| Patent application number | Description | Published |
|---|
| 20100127290 | LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF - The present invention relates to a light emitting diode package and a manufacturing method thereof. | 05-27-2010 |
| 20100227424 | LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF - The present invention relates to a light emitting diode package and a manufacturing method thereof. | 09-09-2010 |
| 20100283382 | White light emitting device - A white light emitting device including: a blue light emitting diode (LED); a green silicate phosphor formed on the blue LED; and a red sulfide phosphor with a surface coated with a silicone oxide layer, the red sulfide phosphor formed on the blue LED. | 11-11-2010 |
| 20110031521 | COMPOSITE PHOSPHOR POWDER, LIGHT EMITTING DEVICE USING THE SAME AND METHOD FOR MANUFACTURING COMPOSITE PHOSHPOR POWDER - The invention provides a high quality composite phosphor powder which ensures diversity in emission spectrum, color reproduction index, color temperature and color, a light emitting device using the same and a method for manufacturing the composite phosphor powder. The composite phosphor powder comprises composite particles. Each of the composite particles includes at least two types of phosphor particles and a light transmitting binder. The phosphor particles have different emission spectrums. In addition, the light transmitting binder is formed between the phosphor particles and binds them together. | 02-10-2011 |
| 20110248299 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME - The present invention relates to a light emitting diode package and a method of fabricating the same capable of uniformly distributing a fluorescent substance in a molding member by including a light emitting diode chip on a package substrate and the molding member having a molding resin, a fluorescent substance and nano particles, which is arranged on the package substrate, with covering the light emitting diode chip. | 10-13-2011 |
| 20110260192 | LIGHT-EMITTING DIODE PACKAGE USING A LIQUID CRYSTAL POLYMER - A light emitting diode (LED) package using a liquid crystal polymer, includes: a package main body formed by using a liquid crystal polymer; a lead frame formed on the package main body; an LED chip mounted on the lead frame; and a resin packaging unit encapsulating the LED chip, the resin packaging unit including phosphors. The LED package is highly reliable. | 10-27-2011 |
| 20110266584 | WHITE LIGHT EMITTING DIODE WITH YELLOW, GREEN AND RED LIGHT EMITTING PHOSPHORS - Provided is a white light emitting diode (LED) including a blue LED chip; and yellow, green, and red light emitting phosphors that are coated on the blue LED chip at a predetermined mixing ratio and converts light, emitted from the blue LED chip, into white light. | 11-03-2011 |
| 20110303940 | LIGHT EMITTING DEVICE PACKAGE USING QUANTUM DOT, ILLUMINATION APPARATUS AND DISPLAY APPARATUS - There is provided a light emitting device package using a quantum dot, an illumination apparatus and a display apparatus. The light emitting device package includes a light emitting device; a sealing part disposed in a path of light emitted from the light emitting device and having a lens shape; and a wavelength conversion part sealed within the sealing part and including a quantum dot. The light emitting device package uses the quantum dot as the wavelength conversion part to thereby achieve superior color reproducibility and light emission efficiency, and facilitates the control of color coordinates by adjusting the particle size and concentration of the quantum dot. | 12-15-2011 |
