| Patent application number | Description | Published |
|---|
| 20080217658 | ELECTRICAL ANTIFUSE WITH INTEGRATED SENSOR - The present invention provides structures for antifuses that utilize electromigration for programming. By providing a portion of antifuse link with high resistance without conducting material and then by inducing electromigration of the conducting material into the antifuse link, the resistance of the antifuse structure is changed. By providing a terminal on the antifuse link, the change in the electrical properties of the antifuse link is detected and sensed. Also disclosed are an integrated antifuse with a built-in sensing device and a two dimensional array of integrated antifuses that can share programming transistors and sensing circuitry. | 09-11-2008 |
| 20080232150 | Method and Structure for Implementing a Reprogrammable ROM - A method and structure implementing a reprogrammable read only memory (ROM) include a pair of fuse elements having different lengths and selectively arranged to define an initial bit state. A group of a plurality of the pairs of fuse elements defines a predetermined data pattern of ones and zeros, providing initial states stored in the reprogrammable ROM. The reprogrammable ROM is reprogrammed when needed by selectively blowing a selected fuse or selected fuses to change the data pattern stored in the ROM. | 09-25-2008 |
| 20080232152 | Method and Structure for Implementing a Reprogrammable ROM - A method and structure for implementing a reprogrammable read only memory (ROM), and a design structure on which the subject circuit resides are provided. A pair of fuse elements having different lengths are selectively arranged to define an initial bit state. A group of a plurality of the pairs of fuse elements defines a predetermined data pattern of ones and zeros, providing initial states stored in the reprogrammable ROM. The reprogrammable ROM is reprogrammed when needed by selectively blowing a selected fuse or selected fuses to change the data pattern stored in the ROM. | 09-25-2008 |
| 20090039331 | PHASE CHANGE MATERIAL STRUCTURES - Structures including a phase change material are disclosed. The structure may include a first electrode; a second electrode; a phase change material electrically connecting the first electrode and the second electrode for passing a current therethrough; and a tantalum nitride heater layer about the phase change material for converting the phase change material between an amorphous, insulative state and a crystalline, conductive state by application of a second current to the phase change material. The structure may be used as a fuse or a phase change material random access memory (PRAM). | 02-12-2009 |
| 20090040006 | ELECTRICAL FUSE WITH ENHANCED PROGRAMMING CURRENT DIVERGENCE - A layer of semiconductor material is patterned to form a cathode semiconductor portion, a fuselink semiconductor portion, and an anode semiconductor portion. A first metal layer is deposited on the patterned semiconductor material layer. A dielectric material layer is deposited and lithographically patterned to cover a middle portion of the fuselink, followed by a deposition of a second metal layer. A thin metal semiconductor alloy is formed in the middle of the fuselink and thick metal semiconductor alloy alloys are formed abutting the thin metal semiconductor alloy alloy. The resulting inventive electrical fuse has interfaces at which a thinner metal semiconductor alloy abuts a thicker metal semiconductor alloy in the fuselink. The divergence of electrical current is enhanced at the interfaces due to a sudden change of a cross-sectional area available for current conduction. | 02-12-2009 |
| 20090042341 | ELECTRICAL FUSE WITH A THINNED FUSELINK MIDDLE PORTION - A metal layer is deposited on the patterned semiconductor material layer containing a cathode semiconductor portion, a fuselink semiconductor portion, and an anode semiconductor portion. The metal layer may be patterned so that a middle portion of the fuselink semiconductor portion has a thin metal layer, which upon annealing produces a thinner metal semiconductor alloy portion than surrounding metal semiconductor alloy portion on the fuselink semiconductor portion. Alternatively, a middle portion of the metal semiconductor alloy having a uniform thickness throughout the fuselink may be lithographically patterned and etched to form a thin metal semiconductor alloy portion in the middle of the fuselink, while thick metal semiconductor alloy portions are formed on the end portions of the fuselink. The resulting inventive electrical fuse has interfaces at which a thinner metal semiconductor alloy abuts a thicker metal semiconductor alloy in the fuselink to enhance the divergence of electrical current. | 02-12-2009 |
