| Patent application number | Description | Published |
|---|
| 20090189269 | Electronic Circuit Package - A electronic circuit package having a flexible substrate with metals layers on one or more of its surfaces forming a wiring pattern and/or surface mount bonding pads. Passive electronic components are integrated onto component packages that are mounted to the flexible substrate and electrically connected with the wiring pattern or bonding pad. An active electronic device is mounted on the flexible substrate or bonding pad. | 07-30-2009 |
| 20090243046 | Pulse-Laser Bonding Method for Through-Silicon-Via Based Stacking of Electronic Components - There is described a method of forming a through-silicon-via to form an interconnect between two stacked semiconductor components using pulsed laser energy. A hole is formed in each component, and each hole is filled with a plug formed of a first metal. One component is then stacked on another component such that the holes are in alignment, and a pulse of laser energy is applied to form a bond between the metal plugs. | 10-01-2009 |
| 20090294916 | BONDING METHOD FOR THROUGH-SILICON-VIA BASED 3D WAFER STACKING - There is described a hybrid bonding method for through-silicon-via based wafer stacking. Patterned adhesive layers are provided to join together adjacent wafers in the stack, while solder bondng is used to electrically connect the vias. The adhesive layers are patterned to enable outgassing and to provide stress relief. | 12-03-2009 |
| 20090294931 | Methods of Making an Electronic Component Package and Semiconductor Chip Packages - An electronic component package having an EMI shielded space is disclosed. The package comprises a substrate having an electronic component located on its surface and a conductive enclosure having a top and downwardly extending sides enclosing the component and defining a shielded space. A vent opening is provided through the substrate and is located in the shielded space for venting the shielded space. A second vent opening may be provided in the top of the conductive enclosure. | 12-03-2009 |
| 20100246141 | ELECTRONIC PACKAGE AND METHOD OF FABRICATION THEREOF - One aspect of the present invention provides an electronic package, comprising at least a first module and a second module arranged on top of the first module, the modules together in the form of a module stack, wherein the first and second modules are adhesively connected together, each module includes a substrate layer having at least one metal layer, at least one die and a plastic(s) package molding compound layer molded over said die or dice, in each module the die or dice are bonded on said substrate layer via the metal layer, a plurality of channels formed generally vertically acting as vias to connect the metal layers and arranged adjacent to the die or dice in at least one of the modules, some or all the channels provided with an inner surface coated with a conductive material layer or filled with a conductive material for electrical connection whereby the dice are electrically connected together, and means serving as an intermediary for providing electrical, mechanical and thermal connectivity, communication externally and connected to the channels. | 09-30-2010 |
| 20110037349 | APPARATUS AND METHOD FOR GENERATING ELECTRICITY USING PIEZOELECTRIC MATERIAL - An apparatus and method for generating electricity using piezoelectric material. The apparatus comprises a first elongate member and a second elongate member that are joining together at first and second points which are spaced apart from each other. The second elongate member comprises a piezoelectric element, or has a piezoelectric element mounted thereon. When pressure is applied to the first elongate member, the second elongate member is stretched and the stretching force is applied to the piezoelectric element. This generates electricity. A similar arrangement with a third elongate member may be provided on the other side of the second elongate member. The apparatus may be placed in a shoe or underneath a floor, so that the variation in pressure caused by walking may be used in generate electricity. | 02-17-2011 |
