Patent application number | Description | Published |
20090294983 | HYBRID CONDUCTIVE VIAS INCLUDING SMALL DIMENSION ACTIVE SURFACE ENDS AND LARGER DIMENSION BACK SIDE ENDS, SEMICONDUCTOR DEVICES INCLUDING THE SAME, AND ASSOCIATED METHODS - A conductive via of a semiconductor device includes a relatively small diameter portion extending into an active surface of a fabrication substrate and a corresponding, relatively large diameter portion that extends into a back side of the fabrication substrate. This type of conductive via may be fabricated by forming the relatively small diameter portion before or during BEOL processing, while the large diameter portion of each conductive via may be fabricated after BEOL processing is complete. Electronic devices that include one or more semiconductor devices with such conductive vias are also disclosed. | 12-03-2009 |
20100264532 | ELECTRONIC DEVICE PACKAGE - Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover. | 10-21-2010 |
20100283151 | TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS - Techniques for fabricating multiple device components. Specifically, techniques for fabricating a stacked package comprising at least one I/C module and a multi-chip package. The multi-chip package includes a plurality of integrated circuit dices coupled to a carrier. The dice are encapsulated such that conductive elements are exposed through the encapsulant. The conductive elements are electrically coupled to the chips. The I/C module comprises an interposer having a plurality of integrated circuit dice disposed thereon. The dice of the I/C module are electrically coupled to the interposer via bondwires. The interposer is configured such that vias are aligned with the conductive elements on the multi-chip package. The multi-chip package and I/C module may be fabricated separately and subsequently coupled together to form a stacked package. | 11-11-2010 |
20110180936 | SEMICONDUCTOR DEVICE STRUCTURES AND ELECTRONIC DEVICES INCLUDING SAME HYBRID CONDUCTIVE VIAS - A conductive via of a semiconductor device includes a relatively small diameter portion extending into an active surface of a fabrication substrate and a corresponding, relatively large diameter portion that extends into a back side of the fabrication substrate. This type of conductive via may be fabricated by forming the relatively small diameter portion before or during BEOL processing, while the large diameter portion of each conductive via may be fabricated after BEOL processing is complete. Electronic devices that include one or more semiconductor devices with such conductive vias are also disclosed. | 07-28-2011 |
20110298077 | METHODS OF FABRICATION OF PACKAGE ASSEMBLIES FOR OPTICALLY INTERACTIVE ELECTRONIC DEVICES AND PACKAGE ASSEMBLIES THEREFOR - Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with back side conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier. | 12-08-2011 |
20120126386 | ELECTRONIC DEVICES - Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover. | 05-24-2012 |
20120187552 | Molded Stiffener for Thin Substrates - A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package. | 07-26-2012 |
20120241956 | TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS - Techniques for fabricating multiple device components. Specifically, techniques for fabricating a stacked package comprising at least one I/C module and a multi-chip package. The multi-chip package includes a plurality of integrated circuit dice coupled to a carrier. The dice are encapsulated such that conductive elements are exposed through the encapsulant. The conductive elements are electrically coupled to the chips. The I/C module comprises an interposer having a plurality of integrated circuit dice disposed thereon. The dice of the I/C module are electrically coupled to the interposer via bondwires. The interposer is configured such that vias are aligned with the conductive elements on the multi-chip package. The multi-chip package and I/C module may be fabricated separately and subsequently coupled together to form a stacked package. | 09-27-2012 |
20130187289 | SEMICONDUCTOR DEVICE STRUCTURES AND ELECTRONIC DEVICES INCLUDING SAME HYBRID CONDUCTIVE VIAS, AND METHODS OF FABRICATION - A conductive via of a semiconductor device includes a relatively small diameter portion extending into an active surface of a fabrication substrate and a corresponding, relatively large diameter portion that extends into a back side of the fabrication substrate. This type of conductive via may be fabricated by forming the relatively small diameter portion before or during BEOL processing, while the large diameter portion of each conductive via may be fabricated after BEOL processing is complete. Electronic devices that include one or more semiconductor devices with such conductive vias are also disclosed. | 07-25-2013 |
20130234275 | METHODS OF FABRICATION OF PACKAGE ASSEMBLIES FOR OPTICALLY INTERACTIVE ELECTRONIC DEVICES AND PACKAGE ASSEMBLIES THEREFOR - Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with back side conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier. | 09-12-2013 |
