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Carpio
Francisco Carpio, Overland Park, KS US
| Patent application number | Description | Published |
|---|---|---|
| 20080297164 | WIRING ANALYZER ADAPTER - An adapter for connecting a wiring cable to be tested to a wiring analyzer. The adapter includes a body; a first set of contacts positioned on a first side of the body for electrically connecting with the wiring analyzer; and a second set of contacts positioned on a second side of the body and electrically connected to the first set of contacts for connecting with a connector on the cable to be tested. The first and second sides of the body are less than 4 inches apart so that the first set of contacts is positioned less than 4 inches from the second set of contacts. The body may include hanging structure for hanging the adapter on an interface of the wiring analyzer and a latch for securing the adapter to the interface. | 12-04-2008 |
Raul E. Carpio, Hampshire GB
| Patent application number | Description | Published |
|---|---|---|
| 20110053605 | MOBILE STATION, WIRELESS COMMUNICATION SYSTEM AND METHOD OF OPERATION - A mobile station ( | 03-03-2011 |
Raul R. Carpio, Hampshire GB
| Patent application number | Description | Published |
|---|---|---|
| 20110151891 | COMMUNICATION SYSTEM AND A MOBILE STATION, PROXY LOCATION SERVER AND METHOD OF OPERATION FOR USE IN THE SYSTEM - A communication system ( | 06-23-2011 |
Ronald Carpio, Austin, TX US
| Patent application number | Description | Published |
|---|---|---|
| 20090163114 | Systems and Methods for Dynamic Slurry Blending and Control - Systems and methods for dynamic slurry blending and control are described. A method comprises applying a slurry to a wafer during a polishing process, detecting a wafer property during the polishing process, and changing a slurry property during the polishing process based, at least in part, upon the detected wafer property. In another embodiment, a system comprises a slurry mixer, a polisher coupled to the slurry mixer via a slurry feeder, the polisher being configured to receive a slurry from the slurry mixer via the slurry feeder and to apply the slurry to a wafer during a polishing process, and a computer coupled to the slurry mixer and to the polisher, the computer being configured to receive a signal indicative of a detected wafer property and to control the slurry mixer to change a slurry property during the polishing process based, at least in part, upon the detected wafer property. | 06-25-2009 |