Casey, NY
Bj Casey, New York, NY US
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20120322068 | METHOD FOR IDENTIFYING INCREASED RISK OF ANXIETY DISORDERS - The present invention is for methods for identifying a human having an increased risk for anxiety disorders. The method involves genotyping the human for a specific brain-derived neurotrophic factor (BDNF) single nucleotide polymorphism (SNP), and/or administering a fear conditioning procedure while measuring fear, and administering an extinction procedure while measuring fear. The method can also involve comparing/MRI images of the amygdala of the human acquired during conditioning and extinction and determining if the human is unresponsive to extinction therapy by noting heightened and non-declining activity in the amygdala during extinction. | 12-20-2012 |
Brendan C. Casey, Webster, NY US
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20110063359 | Real Time Bleed-Though Detection for Continuous Web Printers - An imaging device includes a substantially continuous web of media; a web transport system configured to transport the continuous web along a web path; and a print station positioned along the web path and configured to apply ink to a first side of the continuous web to form images thereon. An image sensor is positioned downstream from the print station along the web path to scan a second side of the continuous web opposite from the first side. The image sensor is configured to generate a reflectance signal indicative of a reflectance of light from the second side of the continuous web. A controller is operably coupled to receive the reflectance signal from the image sensor, and to adjust at least one print process parameter based on the reflectance signal while the imaging device is performing print operations. | 03-17-2011 |
Christine T. Casey, Endicott, NY US
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20090113161 | METHOD, APPARATUS AND PROGRAM PRODUCT FOR MANAGING MEMORY IN A VIRTUAL COMPUTING SYSTEM - A method for managing memory in a virtual computing system is provided. The method comprises providing updated monitor data for a plurality of data domains in the virtual computing system and determining based upon the updated monitor data provided whether there is a memory constraint in a memory of the virtual computing system. Further, the method comprises calculating based upon the updated monitor data, when the memory constraint is determined, a total release-amount of the memory that is to be released by the virtual computing system in order to relieve the memory constraint and issuing a notification to release the total release-amount of the memory in order to relieve the memory constraint. The method further comprises assessing based upon the updated monitor data, when the memory constraint is ended, a reuse-amount that can be reused by the plurality of virtual guests. | 04-30-2009 |
Elaine Casey, New York, NY US
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20110095058 | CLOSURE FOR A CONTAINER - A closure for a container, and a container incorporating the same, that minimizes or eliminates leakage between the closure and the container holding the liquid. The closure provides a liquid sealing system that allows irregularly shaped closure tops to be used without sacrificing the effectiveness of the liquid seal. In one embodiment, the closure includes a plurality of struts disposed within an annular space that receives a neck portion of the container to create a seating plane that corresponds to a plane formed by the rim of the neck portion. | 04-28-2011 |
Janet Casey, Pittsford, NY US
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20130156803 | COMPOSITIONS AND METHODS RELATED TO P6 - Disclosed are compositions and methods related to vaccination for AOM and children prone to AOM. | 06-20-2013 |
20140314803 | COMPOSITIONS AND METHODS RELATED TO P6 - Disclosed are compositions and methods related to vaccination for AOM and children prone to AOM. | 10-23-2014 |
Jon Casey, Poughkeepsie, NY US
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20090032962 | CENTRIFUGAL METHOD FOR FILING HIGH ASPECT RATIO BLIND MICRO VIAS WITH POWDERED MATERIALS FOR CIRCUIT FORMATION - The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component. | 02-05-2009 |
Jon A. Casey, Pooghkeepsie, NY US
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20150094995 | Managing Interconnect Electromigration Effects - A mechanism is provided for determining a modeled age of a set of interconnect groups in a set of cores in a set of multi-core processors. For each interconnect group in the set of interconnect groups in the set of cores on the set of multi-core processors, a determination is made of a current modeled age of the interconnect group. A determination is then made as to whether at least one current modeled age of the interconnect group for the set of interconnect groups is greater than an end-of-life value. Responsive to at least one current modeled age of the interconnect group being greater than the end-of-life value, an indication to take corrective action with the at least one associated interconnect group is sent. | 04-02-2015 |
