| Patent application number | Description | Published |
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| 20080239525 | CAMERA MODULE ASSEMBLY - A camera module ( | 10-02-2008 |
| 20080246845 | CAMERA MODULE WITH COMPACT PACKAGING OF IMAGE SENSOR CHIP - An exemplary camera module includes a lens holder, a lens module, a lens module, an image sensor chip, and an attaching member. The lens module is received in the lens holder. The lens module comprises a barrel and at least one lens received in the barrel. The image sensor chip comprises a photosensitive area configured for receiving light transmitted through the lens module. The attaching member is disposed at an end portion of the lens holder opposite to the lens module. The attaching member is configured for attaching the lens holder to the image sensor chip. The attaching member defines a light transmittance space configured for exposing the photosensitive area to the lens module. | 10-09-2008 |
| 20080279547 | CAMERA MODULE - A camera module ( | 11-13-2008 |
| 20080309805 | IMAGE SENSOR PACKAGE - An image sensor package includes a printed circuit board (PCB) with a plurality of signal input pads disposed on an upper surface thereof, an image sensor chip, a frame layer, a transparent layer, a plurality of wires and glue. The image sensor chip includes a photosensitive region formed on a top surface thereof, a plurality of bonding pads formed on the periphery thereof, and a carrying region formed between the photosensitive region and the bonding pads. The glue covers a space formed between the PCB, the image sensor chip and the frame layer, for sealing the bonding pads, the input pads and the wires. The frame layer defines a base adhered to the corresponding carrying region and a window corresponding to the photosensitive region. The transparent layer is adhered to cover the window of the frame layer to seal the photosensitive region of the image sensor chip. | 12-18-2008 |
| Patent application number | Description | Published |
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| 20110122572 | HEAT DISSIPATION SYSTEM AND ELECTRONIC DEVICE USING THE SYSTEM - A heat dissipation system dissipating heat from a server includes a plurality of fans mounted on a server by a fan holder. Each fan has an inlet and an outlet. The fan holder has a framework attached to one of outer sides of the server and accommodating the fans therein. The inlets or the outlets communicate with the server through the fan holder to enable the fans to generate airflow into or out of the server. | 05-26-2011 |
| 20110193514 | ELECTRONIC DEVICE HAVING ENERGY RECYCLING SYSTEM - An electronic device includes a computer server and an energy recycling system. The computer server includes a frame, at least one fan, and a heat source both are received in the frame. The frame includes a first sidewall with a plurality of vents formed thereon. The fan defines an air inlet facing the heat source, and an air outlet facing the first sidewall and substantially aligned with the vents. The energy recycling system includes a rotation assembly and an electric generator. The rotation assembly includes a rotation shaft and a plurality of driven members formed on the rotation shaft. The rotation assembly is arranged in front of the first sidewall. The driven members are driven by the airflow to rotate the rotation shaft. The rotation shaft is connected to the electric generator configured for converting the rotation of the rotation shaft into electrical energy. | 08-11-2011 |
| 20110235257 | SUPPORT MECHANISM AND DISPLAY DEVICE USING THE SAME - A support mechanism includes a base, a first connection member connected to one side of the base, a rotation assembly connected to the other side of the base, and a second connection member rotatably connected to the rotation assembly. The rotation assembly includes a first hinged member and a second hinged member. The first hinged member includes a pivot shaft, and the second hinged member forms an engaging portion in which the pivot shaft is rotatably received. The first hinged member is rotatably connected to the base, and the second hinged member is rotatably connected with the second connection member. The disclosure further provides a display device using the support mechanism. | 09-29-2011 |
| 20110236169 | TEMPERATURE AND HUMIDITY CONTROL CHAMBER - A temperature and humidity control chamber includes a housing defining a receiving chamber, a support frame received in the receiving chamber, four elevating members supporting the support frame, four driving assemblies mounted on the housing, and a controller operable to control the driving assemblies. The four elevating members are capable of moving the support frame from a first vertical position to a second vertical position. | 09-29-2011 |
| 20110299249 | HEAT SINK MOUNTING FRAME APPLICABLE TO A VARIETY OF CIRCUIT BOARDS - An exemplary heat sink mounting frame is for mounting a heat sink onto a circuit board. The heat sink mounting frame includes a circular guide rail, and mounting arms movably connected with and extending radially and outwardly from the guide rail. Each mounting arm includes a fixing bracket connected to the guide rail and a sliding bar slidably connected with the fixing bracket. An engaging post is formed on the sliding bar. The sliding bar is slidable along the fixing bracket, such that a total length of each of the mounting arms is variable to adjust the locations of the engaging posts of the mounting arms. | 12-08-2011 |