| 20090045388 | PHASE CHANGE MATERIAL STRUCTURE AND RELATED METHOD - A structure including a phase change material and a related method are disclosed. The structure may include a first electrode; a second electrode; a third electrode; a phase change material electrically connecting the first, second and third electrodes for passing a first current through two of the first, second and third electrodes; and a refractory metal barrier heater layer about the phase change material for converting the phase change material between an amorphous, insulative state and a crystalline, conductive state by application of a second current to the phase change material. The structure may be used as a fuse or a phase change material random access memory (PRAM). | 02-19-2009 |
| 20090051003 | Methods and Structures Involving Electrically Programmable Fuses - A method for fabricating an eFuse, the method comprising disposing a crystalline silicon eFuse on a substrate having a fuse link portion, a first contact portion, and a second contact portion, wherein the fuse link is oriented parallel to the silicon crystal { | 02-26-2009 |
| 20090065761 | PROGRAMMABLE FUSE/NON-VOLATILE MEMORY STRUCTURES IN BEOL REGIONS USING EXTERNALLY HEATED PHASE CHANGE MATERIAL - A programmable phase change material (PCM) structure includes a heater element formed at a BEOL level of a semiconductor device, the BEOL level including a low-K dielectric material therein; a first via in electrical contact with a first end of the heater element and a second via in electrical contact with a second end of the heater element, thereby defining a programming current path which passes through the first via, the heater element, and the second via; a PCM element disposed above the heater element, the PCM element configured to be programmed between a lower resistance crystalline state and a higher resistance amorphous state through the use of programming currents through the heater element; and a third via in electrical contact with the PCM element, thereby defining a sense current path which passes through the third via, the PCM element, the heater element, and the second via. | 03-12-2009 |
| 20090090993 | SINGLE CRYSTAL FUSE ON AIR IN BULK SILICON - An integrated eFUSE device is formed by forming a silicon “floating beam” on air, whereupon the fusible portion of the eFUSE device resides. This beam extends between two larger, supporting terminal structures. “Undercutting” techniques are employed whereby a structure is formed atop a buried layer, and that buried layer is removed by selective etching. Whereby a “floating” silicide eFUSE conductor is formed on a silicon beam structure. In its initial state, the eFUSE silicide is highly conductive, exhibiting low electrical resistance (the “unblown state of the eFUSE). When a sufficiently large current is passed through the eFUSE conductor, localized heating occurs. This heating causes electromigration of the silicide into the silicon beam (and into surrounding silicon, thereby diffusing the silicide and greatly increasing its electrical resistance. When the current source is removed, the silicide remains permanently in this diffused state, the “blown” state of the eFUSE. | 04-09-2009 |
| 20090096059 | FUSE STRUCTURE INCLUDING MONOCRYSTALLINE SEMICONDUCTOR MATERIAL LAYER AND GAP - A fuse structure, a method for fabricating the fuse structure and a method for programming a fuse within the fuse structure each use a fuse material layer that is used as a fuse, and located upon a monocrystalline semiconductor material layer in turn located over a substrate. At least part of the monocrystalline semiconductor material layer is separated from the substrate by a gap. Use of the monocrystalline semiconductor material layer, as well as the gap, provides for enhanced uniformity and reproducibility when programming the fuse. | 04-16-2009 |
| 20090101989 | METAL GATE COMPATIBLE ELECTRICAL FUSE - A dielectric material layer is formed on a metal gate layer for a metal gate electrode, and then lithographically patterned to form a dielectric material portion, followed by formation of a polycrystalline semiconductor layer thereupon. A semiconductor device employing a metal gate electrode is formed in a region of the semiconductor substrate containing a vertically abutting stack of the metal gate layer and the polycrystalline semiconductor layer. A material stack in the shape of an electrical fuse is formed in another region of the semiconductor substrate containing a vertical stack of the metal gate layer, the dielectric material portion, and the polycrystalline semiconductor layer. After metallization of the polycrystalline semiconductor layer, an electrical fuse containing a polycrystalline semiconductor portion and a metal semiconductor alloy portion is formed over the dielectric material portion that separates the electrical fuse from the metal gate layer. | 04-23-2009 |