20140099753 | TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS - Techniques for fabricating multiple device components. Specifically, techniques for fabricating a stacked package comprising at least one I/C module and a multi-chip package. The multi-chip package includes a plurality of integrated circuit dice coupled to a carrier. The dice are encapsulated such that conductive elements are exposed through the encapsulant. The conductive elements are electrically coupled to the chips. The I/C module comprises an interposer having a plurality of integrated circuit dice disposed thereon. The dice of the I/C module are electrically coupled to the interposer via bondwires. The interposer is configured such that vias are aligned with the conductive elements on the multi-chip package. The multi-chip package and I/C module may be fabricated separately and subsequently coupled together to form a stacked package. | 04-10-2014 |
Patent application number | Description | Published |
20090018122 | Aryloxy and Arylalkyleneoxy Substituted Imidazoquinolines - Imidazoquinoline compounds with an aryloxy or arylalkyleneoxy or hydroxy substituent at the 6, 7, 8, or 9-position, pharmaceutical compositions containing the compounds, intermediates, and methods of use of these compounds as immunomodulators, for modulating cytokine biosynthesis in animals and in the treatment of diseases including viral and neoplastic diseases, are disclosed. | 01-15-2009 |
20090099161 | Substituted Imidazoquinolines and Imidazonaphthyridines - Imidazoquinolines and imidazonaphthyridines with a substituent containing a functional group, e.g., an amide, sulfonamide, urea, or heterocyclyl group, at the 6, 7, 8, or 9-position, pharmaceutical compositions containing the compounds, intermediates, methods of making and methods of use of these compounds as immunomodulators, for inducing cytokine biosynthesis in animals and in the treatment of diseases including viral and neoplastic diseases are disclosed. | 04-16-2009 |
20090163533 | 1-Substituted Pyrazolo (3,4-C) Ring Compounds as Modulators of Cytokine Biosynthesis for the Treatment of Viral Infections and Neoplastic Diseases - Pyrazolo[3,4-c] ring compounds of Formula (I), e.g., pyrazolo[3,4-c]pyridines, pyrazolo[3,4-c]quinolines, 6,7,8,9-tetrahydro pyrazolo[3,4-c]quinolines, and pyrazolo[3,4-c]naphthyridines, substituted at the 1-position, pharmaceutical compositions containing the compounds, intermediates, methods of making and methods of use of these compounds as immunomodulators, for inducing cytokine biosynthesis in animals and in the treatment of diseases including viral and neoplastic diseases are disclosed. | 06-25-2009 |
20110144099 | ARYLOXY AND ARYLALKYLENEOXY SUBSTITUTED IMIDAZOQUINOLINES - Imidazoquinoline compounds with an aryloxy or arylalkyleneoxy substituent at the 6, 7, 8, or 9-position, pharmaceutical compositions containing the compounds, intermediates, and methods of use of these compounds as immunomodulators, for modulating cytokine biosynthesis in animals and in the treatment of diseases including viral and neoplastic diseases, are disclosed. | 06-16-2011 |
20110245376 | NANOCALCITE COMPOSITES - Compositions comprising surface-modified nanocalcite particles dispersed in a curable resin, and to coatings and fibrous composites incorporating such compositions are described. The surface-modifying agents include a binding group ionically associated with the calcite and a compatiblizing segment, compatible with the curable resin. The surface-modifying agent may also include a reactive group capable of reacting with the curable resin. Methods of preparing nanocalcite composites and coating a fibrous composites prepared from such nanocalcite composites are also described. | 10-06-2011 |
20120214948 | SOLVENTLESS FUNCTIONALIZATION, MILLING, AND COMPOUNDING PROCESS WITH REACTIVE DILUENTS - Methods of compounding nanoparticles with a resin, e.g., a curable resin and one or more surface modifying agents are described. The methods use wet milling technology, including both continuous and batch milling processes, and can be used to functionalize the nanoparticles and disperse the functionalized nanoparticles into the resin system in a single process. Methods of compounding curable resin systems containing reactive diluents are also disclosed. | 08-23-2012 |
20120244338 | NANOCALCITE AND VINYL ESTER COMPOSITES - Compositions comprising surface-modified nanocalcite particles dispersed in a curable resin system comprising a vinyl ester, and coatings and fibrous composites incorporating such compositions are described. The surface-modifying agents include a binding group ionically associated with the calcite and a compatiblizing segment, compatible with the curable resin. The surface-modifying agent may also include a reactive group capable of reacting with the curable resin system. Methods of preparing nanocalcite composites and coating a fibrous composites prepared from such nanocalcite composites are also described. | 09-27-2012 |