| 20120013195 | POWER SUPPLY SYSTEM AND CONTAINER DATA CENTER INCLUDING SAME - A power supply system includes a number of aerogenerators, a number of rectifiers, and a direct current to direct current (DC/DC) converter. A first terminal of each rectifier is connected to a corresponding one of the aerogenerators. A first terminal of the DC/DC converter is connected to second terminals of the rectifiers. A second terminal of the DC/DC converter is connected to a power unit of a container data center. Each rectifier converts the alternating current (AC) generated by the corresponding aerogenerator to a pulsating direct current (DC). The DC/DC converter converts the pulsating DC to a constant voltage DC and supplies power to the power unit. | 01-19-2012 |
| 20120071076 | CONTAINER DATA CENTER AND HEAT DISSIPATION SYSTEM - A container data center includes a container, a number of server systems, and a number of fan apparatuses. Each fan apparatus includes a number of guides to guide airflow of the cooling airflow, a guide driver to drive the guides, and a micro control unit (MCU) to control the guide driver. Each server system includes a temperature sensor to determine temperature of the server system. The MCU of each fan apparatus is connected to two temperature sensors of two server systems nearest to the fan apparatus but not in the same row. The MCU receives two temperature signals from two corresponding temperature sensors and directs the guide driver to rotate the guides towards the server system with higher temperature. | 03-22-2012 |
| 20120074077 | HEAT SINK BRACKET - A bracket for mounting a heat sink on a printed circuit board includes two supports, two rails slidably attached to the supports, four adjusting assemblies slidably attached to the rails and four positioning members extending through the supports to engage with the rails to position the rails on the supports. Positions of opposite ends of the rails in the supports are adjustable along a first direction. Each of the rails defines two spaced slide slots in opposite ends of the rail. The supports and the rails are attached to a first side of the printed circuit board. Positions of the adjusting assemblies in the slide slots are adjustable along a second direction perpendicular to the first direction. The adjusting assemblies extend through the circuit board to engage with the heat sink at a second side of the printed circuit board. | 03-29-2012 |
| 20120074078 | MOUNTING APPARATUS FOR DATA STORAGE DEVICE - A mounting apparatus for data storage devices includes a first bracket and a second bracket pivotably attached to the first bracket end-to-end. The first bracket includes a first connection portion and a second connection portion. The second bracket includes a connection post received in the first connection portion and the second connection portion. | 03-29-2012 |
| 20120108157 | CONTAINER DATA CENTER - A container data center includes a portable container defining a number of inlets, a number of racks received in the container, and a number of air ducts. Each of the air ducts is mounted to the container and aligns with one corresponding inlet of the container. Each of the air ducts includes an air inlet, and an air outlet accommodated in the corresponding inlet of the container. An area of a cross section surface of the air inlet is greater than an area of a cross section of the air outlet of the air duct. | 05-03-2012 |
| 20120109405 | CONTAINER DATA CENTER AND HEAT DISSIPATION SYSTEM THEREOF - A data center includes a container with a raised floor defining a number of openings, and a server system received in the container. The server system includes a rack and a number of servers received in the rack at different heights. Cooling air is released by a cooling device. A number of pressurizing fans are arranged under the raised floor aligned with the openings to drive the cooling air to flow upwards through the openings. A number of temperature sensors are mounted to the rack to sense temperatures of air flowing out of the servers. The temperatures sensed by the temperature sensors are transmitted to a computing unit. According to the temperatures, the computing unit adjusts the speeds of the pressurizing fans to make the cooling air within the container be better distributed for evenly cooling the servers. | 05-03-2012 |
| 20120115411 | AIR CONDUCTION DEVICE - An air conduction device includes main body defining a first passage through which airflow passes, and two adjusting members. A top of the main body defines a cutout communicating with the first passage. The cutout includes two opposite slanted sidewalls, and each slanted sidewall defines a plurality of slots aligned in a line along a slanted direction of the slanted sidewall. An elastic hook extends from each adjusting member. The adjusting members are accommodated in the cutout, with the elastic hooks selectively engaged in one of the corresponding slots. | 05-10-2012 |
| 20120118553 | HEAT VENTILATION APPARATUS - An exemplary heat ventilation apparatus includes a server system having servers, a temperature sensor, a blower unit and a controlling unit electrically connected to the temperature sensor and the blower unit. The temperature sensor is mounted on the server system for sensing a temperature of an interior of the server system. The blower unit is adapted for drawing hot air from the server system to warm buildings. The controlling unit outputs different signals to turn on or turn off the blower unit according to different temperatures of the interior of the server system. | 05-17-2012 |
