| Patent application number | Description | Published |
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| 20100237974 | IMPEDANCE TRANSFORMER AND APPLICATIONS THEREOF - An impedance transformer includes a first winding and a second winding. The first winding includes a first plurality of winding components, wherein each of the first plurality of winding components is on a corresponding layer of a first set of layers of a supporting substrate. The second winding includes a second plurality of winding components, wherein each of the second plurality of winding components is on a corresponding layer of a second set of layers of the supporting substrate and the first and second sets of layers are interleaved. The first winding has a first impedance within a desired frequency range and the second winding has a second impedance within the desired frequency range, where the first and second impedances are based on at least one of spacing, trace width, and trace length of the first and second plurality of winding components. | 09-23-2010 |
| 20100245191 | MULTIPLE MODE RF TRANSCEIVER AND ANTENNA STRUCTURE - An antenna structure includes first and second antennas. The first antenna has a first geometry corresponding to a first frequency. The second antenna has a second geometry corresponding to a second frequency. The second antenna is proximal to the first antenna and utilizes electrical-magnetic properties of the first antenna to transceive signals at the second frequency. | 09-30-2010 |
| 20110133835 | DOUBLE TRANSFORMER BALUN FOR MAXIMUM POWER AMPLIFIER POWER - Double transformer balun for maximum PA (Power Amplifier) power. A novel approach is presented herein by which conversion from a differential signal to single-ended signal may be achieved using a double transformer balun design. The secondary coils of the double transformer balun also operate as a choke for the PA supply voltage. The secondary coils can operate as an RF (Radio Frequency) trap or choke to keep any AC (Alternating Current) signal components and to pass any DC (Direct Current) components. By using a double transformer balun design, relatively thinner tracks may be employed thereby ensuring a high degree of electromagnetic coupling efficiency and high performance. Also, these relatively thinner tracks consume a relatively small amount of space on the die. The double transformer balun design also includes a matching Z (impedance) block that is operable to match the Z of an antenna or line that the PA is driving. | 06-09-2011 |
| 20110182218 | Wireless Bus for Intra-Chip and Inter-Chip Communication, Including Adaptive Link and Route Embodiments - Embodiments of the present invention are directed to a wireless bus for intra-chip and inter-chip communication having adaptable links and routes among wireless-enabled components (WECs) of the wireless bus. Links and routes may be adapted according to one or more of, among other factors, the relative position of WECs, available capabilities (e.g., communication capabilities) at WECs, availability of resources at WECs, and the physical environment. | 07-28-2011 |
| 20110183604 | Creating A System On The Fly And Applications Thereof - Disclosed herein are systems, apparatuses, and methods for creating a system of wireless-enabled components (WECs). Such a system includes a server and a plurality of wireless-enabled component (WECs). Each WEC includes a functional resource (e.g., a processing resource and/or a memory resource) and is configured for wireless communication with the server and one or more other WECs. A first WEC is configured to wirelessly upload, to the server, an availability of the functional resource of the first WEC. The first WEC is further configured to wirelessly download, from the server, a linking resource for linking with one or more of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices. | 07-28-2011 |
| 20110183610 | Proximity Coupling Without Ohmic Contact and Applications Thereof - Disclosed herein are systems, apparatuses, and methods for providing a proximity coupling without Ohmic contact. Such a system includes a plurality of wireless-enabled components (WECs) that are wirelessly coupled to each other. Each WEC includes a metal-based element, a substrate, and a semiconductor layer that separates the metal-based element from the substrate. A signal is configured to be transmitted via a proximity coupling (e.g., a magnetic coupling, an electric coupling, and/or an electromagnetic coupling) between the metal-based element and the substrate without an Ohmic contact between the metal-based element and the substrate. In an example, a first subset of the plurality of the WECs is co-located on a first chip, and a second subset of the plurality of the WECs is co-located on a second chip. The first chip and the second chip may be located in a single device or in separate devices. | 07-28-2011 |