| 20090108396 | ELECTRICAL FUSE HAVING A FULLY SILICIDED FUSELINK AND ENHANCED FLUX DIVERGENCE - A contiguous block of a stack of two heterogeneous semiconductor layers is formed over an insulator region such as shallow trench isolation. A portion of the contiguous block is exposed to an etch, while another portion is masked during the etch. The etch removes an upper semiconductor layer selective to a lower semiconductor layer in the exposed portion. The etch mask is removed and the entirety of the lower semiconductor layer within the exposed region is metallized. A first metal semiconductor alloy vertically abutting the insulator region is formed, while exposed surfaces of the stack of two heterogeneous semiconductor layers, which comprises the materials of the upper semiconductor layer, are concurrently metallized to form a second metal semiconductor alloy. An inflection point for current and, consequently, a region of flux divergence are formed at the boundary of the two metal semiconductor alloys. | 04-30-2009 |
| 20090141533 | METAL GATE COMPATIBLE ELECTRICAL ANTIFUSE - A metal layer and a semiconductor layer are sequentially deposited on a substrate. The semiconductor layer and the metal layer are lithographically patterned to form a stack of a semiconductor portion and a metal gate portion, which is preferably performed concurrently with formation of at least one metal gate stack. In one embodiment, the size of the semiconductor portion is reduced and a metal semiconductor alloy portion is formed on the semiconductor portion by metallization. In a first electrical antifuse formed thereby, the metal semiconductor alloy portion may be electromigrated to form a short between the metal semiconductor alloy portion and the metal gate portion. In another embodiment, two disjoined metal semiconductor alloy portions are formed on the semiconductor portion. In a second electrical antifuse formed thereby, the metal semiconductor alloy portion may be electromigrated to form a short between the two previously disjoined metal semiconductor alloy portions. | 06-04-2009 |
| 20090267179 | SYSTEM FOR POWER PERFORMANCE OPTIMIZATION OF MULTICORE PROCESSOR CHIP - A system in one embodiment includes a multiprocessor chip comprising a plurality of cores; a plurality of power circuits, each power circuit being coupled to one of the cores; and an electrically programmable fuse in each power circuit. Each electrically programmable fuse further comprises a first electrode coupled to the associated power circuit; a second electrode coupled to the associated power circuit; a first pad coupled to the first electrode; a second pad coupled to the second electrode; and an electrically conductive material extending between the first and second electrodes and forming part of the associated power circuit, the electrically conductive material being characterized as tending to electromigrate from one of the electrodes to the other electrode under an applied electrical current passing between the electrodes, wherein the electromigration increases an overall resistance of the power circuit. | 10-29-2009 |
| 20090283840 | METAL GATE INTEGRATION STRUCTURE AND METHOD INCLUDING METAL FUSE, ANTI-FUSE AND/OR RESISTOR - A semiconductor structure and a method for fabricating the semiconductor structure provide a field effect device located and formed upon an active region of a semiconductor substrate and at least one of a fuse structure, an anti-fuse structure and a resistor structure located and formed at least in part simultaneously upon an isolation region laterally separated from the active region within the semiconductor substrate. The field effect device includes a gate dielectric comprising a high dielectric constant dielectric material and a gate electrode comprising a metal material. The at least one of the fuse structure, anti-fuse structure and resistor structure includes a pad dielectric comprising the same material as the gate dielectric, and optionally, also a fuse, anti-fuse or resistor that may comprise the same metal material as the gate electrode. | 11-19-2009 |
| 20100032732 | ELECTRICAL ANTIFUSE HAVING A MULTI-THICKNESS DIELECTRIC LAYER - An electrical antifuse comprising a field effect transistor includes a gate dielectric having two gate dielectric portions. Upon application of electric field across the gate dielectric, the magnitude of the electrical field is locally enhanced at the boundary between the thick and thin gate dielectric portions due to the geometry, thereby allowing programming of the electrical antifuse at a lower supply voltage between the two electrodes, i.e., the body and the gate electrode of the transistor, across the gate dielectric. | 02-11-2010 |
| 20100181620 | STRUCTURE AND METHOD FOR FORMING PROGRAMMABLE HIGH-K/METAL GATE MEMORY DEVICE - A method of fabricating a memory device is provided that may begin with forming a layered gate stack overlying a semiconductor substrate and patterning a metal electrode layer stopping on the high-k gate dielectric layer of the layered gate stack to provide a first metal gate electrode and a second metal gate electrode on the semiconductor substrate. In a next process sequence, at least one spacer is formed on the first metal gate electrode overlying a portion of the high-k gate dielectric layer, wherein a remaining portion of the high-k gate dielectric is exposed. The remaining portion of the high-k gate dielectric layer is etched to provide a first high-k gate dielectric having a portion that extends beyond a sidewall of the first metal gate electrode and a second high-k gate dielectric having an edge that is aligned to a sidewall of the second metal gate electrode. | 07-22-2010 |