| 20120126990 | FLOOD PROTECTION APPARATUS AND CONTAINER DATA CENTER INCLUDING THE SAME - A flood protection apparatus includes an adjustable base, a first water level detector, and a controller. The adjustable base supports the container and is operable to adjust a height of the container. The first water level detector is mounted on the base. When the first water level detector detects water has reached the first level, the first water level detector outputs a first detection signal. The controller receives the first detection signal to activate the base to heighten the container, until the first detection signal ceases or the base is at a highest point. | 05-24-2012 |
| 20120134111 | SERVER CABINET AND SERVER SYSTEM UTILIZING THE SAME - A server cabinet adapted for receiving servers therein includes a top plate, a bottom plate opposite to the top plate, a left side plate and a right side plate connecting with the top and bottom plates respectively, and a front side plate disposed between the top and bottom plates. The front side plate defines through holes therein. A total area of the through holes in an upper half portion of the front side plate is different from a total area of the through holes in a lower half portion of the front side plate. The front side plate is rotatable in a plane defined by the front side plate. | 05-31-2012 |
| 20120162904 | SERVER RACK AND ELECTRONIC SYSTEM INCORPORATING THE SAME - An exemplary server rack includes a box adapted for receiving a plurality of servers therein, a plurality of pivoting members pivotally connected to the box; and a plurality of covers fixed to the pivoting members respectively. The box includes a front board and a back board opposite to the front board. The front board and the back board both define a plurality of though holes adapted for airflow to pass therethrough. Each cover is operable to pivot relative to the box via the corresponding pivoting member, and thereby cover some of the through holes of the front board of the box. | 06-28-2012 |
| 20120195738 | SHOCKPROOF FAN APPARATUS - A fan apparatus includes a fan, a shockproof unit, and a case. The fan includes two plates, and a through hole is defined on each plate. The shockproof unit includes a pole penetrating the two though holes, and at least a flange is defined on the pole; at least an elastic element is restricted between one of the plates and the flange. Two ends of the pole protrude from the through holes and abut on the case when the fan is received in the case. A concave groove is defined on each end of the pole; the concave groove protrudes one of the through holes and received in a sleeve abutting on the case; a containing hole is defined in the sleeve to receive the end of the pole. | 08-02-2012 |
| Patent application number | Description | Published |
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| 20100164999 | DISPLAY DEVICE AND CONTROL METHOD THEREOF - A display device includes a display module for displaying information, a light module for emitting light to the display module, and a display control system. The display control system includes a storage module for storing display control parameters, and a system controller for setting the display module by using the display control parameters when an operation time of the light module equals to a predetermined time point, to compensate for a brightness deterioration of the light module. A related display control method is also provided. | 07-01-2010 |
| 20110262767 | SURFACE HARDENED SUBSTRATE AND METHOD MAKING SAME - A surface hardened substrate includes a base, a transition layer disposed on a surface of the base, and a hard layer disposed on the transition layer. The transition layer includes at least two kinds of transition metals. The hard layer includes an alloy and a nonmetal. The alloy includes the at least two kinds of transition metals. | 10-27-2011 |
| 20120164471 | HOUSING AND METHOD FOR MAKING THE SAME - A housing is provided which includes an aluminum or aluminum alloy substrate, an aluminum layer and a corrosion resistant layer formed on the aluminum or aluminum alloy substrate in that order. The corrosion resistant layer is an Al—O layer. Then, La ions are implanted in the Al—O layer by ion implantation process. The atomic percentages of O in the Al—O gradient layer gradually increase from the side of Al—O gradient layer near the aluminum or aluminum alloy substrate to the other side of Al—O gradient layer, away from aluminum or aluminum alloy substrate. Therefore the housing has a high corrosion resistance. A method for making the housing is also provided. | 06-28-2012 |
| 20120171514 | HOUSING AND METHOD FOR MAKING THE SAME - A housing is provided which includes an aluminum or aluminum alloy substrate, an aluminum layer and a corrosion resistant layer formed on the aluminum or aluminum alloy substrate in that order. The corrosion resistant layer is an Al—C—N layer. Then, La ions is implanted in the Al—C—N layer by ion implantation process. The atomic percentages of N and C in the Al—C—N gradient layer gradually increase from the side of Al—C—N gradient layer near the aluminum or aluminum alloy substrate to the other side of Al—C—N gradient layer, away from aluminum or aluminum alloy substrate. Therefore the housing has a high corrosion resistance. A method for making the housing is also provided. | 07-05-2012 |
