Patent application number | Description | Published |
20090289668 | Output driver circuit for an integrated circuit - An integrated circuit | 11-26-2009 |
20090290623 | Signal amplitude distortion within an integrated circuit - An integrated circuit | 11-26-2009 |
20090290624 | Programmable jitter generation circuit - The present invention provides an integrated circuit comprising a serial transmitter, a serial receiver and a serial connection providing communication between the serial transmitter and the serial receiver. The serial transmitter comprises a clock generator and a serializer for serializing data to be transmitted to the serial receiver. A clock control unit coupled to the clock generator alters the clock phase of the clock signal to stress test the serial receiver. | 11-26-2009 |
20090290626 | Programmable duty cycle distortion generation circuit - An integrated circuit is provided comprising: a serial transmitter, a serial receiver and a serial connection providing communication between the serial transmitter and the serial receiver. The integrated circuit further comprises a duty cycle distortion circuit so that the integrated circuit can be stress tested by distorting the duty cycle of a signal within the integrated circuit. | 11-26-2009 |
20090292961 | Integrated circuit communication self-testing - An integrated circuit | 11-26-2009 |
20090292962 | Integrated circuit with inter-symbol interference self-testing - An integrated circuit | 11-26-2009 |
20140266416 | ON-PACKAGE MULTIPROCESSOR GROUND-REFERENCED SINGLE-ENDED INTERCONNECT - A system of interconnected chips comprising a multi-chip module (MCM) includes a first processor chip, a second processor chip, and an MCM package configured to include the first processor chip, the second processor chip, and an interconnect circuit. The first processor chip is configured to include a first ground-referenced single-ended signaling (GRS) interface circuit. A first set of electrical traces fabricated within the MCM package and configured to couple the first GRS interface circuit to the interconnect circuit. The second processor chip is configured to include a second GRS interface circuit. A second set of electrical traces fabricated within the MCM package and configured to coupled the second GRS interface circuit to the interconnect circuit. | 09-18-2014 |
20140269012 | GROUND-REFERENCED SINGLE-ENDED SYSTEM-ON-PACKAGE - A system of interconnected chips comprising a multi-chip module (MCM) includes a first processor chip, a system function chip, and an MCM package configured to include the first processor chip and the system function chip. The first processor chip is configured to include a first ground-referenced single-ended signaling (GRS) interface circuit. The system function chip is configured to include a second GRS interface circuit. A first set of electrical traces are fabricated within the MCM package and coupled to the first GRS interface circuit and to the second GRS interface circuit. The first GRS interface circuit and second GRS interface circuit together provide a communication channel between the first processor chip and the system function chip. | 09-18-2014 |
20140301134 | GROUND-REFERENCED SINGLE-ENDED MEMORY INTERCONNECT - A system is provided for transmitting signals. The system comprises a first processing unit, a cache memory, and a package. The first processing unit comprises a first ground-referenced single-ended signaling (GRS) interface circuit and the second processing unit comprises a second GRS interface circuit. The cache memory comprises a third and a fourth GRS interface circuit. The package comprises one or more electrical traces that couple the first GRS interface to the third GRS interface and couple the second GRS interface to the fourth GRS interface, where the first GRS interface circuit, the second GRS interface, the third GRS interface, and the fourth GRS interface circuit are each configured to transmit a pulse along one trace of the one or more electrical traces by discharging a capacitor between the one trace and a ground network. | 10-09-2014 |