20120245253 | HIGH MAGNESIUM SURFACE CONCENTRATION NANOCALCITE COMPOSITES - Compositions comprising surface-modified calcite nanoparticles dispersed in a curable resin and to coatings and fibrous composites incorporating such compositions are described. The nanocalcite particles have a high magnesium to calcium surface concentration ratio. The surface-modifying agents include a binding group ionically associated with the nanoparticles, and a compatiblizing segment compatible with the curable resin. The surface-modifying agent may also include a reactive group capable of reacting with the curable resin. Methods of preparing nanocalcite composites, and coatings and fibrous composites prepared from such nanocalcite composites are also described. | 09-27-2012 |
20130253139 | Dry, Surface-Modified Nanocalcite - Nanoparticle compositions including calcite and a surface-modifying agent bonded to the calcite are described. The surface-modifying agent includes a binding group bonded to the calcite and a compatiblizing segment. The compatiblizing segment includes at least one of a polyethylene oxide, a polypropylene oxide, a polyester, a polyamide, or a combination thereof. The composition includes less than 2 wt. % solvents and/or resins. Methods of preparing nanoparticle compositions are also described. | 09-26-2013 |
20150023990 | ALKOXY SUBSTITUTED IMIDAZOQUINOLINES - Imidazoquinoline compounds with an alkoxy substituent at the 6, 7, 8, or 9-position, pharmaceutical compositions containing the compounds, intermediates, methods of making, and methods of use of these compounds as immunomodulators, for inducing or inhibiting cytokine biosynthesis in animals and in the treatment of diseases including viral, and neoplastic, are disclosed. | 01-22-2015 |
Patent application number | Description | Published |
20080208128 | Peelable Atraumatic Tip and Body For a Catheter or Sheath - A splittable/peelable tubular body ( | 08-28-2008 |
20100217235 | Catheter and method of manufacture - The instant invention relates generally to introducer catheters used to help deliver catheters or other medical devices to locations within the human body. In particular, the instant invention relates to large diameter introducer catheters (introducer catheters with lumens greater than about | 08-26-2010 |
20110092911 | Splittable cannula having radiopaque marker - A splittable cannula includes a radiopaque marker placed at or near the distal end of the cannula. The radiopaque marker may be a unitary piece, or may consist of several portions. The cannula may include a sheath or catheter body with a grooved score line running along a portion of the sheath body and a radiopaque marker located at a distal end of the body and abutting the body. The radiopaque marker may be located within the lumen of the sheath, may be embedded in the sheath wall, or may be affixed to the external sheath wall. The radiopaque marker may be scored, notched, grooved, or contain apertures longitudinally. The notches, grooves, apertures, and/or score lines in both the sheath or catheter body and the radiopaque marker serve to provide a weakened tear path. An electrode lead may be coupled with the radiopaque marker. | 04-21-2011 |
20140157573 | METHOD OF MANUFACTURING A PEELABLE ATRAUMATIC TIP AND BODY FOR A CATHETER OR SHEATH - A method of manufacturing a splittable/peelable tubular body of a catheter or sheath wherein the tubular body has a splittable/peelable atraumatic tip is disclosed. The atraumatic tip is generally softer than the tubular body. The tubular body and atraumatic tip each comprise a peel mechanism longitudinally extending along their respective lengths. The peel mechanisms are formed by longitudinally extending regions of interfacial bonding between first and second longitudinally extending strips of polymer material. Each strip forms at least a portion of an outer circumferential surface of the tubular body and atraumatic tip. A region of stress concentration extends along the region of interfacial bonding. The stress concentration facilitates the splitting of the tubular body and atraumatic tip along their respective peel mechanisms. | 06-12-2014 |
20160114133 | Catheter and Method of Manufacture - The instant invention relates generally to introducer catheters used to help deliver catheters or other medical devices to locations within the human body. In particular, the instant invention relates to large diameter introducer catheters (introducer catheters with lumens greater than about 6 French) having increased strength, flexibility, and kink resistance. Introducer catheters according to the teachings herein may also include curved distal ends and flared (that is, funnel-like) transition sections within their lumens. | 04-28-2016 |
Patent application number | Description | Published |
20100023579 | DYNAMIC MEDIA BIT RATES BASED ON ENTERPRISE DATA TRANSFER POLICIES - In general, this disclosure describes techniques of dynamically selecting versions of media content based on data transfer policies of a media content provider that provides the media content. As described herein, a media content provider may establish a variety of data transfer policies for a variety of purposes. When requests are received, versions of media assets indicated by the requests are selected such that an overall bandwidth utilization of the media content provider is likely to be substantially equal to a desired bandwidth utilization established by one or more of the enterprise data transfer policies. | 01-28-2010 |
