| Patent application number | Description | Published |
|---|
| 20090042334 | CMOS image sensor and method for fabricating the same - A CMOS image sensor includes a substrate including silicon, a silicon germanium (SiGe) epitaxial layer formed over the substrate, the SiGe epitaxial layer formed through epitaxial growth and doped with a predetermined concentration level of impurities, an undoped silicon epitaxial layer formed over the SiGe epitaxial layer by epitaxial growth, and a photodiode region formed from a top surface of the undoped silicon epitaxial layer to a predetermined depth in the SiGe epitaxial layer. | 02-12-2009 |
| 20090286345 | Image sensor and method for fabricating the same - An image sensor includes a first conductivity type substrate with a trench formed in a predetermined portion thereof, a second conductivity type impurity region formed in the first conductivity type substrate below the trench and being a part of a photodiode, a second conductivity type first epitaxial layer filling the trench and being a part of the photodiode, and a first conductivity type second epitaxial layer formed over the second conductivity type first epitaxial layer. | 11-19-2009 |
| 20090311854 | METHOD FOR FORMING GATE OF SEMICONDUCTOR DEVICE - A method for forming a triple gate of a semiconductor device is provided. The method includes: forming a buffer layer and a hard mask over a substrate; etching the hard mask and the buffer layer to form a hard mask pattern and a buffer pattern; forming first and second trenches spaced apart within the substrate by partially etching the substrate by a vapor etching process using the hard mask pattern as an etching barrier layer; forming a buried insulation layer to fill the first and second trenches; removing the hard mask pattern and the buffer pattern; forming a gate insulation layer over the substrate between the first trench and the second trench; forming a conductive layer to cover the gate insulation layer; and etching the conductive layer to form a gate electrode. | 12-17-2009 |
| 20100038691 | IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME - An image sensor and a method for fabricating the same are provided. The image sensor includes a first conductive type substrate including a trench formed in a predetermined portion of the first conductive type substrate, a second conductive type impurity region for use in a photodiode, formed below a bottom surface of the trench in the first conductive type substrate, and a first conductive type epitaxial layer for use in the photodiode, buried in the trench. | 02-18-2010 |
| 20100047951 | IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME - An image sensor and a method for fabricating the same are provided. The image sensor includes a first conductive type substrate including a trench formed in a predetermined portion of the first conductive type substrate, a second conductive type impurity region for use in a photodiode, formed below a bottom surface of the trench in the first conductive type substrate, and a first conductive type epitaxial layer for use in the photodiode, buried in the trench. | 02-25-2010 |
| 20100062576 | METHOD FOR FABRICATING CMOS IMAGE SENSOR WITH PLASMA DAMAGE-FREE PHOTODIODE - A method for fabricating a complementary metal-oxide semiconductor (CMOS) image sensor includes providing a semi-finished substrate, forming a patterned blocking layer over a photodiode region of the substrate, implanting impurities on regions other than the photodiode region using a mask while the patterned blocking layer remains, and removing the mask. | 03-11-2010 |
| 20100155728 | EPITAXIAL WAFER AND METHOD FOR FABRICATING THE SAME - An epitaxial wafer and method for fabricating the same can prevent a bowing phenomenon of the epitaxial wafer. The epitaxial wafer includes a substrate configured to be doped in a first doping concentration; an epitaxial layer configured to be formed over a first side of the substrate and doped in a second doping concentration lower than the first doping concentration; and a back seal layer configured to be formed over a second side of the substrate and include a layer having a tensile stress, wherein the second side is opposite to the first side, of the substrate. | 06-24-2010 |
