Cannon, NC
Becky B. Cannon, Asheville, NC US
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20150257944 | Reusable Swim Diaper - A reusable swim diaper, which includes a main torso part having an extent defined by an elastic-banded torso-receiving aperture at its upper end for receiving a torso, a pair of elastic-banded leg-receiving apertures at its lower end, and a crotch portion generally between said leg-receiving apertures. At least one joint extends between the torso-receiving aperture and one of the leg-receiving apertures, the joint being capable of selectively and repeatedly joining and separating adjacent portions of the main torso part. The main torso part also includes a bodyside inner layer of breathable wick away fabric having an extent corresponding to the extent of the main torso part, an absorbent terry cloth intermediate layer, and a waterproof outer layer having an extent corresponding to the extent of said main torso part. The layers are made of materials which are capable of withstanding laundering and are restored to substantially their original conditions by laundering. | 09-17-2015 |
Benjamin L. Cannon, Cary, NC US
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20150162665 | DIELECTRIC-FREE METAL-ONLY DIPOLE-COUPLED BROADBAND RADIATING ARRAY APERTURE WITH WIDE FIELD OF VIEW - Dielectric-free, metal-only, dipole-coupled broadband radiating array aperture with wide field of view. | 06-11-2015 |
Craig D. Cannon, Winston Salem, NC US
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20130173499 | ROBUST CLOUD COMPUTING E-DISCOVERY PLATFORM - System, method, and computer program product are provided for a robust cloud computing e-discovery platform (RCCEP). The RCCEP program allows users to select different applications from different vendors for each phase of e-discovery. A cloud may be populated by vendors supplying e-discovery resources. Once the cloud is populated, users may, in some embodiments, opt-in to access the cloud. In other embodiments, the cloud may be provided to the user privately. The user may access the vendor e-discovery resources that are on the cloud based on the phase of e-discovery the user. In this way, the user may select one vendor's e-discovery resource to use for one phase of e-discovery and subsequently select a different vendor's e-discovery resource for a second phase of e-discovery. This invention provides an enterprise-wide e-discovery technology solution that encompasses the best of all vendors' systems in all phases of the e-discovery process. | 07-04-2013 |
Hencil Joel Cannon, Charlotte, NC US
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20130062131 | Self-Generating Power Assembly For A Vehicle - The invention relates to a self generating power assembly for a vehicle including one or more power sources for a vehicle that increases the mileage efficiency for the vehicle. | 03-14-2013 |
Nathaniel O. Cannon, Durham, NC US
Patent application number | Description | Published |
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20090179213 | PHOSPHOR COATING SYSTEMS AND METHODS FOR LIGHT EMITTING STRUCTURES AND PACKAGED LIGHT EMITTING DIODES INCLUDING PHOSPHOR COATING - Methods are disclosed including applying a layer of binder material onto an LED structure. A luminescent solution including an optical material suspended in a solution is atomized using a flow of pressurized gas, and the atomized luminescent solution is sprayed onto the LED structure including the layer of binder material using the flow of pressurized gas. | 07-16-2009 |
20100155763 | SYSTEMS AND METHODS FOR APPLICATION OF OPTICAL MATERIALS TO OPTICAL ELEMENTS - Methods are disclosed including heating an optical element. An optical material is applied to the heated optical element to provide a conformal layer that is cured via the thermal energy in the heated optical element. | 06-24-2010 |
20110220920 | METHODS OF FORMING WARM WHITE LIGHT EMITTING DEVICES HAVING HIGH COLOR RENDERING INDEX VALUES AND RELATED LIGHT EMITTING DEVICES - Methods of forming a light emitting device are provided in which a solid state lighting source is heated and a luminescent solution is applied to the heated solid state lighting source to form the light emitting device. The luminescent solution includes a first material that down-converts the radiation emitted by the solid state lighting source to radiation that has a peak wavelength in the green color range and that has a full width half maximum emission bandwidth that extends into the cyan color range, and at least one additional material that down-converts the radiation emitted by the solid state lighting source to radiation having a peak wavelength in another color range. | 09-15-2011 |
20120032220 | PACKAGED LIGHT EMITTING DIODES INCLUDING PHOSPHOR COATING AND PHOSPHOR COATING SYSTEMS - Light emitting structures are disclosed that can include a semiconductor light emitting diode (LED) that includes a p-n junction active layer. A first layer can include a binder material having a thickness that is less than about 1000 μm, wherein the first layer is directly on the LED. A second layer can include phosphor particles, where the second layer can have a thickness that is less than about 1000 μm and can be directly on the first layer so that the first layer is between the LED and the second layer. | 02-09-2012 |
Nathaniel O. Cannon, Morrisville, NC US
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20080258168 | Semiconductor light emitting device packages and methods - A submount for a light emitting device package includes a rectangular substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed. | 10-23-2008 |
20090152573 | Textured encapsulant surface in LED packages - A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously. | 06-18-2009 |
20110284903 | Semiconductor Light Emitting Device Packages and Methods - A submount for a light emitting device package includes a substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed. | 11-24-2011 |
20140256072 | Semiconductor Light Emitting Device Packages and Methods - A submount for a light emitting device package includes a substrate with a first bond pad and a second bond pad on a first surface. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are on the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. | 09-11-2014 |