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Chaabouni
Hamed Chaabouni, Grenoble FR
| Patent application number | Description | Published |
|---|---|---|
| 20110018133 | ELECTRIC VIA WITH A ROUGH LATERAL SURFACE - A via connecting the front surface of a semiconductor substrate to its rear surface, this via having a rough lateral surface. | 01-27-2011 |
| 20110018139 | SCALLOPED TUBULAR ELECTRIC VIA - A via connecting the front surface of a substrate to its rear surface and having, in cross-section in a plane parallel to the surfaces, the shape of a scalloped ring. | 01-27-2011 |
| 20110018140 | ELECTRIC VIA COMPRISING LATERAL OUTGROWTHS - A via connecting the front surface of a substrate to its rear surface, this substrate including a porous region extending from at least a portion of the periphery of the via, the via including outgrowths extending in pores of the porous region. | 01-27-2011 |
| 20110079919 | ELECTRICAL CONNECTION VIA FOR THE SUBSTRATE OF A SEMICONDUCTOR DEVICE - An electrical connection via passing through a substrate for a semiconductor device is made of at least one conducting ring formed in an annular hole passing through the substrate. | 04-07-2011 |
| 20110079920 | ELECTRICAL CONNECTION VIA FOR THE SUBSTRATE OF A SEMICONDUCTOR DEVICE - An electrical connection via is formed through a substrate to make an electrical connection from one face of the substrate to the other. The via includes a ring made of an electrically conductive material. The ring is formed in a hole in the substrate so as to at least partly form the via. | 04-07-2011 |
| 20110086468 | ASSEMBLY OF SEMICONDUCTOR CHIPS/WAFERS - A method for assembling a first semiconductor chip provided with pads on a second semiconductor chip or wafer provided with pads, comprising covering the chip(s) with a dielectric, superposing the two chips, the pads being arranged substantially opposite to each other, and applying a voltage difference between the pads of the first and second chips to cause a breakdown of the dielectric and a diffusion of the conductor forming the pads into the broken down areas, whereby a conductive path forms between the opposite pads. | 04-14-2011 |
Hassan Chaabouni, Kalimantan Timur ID
| Patent application number | Description | Published |
|---|---|---|
| 20090101343 | HIGH RATE GRAVEL PACKING - A method of gravel packing a portion of a cased wellbore proximate perforations by using coiled tubing is disclosed. The portion of the wellbore containing perforations is isolated from the portion of the wellbore below the perforations. A connection apparatus is installed between a bottom hole assembly and the coiled tubing and this connection apparatus comprises a crossover tool. The bottom hole assembly is lowered into the wellbore using the coiled tubing until the bottom hole assembly is proximate the perforations. Then, a slurry comprising a gravel and a carrier fluid is pumpdown the coiled tubing and into the annulus between the coiled tubing and the casing. A second fluid which is compatible with the slurry is pumpdown the annulus between the coiled tubing and the casing while the slurry is above the connection apparatus between the bottom hole assembly and the coiled tubing. The second fluid and the slurry mixture reduce the slurry concentration prior to reaching the perforations. | 04-23-2009 |
Hassan Chaabouni, Tunis TN
| Patent application number | Description | Published |
|---|---|---|
| 20110284222 | CHELANT BASED SYSTEM AND POLYLACTIDE RESIN FOR ACID DIVERSION - Compositions and methods for treating a subterranean formation including forming a fluid comprising chelant and polylactide resin fiber; and introducing the fluid to a subterranean formation, wherein the temperature of the formation is about 300° F. or warmer. Compositions and methods for treating a subterranean formation including forming a fluid comprising viscoelastic surfactant, trisodium hydroxyethylethylenediamine-triacetate and polylactide resin fiber; and introducing the fluid to a subterranean formation, wherein the temperature of the formation is about 300° F. or warmer. | 11-24-2011 |
Rafik Chaabouni, Vesenaz CH
| Patent application number | Description | Published |
|---|---|---|
| 20090300347 | SET MEMBERSHIP PROOFS IN DATA PROCESSING SYSTEMS - A method and apparatus for proving and a method and apparatus for verifying that a secret value is a member of a predetermined set of values. The proving mechanism receives a set of signatures which has respective values in the predetermined set signed using a private key. The proving mechanism sends to the verifying mechanism a commitment on the secret value of the proving mechanism. The proving mechanism and verifying mechanism then communicate to implement a proof of knowledge protocol demonstrating knowledge by the proving mechanism of a signature on the secret value committed to in the commitment, thus proving that the secret value is a member of the predetermined set. | 12-03-2009 |