Jon A. Casey, Poughkeepsie, NY US
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20100049466 | Tracking Thermal Mini-Cycle Stress - Monitoring temperature excursions an assembly experiences over a life of the assembly is provided. A determination is made as to whether the assembly has been in service beyond a predetermined end of life objective. Responsive to the assembly failing to be in service beyond the predetermined end of life objective, a new temperature value associated with the assembly is read. A modifier value for a figure of merit (FOM) value is computed and added to a cumulative figure of merit value. The cumulative figure of merit value is compared to a cumulative stress figure of merit budget. Responsive to the cumulative figure of merit value exceeding the cumulative stress figure of merit budget, an identified stress management solution is implemented. | 02-25-2010 |
20100049995 | Enhanced Thermal Management for Improved Module Reliability - Mitigating effects of delamination of components in the data processing system is provided. A signal is received from one or more sensors in the data processing system. A determination is made as to whether the signal indicates that one threshold in a plurality of thresholds has been reached or exceeded. Responsive to the signal indicating that one threshold in the plurality of thresholds has been reached or exceeded, a determination is made as to whether the one threshold is a low temperature threshold or a high temperature threshold. Responsive to the one threshold being a low temperature threshold, one of a plurality of actions is initiated to increase a temperature of the data processing system thereby mitigating effects of delamination of the components in the data processing system. | 02-25-2010 |
20100181665 | System and Method of Achieving Mechanical and Thermal Stability in a Multi-Chip Package - A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package. | 07-22-2010 |
20110121469 | PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INTEGRITY IN PACKAGED ASSEMBLIES - A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material. | 05-26-2011 |
20120175766 | SYSTEM AND METHOD OF ACHIEVING MECHANICAL AND THERMAL STABILITY IN A MULTI-CHIP PACKAGE - A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package. | 07-12-2012 |
20120228748 | PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INTEGRITY IN PACKAGED ASSEMBLIES - A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material. | 09-13-2012 |
20140024465 | ELECTRONIC DEVICE CONSOLE WITH NATURAL DRAFT COOLING - An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation. | 01-23-2014 |
Jon Alfred Casey, Poughkeepsie, NY US
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20090032909 | SEMICONDUCTOR CHIPS WITH CRACK STOP REGIONS FOR REDUCING CRACK PROPAGATION FROM CHIP EDGES/CORNERS - Structures and a method for forming the same. The structure includes a semiconductor substrate, a transistor on the semiconductor substrate, and N interconnect layers on top of the semiconductor substrate, N being a positive integer. The transistor is electrically coupled to the N interconnect layers. The structure further includes a first dielectric layer on top of the N interconnect layers and P crack stop regions on top of the first dielectric layer, P being a positive integer. The structure further includes a second dielectric layer on top of the first dielectric layer. Each crack stop region of the P crack stop regions is completely surrounded by the first dielectric layer and the second dielectric layer. The structure further includes an underfill layer on top of the second dielectric layer. The second dielectric layer is sandwiched between the first dielectric layer and the underfill layer. | 02-05-2009 |
20090214780 | Negative Coefficient of Thermal Expansion Particles and Method of Forming the Same - A negative coefficient of thermal expansion particle includes a first bilayer having a first bilayer inner layer and a first bilayer outer layer, and a second bilayer having a second bilayer inner layer and a second bilayer outer layer. The first and second bilayers are joined together along perimeters of the first and second bilayer outer layers and first and second bilayer inner layers, respectively. The first bilayer inner layer and the second bilayer inner layer are made of a first material and the first bilayer outer layer and the second bilayer outer layer are made of a second material. The first material has a greater coefficient of thermal expansion than that of the second material. | 08-27-2009 |
