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Chang-Bae Lee
Chang-Bae Lee, Gwacheon-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110032390 | DIGITAL PHOTOGRAPHING APPARATUS AND MOVING PICTURE CAPTURING METHOD PERFORMED BY THE SAME - A digital photographing apparatus and a moving picture capturing method performed by the same, and more particularly to, a removal of noise of a digital photographing apparatus from sound of a moving picture when the moving picture is being captured. The method of photographing a moving picture performed by a digital photographing apparatus, the method including: executing a moving picture shooting mode; generating an operation control signal; operating the digital photographing apparatus according to the operation control signal; extracting an offset sound corresponding to the operation control signal; and combining a noise generated by the operation of the digital photographing apparatus and the offset sound. | 02-10-2011 |
| 20110091197 | OPTICAL ASSEMBLY AND PHOTOGRAPHING APPARATUS INCLUDING THE SAME - An optical assembly and/or a photographing apparatus including a lens mounting member on which at least one lens is mounted; a transfer portion for moving the lens mounting member; a guide member for guiding a movement of the lens mounting member; a base member on which the transfer portion and the guide member are arranged; and a lens cap apparatus having at least one barrier for opening and closing an optical path passing through the at least one lens, wherein the lens cap apparatus is configured to open and close the barrier by contact with the guide member when the lens cap apparatus is moved closer to or farther from the base member. | 04-21-2011 |
Chang-Bae Lee, Suwon-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100166402 | LENS BARREL ASSEMBLY AND CAMERA INCLUDING THE SAME - A lens barrel assembly and a camera including the lens barrel assembly are provided. The lens barrel assembly includes a barrel case accommodating at least one optical lens, and a flexible printed circuit board (FPCB) configured to transmit signals between an area inside of the barrel case and an area outside of the barrel case. The barrel case comprises an outlet slit formed in the barrel case. The outlet slip being configured for extending the flexible printed circuit board to the area outside of the barrel case. Accordingly, the lens barrel assembly has an improved extension structure for extending the flexible printed circuit board which is configured to transmit signals between the inside and the outside of the lens barrel assembly. | 07-01-2010 |
| 20100166417 | CAMERA HAVING DETACHABLE LENS MODULE - A camera having a detachable lens is provided. More particularly, the camera includes a main body and a lens module configured so that it can be mounted to or detached from the main body according to a rotating state of the lens module with respect to the main body. The camera also includes a first coupling structure that is configured to provide the lens module with coupling when the lens module is set to a mounting position. The camera also includes a secondary coupling structure that is configured to provide the lens module with temporary coupling when the lens module is set to a detaching position. As a result of this structure, an unwanted dropping of the lens module due to an instant loss of supporting force when the lens module is detached from the main body may be prevented. | 07-01-2010 |
Chang-Bae Lee, Daegu KR
| Patent application number | Description | Published |
|---|---|---|
| 20080221299 | Aromatic Polyamide Filament and Method of Manufacturing the Same - Disclosed are wholly aromatic polyamide filament and a method of manufacturing the same, characterized in that, in a process of preparing wholly aromatic polyamide polymer, a multiple tubular feed pipe for polymeric monomer and polymerization solvent with specific construction of adjacent inner paths | 09-11-2008 |
| 20090253890 | AROMATIC POLYAMIDE FILAMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed are wholly aromatic polyamide filament and a method of manufacturing the same, characterized in that, in a process of preparing wholly aromatic polyamide polymer, a multiple tubular feed pipe for polymeric monomer and polymerization solvent with specific construction of adjacent inner paths | 10-08-2009 |
| 20100077717 | METHOD OF FOLDING FILAMENT AND BUNDLE OF FILAMENT MANUFACTURED THEREOF - Disclosed are a method of folding multiple filaments and a bundle of filament produced by the same. More particularly, the method of folding multiple filaments includes release-winding the filaments under a uniform release-winding tension, folding the released filaments in non-twisted states and winding the folded filaments to produce a bundle of filament, so as to effectively prevent some of the filaments in the bundle of filament from hanging down or becoming loose due to different tensions when the bundle of filament is release-wound for post processing. The bundle of filament includes a plurality of filaments folded together in non-twisted states and has a standard deviation in weight of the filaments per unit length of the bundle of filament ranging from 0.0001 to 0.01. | 04-01-2010 |
| 20100129655 | RIPCORD OF OPTIC CABLES AND METHOD OF MANUFACTURING THE SAME - Disclosed are a ripcord for optic cable and a method of manufacturing the same. The ripcord for optic cable has a coating layer formed by applying a coating solution, which includes a binder and a colorant dispersed in the binder, to a surface of a folded and twisted yarn formed by folding and twisting together wholly aromatic polyamide filaments. | 05-27-2010 |
Chang-Bae Lee, Yongin-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110298102 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A semiconductor package and a method of manufacturing the semiconductor package are disclosed. A semiconductor package in accordance with an embodiment of the present invention includes a substrate, which is formed with a ground circuit and mounted with a semiconductor chip on one surface, a conductive ground layer, which is formed on the other surface of the substrate and connected with the ground circuit, a molding, which seals up the ground layer and the substrate having the semiconductor chip mounted thereon, and a conductive shield, which covers the molding and is connected with the ground layer. With a semiconductor package in accordance with an embodiment of the present invention, grounding for shielding is possible even in an entirely molded structure, and a double shielding structure to improve the shielding property. | 12-08-2011 |