20100146145 | ADAPTIVE PLAYBACK RATE WITH LOOK-AHEAD - The disclosure provides for a download agent executing on a computing device to dynamically select between media files when a portion of the media file that is currently being downloaded has a portion average playback rate that is greater than a throughput rate at which the computing device is receiving media files. During the portion where the portion average playback rate is greater than the throughput rate, the download agent may dynamically transition to a different media file where the portion average playback rate for the portion is less than or equal to the throughput rate. The download agent may then transition back to the original media file after downloading the portion form the different media file. | 06-10-2010 |
20130132525 | ADAPTIVE PLAYBACK WITH LOOK-AHEAD - The disclosure provides for a download agent executing on a computing device to dynamically select between media files when a portion of the media file that is currently being downloaded has a portion average playback rate that is greater than a throughput rate at which the computing device is receiving media files. During the portion where the portion average playback rate is greater than the throughput rate, the download agent may dynamically transition to a different media file where the portion average playback rate for the portion is less than or equal to the throughput rate. The download agent may then transition back to the original media file after downloading the portion form the different media file. | 05-23-2013 |
20130254420 | DYNAMIC MEDIA BIT RATES BASED ON ENTERPRISE DATA TRANSFER POLICIES - In general, this disclosure describes techniques of dynamically selecting versions of media content based on data transfer policies of a media content provider that provides the media content. As described herein, a media content provider may establish a variety of data transfer policies for a variety of purposes. When requests are received, versions of media assets indicated by the requests are selected such that an overall bandwidth utilization of the media content provider is likely to be substantially equal to a desired bandwidth utilization established by one or more of the enterprise data transfer policies. | 09-26-2013 |
Patent application number | Description | Published |
20150039541 | Feature Extraction and Machine Learning for Evaluation of Audio-Type, Media-Rich Coursework - Conventional techniques for automatically evaluating and grading assignments are generally ill-suited to evaluation of coursework submitted in media-rich form. For courses whose subject includes programming, signal processing or other functionally expressed designs that operate on, or are used to produce media content, conventional techniques are also ill-suited. It has been discovered that media-rich, indeed even expressive, content can be accommodated as, or as derivatives of, coursework submissions using feature extraction and machine learning techniques. Accordingly, in on-line course offerings, even large numbers of students and student submissions may be accommodated in a scalable and uniform grading or scoring scheme. Instructors or curriculum designers may adaptively refine assignments or testing based on classifier feedback. Using developed techniques, it is possible to administer courses and automatically grade submitted work that takes the form of media encodings of artistic expression, computer programming and even signal processing to be applied to media content. | 02-05-2015 |
20150066820 | Feature Extraction and Machine Learning for Evaluation of Image-Or Video-Type, Media-Rich Coursework - Conventional techniques for automatically evaluating and grading assignments are generally ill-suited to evaluation of coursework submitted in media-rich form. For courses whose subject includes programming, signal processing or other functionally expressed designs that operate on, or are used to produce media content, conventional techniques are also ill-suited. It has been discovered that media-rich, indeed even expressive, content can be accommodated as, or as derivatives of, coursework submissions using feature extraction and machine learning techniques. Accordingly, in on-line course offerings, even large numbers of students and student submissions may be accommodated in a scalable and uniform grading or scoring scheme. Instructors or curriculum designers may adaptively refine assignments or testing based on classifier feedback. Using developed techniques, it is possible to administer courses and automatically grade submitted work that takes the form of media encodings of artistic expression, computer programming and even signal processing to be applied to media content. | 03-05-2015 |
Patent application number | Description | Published |