20100233872 | SEMICONDUCTOR CHIPS WITH CRACK STOP REGIONS FOR REDUCING CRACK PROPAGATION FROM CHIP EDGES/CORNERS - A chip fabrication method. A provided structure includes: a transistor on a semiconductor substrate, N interconnect layers on the semiconductor substrate and the transistor (N>0), and a first dielectric layer on the N interconnect layers. The transistor is electrically coupled to the N interconnect layers. P crack stop regions and Q crack stop regions are formed on the first dielectric layer (P, Q>0). The first dielectric layer is sandwiched between the N interconnect layers and a second dielectric layer that is formed on the first dielectric layer. Each P crack stop region is completely surrounded by the first and second dielectric layers. The second dielectric layer is sandwiched between the first dielectric layer and an underfill layer that is formed on the second dielectric layer. Each Q crack stop region is completely surrounded by the first dielectric layer and the underfill layer. | 09-16-2010 |
20120098116 | MULTI-CHIP MODULE SYSTEM WITH REMOVABLE SOCKETED MODULES - A multi-chip module (MCM) includes chip sub-modules that are fabricated as self-contained testable entities. The chip sub-modules plug into respective sockets in a frame of the MCM. Each chip sub-module may be tested before being plugged into the MCM. A chip sub-module may include an IC chip, such as a processor, mounted to an sub-module organic substrate that provides interconnects to the chip. The frame into which each chip sub-module plugs sits on a mini-card organic substrate that interconnects the chip sub-modules together. The MCM may include a downstop between the mini-card organic substrate and a system board to limit or prevent solder creep of solder connections between the mini-card organic substrate and the system board. | 04-26-2012 |
Kathleen Casey, New York, NY US
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20100025934 | PORTABLE COOLER AND GAME ASSEMBLY - A portable cooler and game assembly includes a cooler attached to a collapsible stand, a frame attached to the cooler capable of extending above the cooler, and a game board attached to the frame. The game board includes one or more catch nets attached to one or more toss holes contained within the game board. A side net is attached to the cooler for retaining a set of playing objects. The assembly also includes a carrying bag for holding the cooler, frame, game board, and playing objects. | 02-04-2010 |
Leslie S. Casey, New York, NY US
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20090010928 | Anti-anthrax antibody, formulations thereof, and methods of use - The present invention provides an antibody which binds to | 01-08-2009 |
20120156196 | ANTI-ANTHRAX ANTIBODY, FORMULATIONS THEREOF, AND METHODS OF USE - The present invention provides an antibody which binds to | 06-21-2012 |
Michael Allen Casey, Port Washington, NY US
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20090317356 | Composition and method for repelling mammals - A composition that first attracts then repels mammals, which is delivered via an easy-to-use open container, or on a transportable flat surface. The open container or transportable flat surface holding the composition may be placed near, in or on an object or area to be protected. The composition maintains its effectiveness over an extended period of time, in varying climates and weather conditions. | 12-24-2009 |
Ryan Casey, New York, NY US
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20150015252 | Methods and Kits for Detecting Non-Luminescent or Weakly Luminescent Metals - The invention provides methods and kits for detecting the presence of, the amount of or the concentration of a substantially non-emitting metal in a sample by a) providing a sensitizer to a chelator of the substantially non-emitting metal thereby creating a sensitized-metal complex; b) adding an unsensitized chelate, and c) detecting a signal from the unsensitized chelate. The substantially non-emitting metal may be gadolinium and may exist in complex with a chelator. The unsensitized chelate may be terbium (Tb) or europium (Eu), and the detecting a signal may be performed by fluorescence. | 01-15-2015 |
Stefan Casey, Clifton Park, NY US
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20090289197 | GAS DELIVERY SYSTEM FOR AN ION SOURCE - An ion source has an arc chamber with an electron-emitting element and a repeller. A manifold assembly defines a cavity and a gas outlet configured to allow gas flow to the arc chamber. This gas outlet is closer to the repeller than the electron-emitting element. In one embodiment, the ion source has a first crucible and a second crucible. The first crucible and the second crucible are connected to the manifold assembly. In one instance, the crucibles have tamper-resistant features. | 11-26-2009 |