Cardwell
David Anthony Cardwell, Cambridgeshire GB
Patent application number | Description | Published |
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20110319268 | SUPERCONDUCTOR FABRICATION - A seed crystal for the fabrication of a superconductor is grown from a rare-earth oxide having the basic formula X | 12-29-2011 |
David Anthony Cardwell, St. Ives GB
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20160045273 | Magnetic-Anchored Robotic System - Present example embodiments relate generally to a surgical system comprising an internal anchor assembly configurable to be inserted into and positioned inside a cavity of a body. The surgical system further comprises an external anchor assembly configurable to magnetically couple to the internal anchor assembly. The external anchor assembly may comprise a magnetic assembly. The magnetic assembly may include one or more superconducting magnets configurable to generate a magnetic field. The magnetic assembly may further include a conductive housing for receiving the one or more superconducting magnets. The external anchor assembly may further include a temperature control section configurable to control a temperature of the one or more superconducting magnets via the conductive housing. The external anchor assembly may further include an external anchor body configurable to receive the magnetic assembly and the temperature control section. The external anchor body may be fixably positionable outside of the body. | 02-18-2016 |
Kevin Stuart Cardwell, Stevenage GB
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20130060028 | NOVEL PROCESSES - This invention relates to methods of making a compound of formula (I) and intermediates for same | 03-07-2013 |
Oliver Raymond Cardwell, Christchurch NZ
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20090272457 | WIRE TWISTING APPARATUS - A rotatable member ( | 11-05-2009 |
Stuart Cardwell, East Sussex GB
Patent application number | Description | Published |
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20110260322 | "Semiconductor on semiconductor substrate multi-chip-scale package" - Some exemplary embodiments of a multi-chip semiconductor package utilizing a semiconductor substrate and related method for making such a semiconductor package have been disclosed. One exemplary embodiment comprises a first semiconductor device including, on a surface thereof, a first patterned dielectric layer, a conductive redistribution layer, a second patterned dielectric layer, and a second semiconductor device. The conductive redistribution layer connects to a first and a second patterned conductive attach material for connecting the first and second semiconductor devices to provide coplanar electrical connections for mounting on a printed circuit board. In one embodiment, the first semiconductor device is a diode having anode and cathode contacts on an upper surface thereof, and the second semiconductor device is an IGBT. | 10-27-2011 |
20130316527 | Multi-Chip-Scale Package - Some exemplary embodiments of a multi-chip semiconductor package utilizing a semiconductor substrate and related method for making such a semiconductor package have been disclosed. One exemplary embodiment comprises a first semiconductor device including, on a surface thereof, a first patterned dielectric layer, a conductive redistribution layer, a second patterned dielectric layer, and a second semiconductor device. The conductive redistribution layer connects to a first and a second patterned conductive attach material for connecting the first and second semiconductor devices to provide coplanar electrical connections for mounting on a printed circuit board. In one embodiment, the first semiconductor device is a diode having anode and cathode contacts on an upper surface thereof, and the second semiconductor device is an IGBT. | 11-28-2013 |