| 20110183615 | System Having Co-Located Functional Resources Amd Applications Thereof - Disclosed herein are systems, apparatuses, and methods for wirelessly coupling functional resources. Such a system includes a plurality of co-located, wireless-enabled functional units of a first type and a plurality of co-located, wireless-enabled functional units of a second type. At least one of the wireless-enabled functional units of the first type is wirelessly coupled with one or more of the wireless-enabled functional units of the second type. The wireless-enabled functional units of the first type may be wireless-enabled processing units, and the wireless-enabled functional units of the second type may be wireless-enabled memory units. In an example, the plurality of wireless-enabled functional units of the first type are co-located on a first chip, and the plurality of wireless-enabled functional units of the second type are co-located on a second chip. The first chip and the second chip may be located in a single device or in separate devices. | 07-28-2011 |
| 20110183616 | Wireless Bus for Intra-Chip and Inter-Chip Communication, Including Scalable Wireless Bus Embodiments - Embodiments of the present invention are directed to a scalable wireless bus for intra-chip and inter-chip communication. The scalable wireless bus includes a plurality of wireless-enabled components (WECs). In an embodiment, the scalable wireless bus may have at least one of the number of links among WECs and the capacity of said links adapted based on one or more factors. For example, the number of links and the capacity of the links may be adapted according to one or more of, among other factors, expected activity level over the wireless bus, desired power consumption, delay, and interference levels. | 07-28-2011 |
| 20110183617 | Establishing A Wireless Communications Bus And Applications Thereof - Disclosed herein are systems, apparatuses, and methods for establishing wireless communications among a plurality of wireless-enabled components (WECs), and applications thereof. Such a system includes a plurality of WECs, each configured to transmit and receive over a wireless bus. The wireless bus includes (i) a first channel to identify proximally located WECs and (ii) a second channel to support communications among the proximally located WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips across multiple devices. | 07-28-2011 |
| 20110183630 | Wireless Bus for Intra-Chip and Inter-Chip Communication, Including Wireless-Enabled Component (WEC) Embodiments - Embodiments of the present invention are directed to a wireless-enabled component (WEC) for enabling a wireless bus for intra-chip and inter-chip communication. A WEC encompasses a functional block of an IC (such as, for example, a processing core of a processing unit), an entire IC (such as, for example, a processing unit), or a device that includes a plurality of ICs (such as, for example, a handheld device). According to embodiments, a WEC may be associated with one or more sub-blocks of an IC, a single IC, or a plurality of ICs. | 07-28-2011 |
| 20110183699 | Wireless bus for intra-chip and inter-chip communication, including resource borrowing embodiments - Embodiments of the present invention are directed to a wireless resource borrowing environment enabled by a wireless bus comprising a plurality of wireless-enabled components (WECs). In an embodiment, the WECs use the wireless bus to share resource information (including resource availability information) among each others. For example, a WEC may share with other WECs information regarding its processing and memory resources. The WEC may then use the shared resource information to identify resources at other WECs that it may borrow to perform certain tasks. In an embodiment, resource borrowing is performed according to a cost-based method which optimizes resource borrowing according to a cost function. The cost function may be designed to optimize resource borrowing according to any combination of one or more factors, including power consumption, processing speed, delay, interference, error rate, reliability, load at the lender WEC, computing capability at the lender WEC, etc. | 07-28-2011 |
| 20110185091 | Wireless Bus for Intra-Chip and Inter-Chip Communication, Including Data Center/Server Embodiments - Embodiments of the present invention are directed to a wire-free data center/server. The data center/server is wire-free in the sense that communication within a data unit of the data center/server (i.e., intra-data unit), between data units of the data center/server (inter-data unit), and between the data units and the backplane of the data center/server is performed wirelessly. | 07-28-2011 |
| 20110185092 | Configurable System of Wireless-Enabled Components And Applications Thereof - Disclosed herein is a configurable system of wireless-enabled components (WECs) and applications thereof. The system includes a plurality of WECs and a controller. Each WEC comprises a functional resource and is adapted to wirelessly communicate with other WECs. The controller is adapted to dynamically configure the functional resource of each WEC and wireless communications among the plurality of WECs to form a field-programmable communications array. The controller may be one of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices. | 07-28-2011 |