| 20100181643 | EFUSE WITH PARTIAL SIGE LAYER AND DESIGN STRUCTURE THEREFOR - A fuse includes a fuse link region, a first region and a second region. The fuse link region electrically connects the first region to the second region. A SiGe layer is disposed only in the fuse link region and the first region. | 07-22-2010 |
| 20100193854 | NON-VOLATILE MEMORY DEVICE USING HOT-CARRIER INJECTION - Each of a hot-carrier non-volatile memory device and a method for fabricating the hot carrier non-volatile memory device is predicated upon a semiconductor structure and related method that includes a metal oxide semiconductor field effect transistor structure. The semiconductor structure and related method include at least one of: (1) a spacer that comprises a dielectric material having a dielectric constant greater than 7 (for enhanced hot carrier derived charge capture and retention); and (2) a drain region that comprises a semiconductor material that has a narrower bandgap than a bandgap of a semiconductor material from which is comprised a channel region (for enhanced impact ionization and charged carrier generation). | 08-05-2010 |
| 20100327399 | ELECTRICALLY PROGRAMMABLE FUSE USING ANISOMETRIC CONTACTS AND FABRICATION METHOD - An electrically programmable fuse that includes an anode contact region and a cathode contact region are formed of a polysilicon layer having a silicide layer formed thereon, and a fuse link conductively connecting the cathode contact region with the anode contact region, which is programmable by applying a programming current, and a plurality of anisometric contacts formed on the silicide layer of the cathode contact region or on both the silicide layer of the cathode contact region and the anode contact region in a predetermined configuration, respectively. | 12-30-2010 |
| 20100330783 | ELECTRICAL FUSE HAVING A FULLY SILICIDED FUSELINK AND ENHANCED FLUX DIVERGENCE - A contiguous block of a stack of two heterogeneous semiconductor layers is formed over an insulator region such as shallow trench isolation. A portion of the contiguous block is exposed to an etch, while another portion is masked during the etch. The etch removes an upper semiconductor layer selective to a lower semiconductor layer in the exposed portion. The etch mask is removed and the entirety of the lower semiconductor layer within the exposed region is metallized. A first metal semiconductor alloy vertically abutting the insulator region is formed, while exposed surfaces of the stack of two heterogeneous semiconductor layers, which comprises the materials of the upper semiconductor layer, are concurrently metallized to form a second metal semiconductor alloy. An inflection point for current and, consequently, a region of flux divergence are formed at the boundary of the two metal semiconductor alloys. | 12-30-2010 |
| 20110031582 | FIN ANTI-FUSE WITH REDUCED PROGRAMMING VOLTAGE - A method forms an anti-fuse structure comprises a plurality of parallel conductive fins positioned on a substrate, each of the fins has a first end and a second end. A second electrical conductor is electrically connected to the second end of the fins. An insulator covers the first end of the fins and a first electrical conductor is positioned on the insulator. The first electrical conductor is electrically insulated from the first end of the fins by the insulator. The insulator is formed to a thickness sufficient to break down on the application of a predetermined voltage between the second electrical conductor and the first electrical conductor and thereby form an uninterrupted electrical connection between the second electrical conductor and the first electrical conductor through the fins. | 02-10-2011 |
| 20110049460 | SINGLE MASK ADDER PHASE CHANGE MEMORY ELEMENT - A method of fabricating a phase change memory element within a semiconductor structure includes etching an opening to an upper surface of a bottom electrode, the opening being formed of a height equal to a height of a metal region at a same layer within the semiconductor structure, depositing phase change material within the opening, recessing the phase change material within the opening, and forming a top electrode on the recessed phase change material. | 03-03-2011 |
| 20110101496 | FOUR-TERMINAL ANTIFUSE STRUCTURE HAVING INTEGRATED HEATING ELEMENTS FOR A PROGRAMMABLE CIRCUIT - The present invention provides antifuse structures having an integrated heating element and methods of programming the same, the antifuse structures comprising first and second conductors and a dielectric layer formed between the conductors, where one or both of the conductors functions as both a conventional antifuse conductor and as a heating element for directly heating the antifuse dielectric layer during programming. | 05-05-2011 |
