore, a first metal layer and a second metal layer are optionally formed on the same surface or two surfaces of the first dielectric layer to compose a capacitor. | 01-15-2009 |
| 20090051469 | MULTI-FUNCTIONAL COMPOSITE SUBSTRATE STRUCTURE - A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are interlaced above the third substrate. One or more permeance blocks may be formed above each substrate, so that one or more inductors may be fabricated thereon. One or more capacitors may be fabricated on the first substrate. Also, one or more signal transmission traces of the system impedance are formed on the second substrate of the outside layer. Therefore, the inductance of the inductor(s) is effectively enhanced. Moreover, the area of built-in components is reduced. Furthermore, it has shorter delay time, smaller dielectric loss, and better return loss for the transmission of high speed and high frequency signal. | 02-26-2009 |
| 20100226112 | MIRROR IMAGE SHIELDING STRUCTURE - A mirror image shielding structure is provided, which includes an electronic element and a ground shielding plane below the electronic element. The shape of the ground shielding plane is identical to the projection shape of the electronic element, and the horizontal size of the ground shielding plane is greater than or equal to that of the electronic element. Thus, the parasitic effect between the electronic element and the ground shielding plane is effectively reduced, and the vertical coupling effect between electronic elements is also reduced. Furthermore, the vertical impact on the signal integrity of the embedded elements caused by the layout of the transmission lines is prevented. | 09-09-2010 |
| 20100259338 | High frequency and wide band impedance matching via - A high frequency and wide band impedance matching via is provided, applicable to multi-layer printed circuit boards, for example. The multi-layer circuit board may include several signal transmission traces, several ground layers, signal transmission vias and ground vias. The signal transmission traces and the ground layers may be sited on different circuit layers, and each signal transmission trace may be opposite to one of the ground layers. The signal transmission vias may be connected between the signal transmission traces. The ground vias may be connected between the ground layers. The ground vias may be opposite to the signal transmission vias, and the ground vias corresponding to the signal transmission vias may be sited to stabilize the characteristic impedance of the transmission traces. | 10-14-2010 |
Chang-Sheng Chen, Hsinchu City TW
Chang-Sheng Hsu, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110169139 | CHIP PACKAGE AND FABRICATION METHOD THEREOF - A chip package and a fabrication method thereof are provided. The chip package includes a semiconductor substrate, having a first surface and an opposite second surface. A through hole is formed on the first surface, extending from the first surface to the second surface. A conductive trace layer is formed on the first surface and in the through hole. A buffer plug is formed in the through hole and a protection layer is formed over the first surface and in the through hole. | 07-14-2011 |
Chang-Sheng Lin, Taichung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100080717 | Fan motor for combustion-powered tool - A fan motor is adapted to be mounted in a combustion-powered tool. The combustion-powered tool has a housing. The fan motor includes a fan unit, a motor for driving the fan unit, a vibration-absorbing unit, and a clamping unit. The vibration-absorbing unit includes a rigid support that is adapted to be mounted fixedly in the housing of the combustion-powered tool, and an elastic member sleeved over the motor and molded on the rigid support such that the rigid support is disposed around the elastic member. The elastic member is disposed between the rigid support and the motor for absorbing vibrations generated by the motor. The clamping unit includes at least one clamping member sleeved over the elastic member for clamping and retaining the elastic member on the motor. | 04-01-2010 |
| 20100237127 | OSCILLATION REDUCING SUSPENSION DEVICE FOR A FAN MOTOR OF A COMBUSTION-POWERED TOOL - An oscillation reducing suspension device for a fan motor of a combustion-powered tool includes a rigid axial-play setting unit mounted on an upper major surface of a cylinder head, and having upper and lower limit defining members that are spaced apart from each other by an axial play route, a suspending mount configured to keep the fan motor oriented in a rotary axis, and having a lug which extends radially into the axial play route to divide the axial play route into proximate and distal regions, and an elastomeric damper unit having upper and lower damping members respectively disposed in the distal and proximate regions. By virtue of the rigid mount supporting the fan motor, and the resilient damper unit coupling the mount and the cylinder head, the fan motor is firmly secured to the cylinder head, and axial oscillation of the fan motor is reduced. | 09-23-2010 |
Chang-Sheng Lin, Taoyuan County TW
| Patent application number | Description | Published |
|---|---|---|
| 20090169921 | SYNTHESIS OF TRIPHENYLENE AND PYRENE BASED AROMATICS AND THEIR APPLICATION IN OLEDS - The present invention provides a compound of the general formula | 07-02-2009 |