| Patent application number | Description | Published |
|---|
| 20090255722 | Printed circuit board having landless via hole and method of manufacturing the same - This invention relates to a printed circuit board having a landless via hole, including a circuit pattern formed on a via made of a first metal and having a line width smaller than the diameter of the via hole, in which the circuit pattern includes a seed layer made of a second metal and a plating layer made of a third metal, which is different from the second metal, and to a method of manufacturing the same. In the printed circuit board, the via has no upper land, thus making it possible to finely form the circuit pattern which is connected to the via, thereby realizing a high-density circuit pattern. | 10-15-2009 |
| 20090260868 | Printed circuit board and method of manufacturing the same - The printed circuit board includes the via formed with the electroplating layer unlike a conventional via formed with an electroless plating layer and an electroplating layer and having a cylindrical shape, and thus exhibits good interlayer electrical connection and high reliability of physical contact upon thermal stress caused by the variance in physical properties of material depending on changes in temperature. The via has no upper land, and thus a fine circuit pattern of the circuit layer can be formed on the via. | 10-22-2009 |
| 20090288872 | Printed circuit board including outmost fine circuit pattern and method of manufacturing the same - Disclosed herein is a printed circuit board including an outmost fine circuit pattern. In the board, an end of a via, which has the minimum diameter, is connected to the outmost circuit layer of a substrate. The end surface, having the minimum diameter, is positioned at the outmost layer, so that the outmost circuit layer of the substrate, which needs to have a relatively high density in order to mount chips, compared to other circuit layers, can be more finely formed. | 11-26-2009 |
| 20090294164 | Printed circuit board including landless via and method of manufacturing the same - Disclosed herein is a printed circuit board including a landless via and a method of manufacturing the printed circuit board. The printed circuit board includes a landless via having no upper land. The via includes a circuit pattern having a line width smaller than the minimum diameter of the via. The via does not have an upper land on an end surface thereof having the minimum diameter, and thus a circuit pattern connected to the via is finely formed, resulting in the high-density circuit pattern. Thus, a compact printed circuit board having a reduced number of layers is realized. | 12-03-2009 |
| 20110138615 | CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME - Disclosed herein is a carrier for manufacturing a printed circuit board, including: a magnetic sheet; and a metal layer attached to at least one side of the magnetic sheet by magnetic properties of the magnetic sheet. The carrier is advantageous in that its structure can be simplified without performing a vacuum or releasing process at the time of the attachment and separation of the carrier, thus reducing process cost and process time and maintaining the size of a printed circuit board. | 06-16-2011 |
| 20110138621 | CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME - Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities. | 06-16-2011 |
| 20110139858 | CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME - Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities. | 06-16-2011 |
| 20110180205 | CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME - Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing to the carrier and maintaining the compatibility between the substrate and manufacturing facilities. | 07-28-2011 |
