| Patent application number | Description | Published |
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| 20110135393 | BERM AND METHOD OF CONSTRUCTION THEREOF - A berm to increase capacity of an existing landfill comprises fill material and a covering portion. The landfill comprises a waste-receiving recess having an outer perimeter, an edge surface peripherally adjacent at least a portion of the outer perimeter, and an existing accumulation of waste within the recess. The fill material has a base, an inner sloped surface adjacent a future accumulation of waste, and an outer sloped surface opposite the inner sloped surface. The fill material comprises contaminated fill material fully encapsulated by an impermeable membrane. The covering portion comprises structural fill material and at least partially covers the fill material. At least a portion of the berm sits on at least a portion of the edge surface of the landfill, and portions of the berm are substantially parallel to corresponding portions of the outer perimeter. | 06-09-2011 |
| 20110135394 | BERM AND METHOD OF CONSTRUCTION THEREOF - Embodiments of the invention comprise berm to increase capacity of an existing landfill. The landfill comprises a waste-receiving recess having a surface and an outer perimeter, an edge surface peripherally adjacent at least a portion of the outer perimeter, and an existing accumulation of waste within the recess. The berm comprises a reinforced portion having opposing inner and outer surfaces and comprising fill material and a plurality of reinforcing members disposed therein, backfill material having an inner surface adjacent the inner surface of the reinforced portion, and an impermeable membrane encapsulating at least a portion of the backfill material, at least a portion of the fill material, and at least a portion of one or more of the reinforcing members. | 06-09-2011 |
| 20110135403 | BERM AND METHOD OF CONSTRUCTION THEREOF - A berm to increase capacity of an existing landfill comprises a reinforced portion and backfill material. The landfill comprises a waste-receiving recess having a surface and an outer perimeter, an edge surface peripherally adjacent at least a portion of the outer perimeter, and an existing accumulation of waste within the recess having a collective top surface. The reinforced portion has opposing inner and outer surfaces and comprises structural fill material and a plurality of reinforcing members disposed therein. The backfill material has an inner surface adjacent the inner surface of the reinforced portion. The backfill material comprises contaminated fill material and is at least partially encapsulated by an impermeable membrane. At least a portion of the berm sits on at least a portion of the edge surface of the landfill. Portions of the berm are substantially parallel to corresponding portions of the outer perimeter. | 06-09-2011 |
| Patent application number | Description | Published |
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| 20080252397 | BAW Resonator Filter Bandwidth and Out-of-Band Frequency Rejection - Embodiments of the present invention provide systems, devices and methods for improving both the bandwidth of a BAW resonator bandpass filter and the suppression of out-of-band frequencies above the passband. In various embodiments of the invention, blocker inductors are located in series between the filter input and the filter output to realize both bandwidth enhancement and improved out-of-band frequency rejection. For example, a first blocker inductor may be located at the input and a second blocker inductor may be located at the output of a BAW resonator bandpass filter. | 10-16-2008 |
| 20090289722 | Bonded Wafer Package Module - Bonded wafer packages having first and second wafers bonded together forming a matrix of sealed devices, at least one of the wafers having a plurality of passive devices formed thereon, including at least one BAW resonator within each of the sealed devices, the first wafer having conductor filled through-holes forming electrical connections between the passive devices and connections assessable from outside the sealed devices, the bonded wafers being diced to form individual sealed devices. The devices may be duplexers, interstage filters or other circuits such as VCOs and RF circuits. Various embodiments are disclosed. | 11-26-2009 |
| 20100073106 | BAW Resonator Filter Bandwidth and Out-of-Band Frequency Rejection - Embodiments of the present invention provide systems, devices and methods for improving both the bandwidth of a BAW resonator bandpass filter and the suppression of out-of-band frequencies above the passband. In various embodiments of the invention, blocker inductors are located in series between the filter input and the filter output to realize both bandwidth enhancement and improved out-of-band frequency rejection. For example, a first blocker inductor may be located at the input and a second blocker inductor may be located at the output of a BAW resonator bandpass filter. | 03-25-2010 |
