| Patent application number | Description | Published |
|---|
| 20080197967 | Circuit boards with embedded resistors - The present invention relates to an adjustable resistor embedded in a circuit board and a method of fabricating the same. The adjustable resistor comprises a resistor with a number of connection terminals, and a number of via holes extending to contact with the resistor. The resistive value of the resistor is variable depending on the size of the via holes, the number of the via holes, or the distance between the via holes. | 08-21-2008 |
| 20080258862 | RESISTOR LAYOUT STRUCTURE AND MANUFACTURING METHOD THEREOF - A resistor layout structure and a manufacture method thereof are provided. The resistor layout structure includes a substrate, a plurality of metals, and a plurality of resistor lumps. The plurality of metals is disposed on the substrate. The plurality of first resistor lumps is disposed on the substrate. The metals are used as a supporting structure during the disposing process. Besides, the metals are interlaced and connected in series connected with the resistor lumps to form the resistor. Therefore, the present invention decreases the resistance variability of the resistor. | 10-23-2008 |
| 20080290984 | EMBEDDED RESISTOR DEVICES - An embedded resistor device includes a resistor, a ground plane located near a first side of the resistor and electrically coupled to a first end of the resistor, at the ground plane a hole is provided, a first dielectric layer exists between the resistor and the ground plane, a conductive wire, which is electrically coupled to a second end of the resistor different from the first end of the resistor and partially surrounds the resistor, is used as an auxiliary for supporting a resistor-coating process of the resistor and to provide a terminal of the embedded resistor device at the conductive wire, a conductive region located near a second side of the ground plane different from the first side of the resistor, a second dielectric layer exists between the ground plane and the conductive region, and a conductive path to electrically couple the conductive wire to the conductive region through the hole. | 11-27-2008 |
| 20080297298 | TUNABLE EMBEDDED INDUCTOR DEVICES - The invention provides tunable embedded high frequency inductor devices. The inductor device comprises a dielectric substrate. A first conductive line is disposed on a first surface of the dielectric substrate. A second conductive line is disposed on a second surface of the dielectric substrate. An interconnection is disposed perforating the dielectric substrate and connecting the first conductive line with the second conductive line. A coupling region is defined between the first and the second conductive lines. A conductive plug connecting the first conductive line and the second line is disposed in the coupling region. Alternatively, an opening is disposed in the first and second conductive lines to tune inductance of the inductor. | 12-04-2008 |
| 20090045904 | INTER-HELIX INDUCTOR DEVICES - The invention is directed to inter-helix inductor devices. The inter-helix inductor device includes a dielectric substrate. An input end is disposed on the first surface of the dielectric substrate. A clockwise winding coil has one end connecting to the input end and at least one winding turn through the dielectric substrate. A counter clockwise winding coil includes at least one winding turn through the dielectric substrate, wherein the clockwise and counter clockwise winding coils are connected by an interconnection. An output end is disposed on the dielectric substrate, connects one end of the counter clockwise winding coil, and is adjacent to the input end. | 02-19-2009 |
| 20090058589 | SUSPENSION INDUCTOR DEVICES - Suspension inductor devices are provided. A suspension inductor device includes a dielectric substrate and a suspension induction coil. The suspension induction coil includes an input end disposed on the dielectric substrate. A spiral coil is wound from the dielectric substrate to an interconnection. The interconnection is disposed in the spiral coil and connects the input end and the spiral coil. An output end is disposed on the dielectric substrate and adjacent to the input end. | 03-05-2009 |
| 20090072942 | MEANDER INDUCTOR AND SUBSTRATE STRUCTURE WITH THE SAME - A meander inductor is disclosed, the inductor is disposed on a substrate or embedded therein. The meander inductor includes a conductive layer composed of a plurality of sinusoidal coils with different amplitudes and in series connection to each other, wherein the sinusoidal coils with different amplitudes are laid out according to a periphery outline. The profile of the meander inductor is designed according to an outer frame range available for accommodating the meander inductor and is formed by coils with different amplitudes. Therefore, under a same area condition, the present invention enables the Q factor and the resonant frequency fr of the novel inductor to be advanced, and further expands the applicable range of the inductor. | 03-19-2009 |
| 20090268369 | CAPACITOR STRUCTURE WITH RAISED RESONANCE FREQUENCY - A capacitor structure is provided. In the capacitor structure, a signal electrode plate and an extension ground electrode plate are disposed on the same plane to form a co-plane capacitor structure. Due to slow wave characteristic, the resonance frequency of the capacitor structure is effectively raised and the capacitor structure may be applied in high frequency. | 10-29-2009 |
| 20100026420 | BAND-PASS FILTER CIRCUIT AND MULTI-LAYER STRUCTURE AND METHOD THEREOF - A band-pass filter includes a plurality of resonators, a feedback capacitive device and a grounding inductance device. A first end of each resonator is connected to a first node, and a second end of each resonator is connected to a second node. The feedback capacitive device is formed on the feedback circuit from the first node to the second node. The grounding inductance device is connected to the second node and ground. In an embodiment, the resonator essentially consists of a capacitive device and an inductance device. | 02-04-2010 |
| 20110063067 | Inter-Helix Inductor Devices - The invention is directed to inter-helix inductor devices. The inter-helix inductor device includes a dielectric substrate. An input end is disposed on the first surface of the dielectric substrate. A clockwise winding coil has one end connecting to the input end and at least one winding turn through the dielectric substrate. A counter clockwise winding coil includes at least one winding turn through the dielectric substrate, wherein the clockwise and counter clockwise winding coils are connected by an interconnection. An output end is disposed on the dielectric substrate, connects one end of the counter clockwise winding coil, and is adjacent to the input end. | 03-17-2011 |
