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Casimer Decusatis, Poughkeepsie US

Casimer Decusatis, Poughkeepsie, NY US

Patent application numberDescriptionPublished
20080218869INJECTION MOLDED MICROLENSES FOR OPTICAL INTERCONNECTS - Disclosed are a microlens array, and a method of positioning and aligning the microlens array on another device. Generally, the microlens array comprises an array of injection molded microlens elements, and a supporting flange. Each of the microlens elements has a generally spheroid or spherical shape, and the supporting flange connects together the array of microlens elements to facilitate positioning that array of lenses on a printed circuit board, semiconductor package or wafer. This array is well suited for use with vertical cavity surface emitting lasers (VCSELs); and, in particular, the preferred embodiment of the invention addresses the problem of VCSEL laser array alignment by using arrays of microlenses elements fabricated by injection molding.09-11-2008
20080285136INJECTION MOLDED MICROOPTICS - A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught. 11-20-2008
20080310799HYBRID OPTICAL/ELECTRONIC STRUCTURES FABRICATED BY A COMMON MOLDING PROCESS - Disclosed is a method of fabricating a molded structure including both micro lenses and metallic pins. The method comprises the steps of providing a mold apparatus having a set of first cavities and a set of second cavities, depositing a first material in the first cavities to form a set of metallic pins, and depositing a second material in the second cavities to form a set of micro lenses. The formed molded structure comprises a substrate, a set of molded microlenses on said substrate, and a set of molded metallic pins on that same substrate. The metallic pins may be formed as alignment pins or as electrical connectors. The invention enables the micro lenses and metallic pins to be manufactured by way of molding on a common substrate for the first time.12-18-2008
20090059916METHOD, SYSTEM, AND APPARATUS FOR RELIABLE DATA PACKET RECOVERY IN A LINK LAYER OF A DATA CENTER ETHERNET NETWORK - Dropped packets are recovered in a link layer of a Data Center Ethernet (DCE) network. Data packets for transmission are stored in a replay buffer. Each data packet includes a header having a field including data indicating that the data packet is formatted for reliable recovery at the link layer. The data packets are transmitted to a receiver across a link layer in the DCE network. The receiver determines whether a data packet has been dropped. If a data packet has not been dropped, an acknowledgement signal is sent to the transmitter in another data packet across the link layer, indicating that the data packet has been received. If a data packet has been dropped, a non-acknowledgement signal is sent to the transmitter in the other data packet across the link layer, indicating that the data packet has been dropped. In response to receipt of the non-acknowledgement signal or no receipt of an acknowledgement signal after the timeout period, the dropped data packet is retrieved from the replay buffer and is resent to the receiver across the link layer.03-05-2009
20090080334METHOD, SYSTEM, AND COMPUTER PROGRAM PRODUCT FOR ADAPTIVE CONGESTION CONTROL ON VIRTUAL LANES FOR DATA CENTER ETHERNET ARCHITECTURE - Congestion is adaptively controlled in a data center Ethernet (DCE) network. Packets are received over at least one virtual lane in the DCE network. An absolute or relative packet arrival rate is computed over a time period. The absolute or relative packet arrival rate is compared to at least a first threshold and a second threshold. If the absolute or relative packet arrival rate increases beyond the first threshold, the packet transmission rate is caused to decrease. If the absolute or relative packet arrival rate is less than a second threshold, the packet transmission rate is caused to increase.03-26-2009
20090086635METHOD, SYSTEM, AND APPARATUS FOR FLOW CONTROL MANAGEMENT IN A DATA CENTER ETHERNET NETWORK OVER AN EXTENDED DISTANCE - Flow control in a data center Ethernet (DCE) network is managed between a source node and a destination node separated by an extended distance. An initiation sequence between the source node and the destination node is intercepted. The imitation sequence is for determining buffer credits available for receiving packets in the source node and the destination node. Replies are generated to the source node and the destination node indicating buffer credits available in at least one extended data interface interspersed between the source node and the destination node. The initiation sequence is completed based on the replies from the extended data interface.04-02-2009
20090086637METHOD, SYSTEM, AND APPARATUS FOR ACCELERATING RESOLUTION OF NETWORK CONGESTION - The response time for resolving network traffic congestion is accelerated in a Data Center Ethernet (DCE) network. A data packet is received at a node in the network. Congestion of the data packet at the node is detected, and a backward congestion notification signal for the data packet is generated. A packet injection rate is adapted based on at least one of the backward congestion notification signal generated by the node and another backward congestion notification signal.04-02-2009
20090210770METHOD, SYSTEM AND COMPUTER PROGRAM PRODUCT FOR END TO END ERROR CHECKING IN ETHERNET - A method for network protocol error correction comprising, generating a data packet including a cycle redundancy check (CRC) field, an end to end error field that remains unchanged as the data packet is sent over a network, for use in performing error detection in one or more field of the data packet, and a flag field associated with the end to end field to indicate that the end to end error field contains error correction data, and sending the data packet over a network via an Ethernet protocol.08-20-2009
20090238068METHOD, SYSTEM AND COMPUTER PROGRAM PRODUCT INVOLVING CONGESTION AND FAULT NOTIFICATION IN ETHERNET - A method for sending congestion notifications from a node in an Ethernet protocol including, determining whether the node is congested, generating a congestion message including a unique identifier of the node, responsive to determining that the node is congested, and sending the congestion message to a source transmitter.09-24-2009
20090238211METHOD, SYSTEM AND COMPUTER PROGRAM PRODUCT INVOLVING CONGESTION DETECTION IN ETHERNET - A method for determining data packet transmission times in an Ethernet protocol including, receiving a first data packet having a first data packet send time, wherein the first data packet send time is a time the data packet is sent by a source transmitter, subtracting the first data packet send time from a first data packet receive time to yield a first data packet transmission time, wherein the first data packet receive time is the time the data packet is received by a destination receiver, comparing the first data packet transmission time to a third time, determining whether a difference between the first data packet transmission time and the third time exceeds a threshold value, and sending a notification of a transmission delay responsive to determining that the difference between the first data packet transmission time and the third time exceeds the threshold value.09-24-2009
20090245789Methods and Apparatus for Optical Modulation Amplitude Measurement - Techniques for measuring optical modulation amplitude (OMA) are disclosed. For example, a technique for measuring an OMA value associated with an input signal includes the following steps/operations. The input signal is applied to a photodetector, wherein the photodetector is calibrated to have a given responsivity value R, and further wherein the photodetector generates an output signal in response to the input signal. The output signal from the photodetector is applied to a radio frequency (RF) power meter, wherein the RF power meter measures the root mean squared (RMS) power value of the output signal received from the photodetector. The OMA value associated with the input signal is determined in response to the root mean squared (RMS) power value measured by the RF power meter. The OMA value may be determined as a function of a factor F derived from a relationship between an amplitude of a data signal and the RMS value of the data signal.10-01-2009
20100265507INJECTION MOLDED MICROLENSES FOR OPTICAL INTERCONNECTS - Disclosed are a microlens array, and a method of positioning and aligning the microlens array on another device. Generally, the microlens array comprises an array of injection molded microlens elements, and a supporting flange. Each of the microlens elements has a generally spheroid or spherical shape, and the supporting flange connects together the array of microlens elements to facilitate positioning that array of lenses on a printed circuit board, semiconductor package or wafer. This array is well suited for use with vertical cavity surface emitting lasers (VCSELs); and, in particular, the preferred embodiment of the invention addresses the problem of VCSEL laser array alignment by using arrays of microlenses elements fabricated by injection molding.10-21-2010

Patent applications by Casimer Decusatis, Poughkeepsie, NY US