20090000185 | AVIATION-GRADE KEROSENE FROM INDEPENDENTLY PRODUCED BLENDSTOCKS - Aviation-grade kerosene comprising a first blendstock derived from non-petroleum feedstock and comprising primarily hydrocarbons selected from the group consisting of isoparaffins and normal paraffins, and a second blendstock comprising primarily hydrocarbons selected from the group consisting of cycloalkanes and aromatics. | 01-01-2009 |
20100113848 | PROCESS FOR THE CONVERSION OF RENEWABLE OILS TO LIQUID TRANSPORTATION FUELS - A method of producing a hydrocarbon product by hydrotreating a feedstock comprising triacylglyceride (TAG) in the presence of a nonsulfided hydrotreating catalyst to produce a first product comprising hydrocarbons. A method of producing a transportation fuel by selecting an undoped feedstock comprising virgin TAG, used TAG, or a combination thereof; hydrotreating the undoped feedstock in the presence of an unsulfided hydrotreating catalyst to produce a first product; and subjecting the first product to at least one process selected from aromatization, cyclization, and isomerization; to produce a second hydrocarbon product selected from gasoline, kerosene, jet fuel, and diesel fuels. | 05-06-2010 |
20110061290 | AVIATION-GRADE KEROSENE FROM INDEPENDENTLY PRODUCED BLENDSTOCKS - Aviation-grade kerosene comprising a first blendstock derived from non-petroleum feedstock and comprising primarily hydrocarbons selected from the group consisting of isoparaffins and normal paraffins, and a second blendstock comprising primarily hydrocarbons selected from the group consisting of cycloalkanes and aromatics. | 03-17-2011 |
20120083633 | OPTIMAL ENERGY PATHWAY TO RENEWABLE DOMESTIC AND OTHER FUELS - A novel, energy efficient process of producing jet fuel is disclosed herein. The process is based on utilizing a medium chain fatty acid source such as cuphea oil, which precludes the need for high-energy fatty acid chain cracking to achieve the shorter molecules needed for jet fuels and other fuels with low-temperature flow requirements. In an embodiment, a process for producing a jet fuel comprises providing a medium chain fatty acid source. The method also comprises cleaving the one or more medium chain fatty acid groups from the glycerides to form glycerol and one or more free fatty acids. The method further comprises decarboxylating the one or more medium chain fatty acids to form one or more hydrocarbons for the production of the jet fuel. | 04-05-2012 |
20120157733 | PROCESS FOR THE CONVERSION OF RENEWABLE OILS TO LIQUID TRANSPORTATION FUELS - A method of producing a hydrocarbon product by hydrotreating a feedstock comprising triacylglyceride (TAG) and TAG-derived materials such as free fatty acid (FFA) and fatty acid methyl ester (FAME) in the presence of a nonsulfided hydrotreating catalyst to produce a first product comprising hydrocarbons. A method of producing a transportation fuel by selecting an undoped feedstock comprising virgin TAG, used TAG, FFA, and FAME or a combination thereof; hydrotreating the undoped feedstock in the presence of an unsulfided hydrotreating catalyst to produce a first product and subjecting the first product to at least one process selected from aromatization, cyclization, and isomerization to produce a second hydrocarbon product selected from gasoline, kerosene, jet fuel, and diesel fuels. A method is described by which fatty acids may be converted to hydrocarbons suitable for use as liquid transportation fuels. Additionally, the method allows for the blending of fatty acids with TAGs, and the conversion of such blends to hydrocarbons suitable for use as liquid transportation fuels. The method utilizes a catalyst and hydrogen as reductant to convert fatty acids to hydrocarbons. Subsequent steps, including dewatering, isomerization, and distillation, can provide a hydrocarbon mixture useful as a liquid transportation fuel or as a blendstock with petroleum transportation fuels. | 06-21-2012 |
20120157734 | PROCESS FOR THE CONVERSION OF RENEWABLE OILS TO LIQUID TRANSPORTATION FUELS - The present invention relates to production of fuels or fuel blendstocks from renewable sources. Various embodiments provide a method of producing a hydrocarbon product by hydrotreating a feedstock including at least one of a renewable triacylglyceride (TAG), renewable free fatty acid (FFA), and renewable fatty acid C | 06-21-2012 |
20130072731 | PROCESS FOR THE CONVERSION OF RENEWABLE OILS TO LIQUID TRANSPORTATION FUELS - The present invention relates to production of fuels or fuel blendstocks from renewable sources. Various embodiments provide a method of producing a hydrocarbon product by hydrotreating a feedstock including at least one of a renewable triacylglyceride (TAG), renewable free fatty acid (FFA), and renewable fatty acid C | 03-21-2013 |
20140275670 | PROCESS FOR LOW-HYDROGEN-CONSUMPTION CONVERSION OF RENEWABLE FEEDSTOCKS TO ALKANES - A process relating to the manufacture of hydrocarbons, particularly paraffins/alkanes, from fatty acid feedstocks. More specifically, a process relating to the manufacture of paraffins/alkanes from fatty acid feedstocks comprising an olefinic bond saturation followed by a deoxygenation process carried out using decarboxylation achieving a maximum feedstock conversion to a paraffin product while consuming a minimum amount of hydrogen. | 09-18-2014 |