| 20120183803 | HOUSING AND METHOD FOR MAKING THE SAME - A housing is provided which includes an aluminum or aluminum alloy substrate, an aluminum layer and a corrosion resistant layer formed on the aluminum or aluminum alloy substrate in that order. The corrosion resistant layer is an Al—C—N layer. Then, Gd ions is implanted in the Al—C—N layer by ion implantation process. The atomic percentages of N and C in the Al—C—N gradient layer gradually increase from the side of Al—C—N gradient layer near the aluminum or aluminum alloy substrate to the other side of Al—C—N gradient layer, away from aluminum or aluminum alloy substrate. Therefore the housing has a high corrosion resistance. A method for making the housing is also provided. | 07-19-2012 |
| 20120189865 | HOUSING AND METHOD FOR MAKING THE SAME - A housing is provided which includes an aluminum or aluminum alloy substrate, an aluminum layer and a corrosion resistant layer formed on the aluminum or aluminum alloy substrate in that order. The corrosion resistant layer is an Al—O layer. Then, Nd ions are implanted in the Al—O layer by ion implantation process. The atomic percentages of O in the Al—O gradient layer gradually increases from the side of Al—O gradient layer near the aluminum or aluminum alloy substrate to the other side of Al—O gradient layer, away from aluminum or aluminum alloy substrate. Therefore the housing has a high corrosion resistance. A method for making the housing is also provided. | 07-26-2012 |
| 20120189867 | HOUSING AND METHOD FOR MAKING THE SAME - A housing is provided which includes an aluminum or aluminum alloy substrate, an aluminum layer and a corrosion resistant layer formed on the aluminum or aluminum alloy substrate in that order. The corrosion resistant layer is an Al—O layer. Then, Gd ions are implanted in the Al—O layer by ion implantation process. The atomic percentages of O in the Al—O gradient layer gradually increase from the side of Al—O gradient layer near the aluminum or aluminum alloy substrate to the other side of Al—O gradient layer, away from aluminum or aluminum alloy substrate. Therefore the housing has a high corrosion resistance. A method for making the housing is also provided. | 07-26-2012 |
| 20120196145 | HOUSING AND METHOD FOR MAKING THE SAME - A housing is provided which includes an aluminum or aluminum alloy substrate, an aluminum layer and a corrosion resistant layer formed on the aluminum or aluminum alloy substrate in that order. The corrosion resistant layer is an Al—C—N layer. Then, Ce ions are implanted in the Al—C—N layer by ion implantation process. The atomic percentages of N and C in the Al—C—N gradient layer gradually increase from the side of Al—C—N gradient layer near the aluminum or aluminum alloy substrate to the other side of Al—C—N gradient layer, away from aluminum or aluminum alloy substrate. Therefore the housing has a high corrosion resistance. A method for making the housing is also provided. | 08-02-2012 |
| 20120219819 | HOUSING AND METHOD FOR MAKING THE SAME - A housing is provided which includes an aluminum or aluminum alloys substrate, an aluminum layer and a corrosion resistant layer formed on the aluminum or aluminum alloys substrate in that order. The corrosion resistant layer is an Al—O—N layer. Then, Gd ions is implanted in the Al—O—N layer by ion implantation process. The atomic percentages of N and O in the Al—O—N gradient layer gradually increase from the bottom of the layer near the aluminum or aluminum alloys substrate to the top of the layer away from aluminum or aluminum alloys substrate by physical vapor deposition. The housing has a higher corrosion resistance. A method for making the housing is also provided. | 08-30-2012 |
| 20120219820 | HOUSING AND METHOD FOR MAKING THE SAME - A housing is provided which includes an aluminum or aluminum alloy substrate, an aluminum layer and a corrosion resistant layer formed on the aluminum or aluminum alloy substrate in that order. The corrosion resistant layer is an Al—C—N layer. Then, Nd ions are implanted in the Al—C—N layer by ion implantation process. The atomic percentages of N and C in the Al—C—N gradient layer gradually increase from the side of Al—C—N gradient layer near the aluminum or aluminum alloy substrate to the other side of Al—C—N gradient layer, away from aluminum or aluminum alloy substrate. Therefore the housing has a high corrosion resistance. A method for making the housing is also provided. | 08-30-2012 |
| 20120219822 | HOUSING AND METHOD FOR MAKING THE SAME - A housing is provided which includes an aluminum or aluminum alloys substrate, an aluminum layer and a corrosion resistant layer formed on the aluminum or aluminum alloys substrate in that order. The corrosion resistant layer is an Al—O—N layer. Then, La ions is implanted in the Al—O—N layer by ion implantation process. The atomic percentages of N and O in the Al—O—N gradient layer gradually increase from the bottom of the layer near the aluminum or aluminum alloys substrate to the top of the layer away from aluminum or aluminum alloys substrate by physical vapor deposition. The housing has a higher corrosion resistance. A method for making the housing is also provided. | 08-30-2012 |
| 20120237790 | HOUSING AND METHOD FOR MAKING THE SAME - A housing is provided which includes an aluminum or aluminum alloy substrate, an aluminum layer and a corrosion resistant layer formed on the aluminum or aluminum alloy substrate in that order. The corrosion resistant layer is an Al—O—N layer. Then, Nd ions is implanted in the Al—O—N layer by ion implantation process. The atomic percentages of N and O in the Al—O—N gradient layer gradually increase from nearing the aluminum or aluminum alloy substrate to far away from it. The housing has a higher corrosion resistant. A method for making the housing is also provided. | 09-20-2012 |
