Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Canham
John S. Canham, Ellicott City, MD US
| Patent application number | Description | Published |
|---|---|---|
| 20100022377 | OPTICAL DEVICES COMPRISING DOPED GLASS MATERIALS, LASER SYSTEMS INCLUDING SUCH OPTICAL DEVICES, AND METHODS OF FORMING SUCH OPTICAL DEVICES AND LASER SYSTEMS - Optical devices include a doped glass material in which the dopant facilitates the transmission of energy out from the glass material. The doped glass may not significantly absorb a selected wavelength of laser radiation to be manipulated by the optical devices. The dopant may comprise one or more of a transition metal element, an actinide element, and a lanthanide element. Laser systems include at least one such optical device and a laser device configured to emit a beam to be manipulated by the optical device. Methods for forming optical devices and laser systems including such optical devices include dispersing a dopant within a glass material to form, and forming the glass material into a body having a size and shape configured to manipulate a beam of radiation emitted by a laser device. The dopant is selected to comprise a material that facilitates the transmission of energy out from the glass material. | 01-28-2010 |
| 20100212925 | LIGHTNING DIRECTING SYSTEM - A lightning direction device is provided. The lightning direction device includes a drag member, a pendant mass and a conductor. The drag member is configured to have a select amount of wind resistance. The pendant mass has a select weight and shape. Moreover, the conductor is coupled between the pendant mass and the drag member. | 08-26-2010 |
| 20100232460 | ELECTROMAGNETICALLY PUMPED ALKALI METAL VAPOR CELL SYSTEM - An electromagnetic pumped alkali metal vapor cell system is provided. The system comprises a vapor cell and windings. The vapor cell contains alkali metal and a buffer. The windings are positioned around the vapor cell and are configured to create an electromagnet field in the vapor cell when an AC signal is applied to the windings. The electromagnetic field pumps unexcited alkali vapor into unionized D | 09-16-2010 |
Luke Canham, Nsw AU
| Patent application number | Description | Published |
|---|---|---|
| 20110147122 | MODULAR FRAME - The present invention provides scaffolding erection methods. One method includes considering whether to attach a scaffold frame support to a building frame from inside, and alternatively, outside the building frame wall. Another comprises attaching a load distribution member to distribute transferred load to at least two wall studs. The present invention also provides scaffolding frame members. One is arranged for connection to a top plate from inside, and alternatively, outside a building frame. Another is a load distributor arranged for distribution across at least two studs of the building frame. The present invention also provides kick board and plank joiners. | 06-23-2011 |
Matthew John Canham, Greenville, SC US
| Patent application number | Description | Published |
|---|---|---|
| 20090049842 | ENCLOSURE FOR A GAS TURBINE AND METHOD FOR ENCLOSING THE SAME - Disclosed is an enclosure for a gas turbine, the enclosure including an enclosure section configured to partially enclose the gas turbine, and at least one other enclosure section, the at least one other enclosure section being configured to assemble with the enclosure section in a manner that associates the at least one other enclosure section with the enclosure section, wherein said at least one other enclosure section and said enclosure section are configured to substantially enclose the gas turbine when the at least one other enclosure section is associated with the enclosure section. | 02-26-2009 |
Rick Canham, Portland, OR US
| Patent application number | Description | Published |
|---|---|---|
| 20100162561 | SLIDING PACKAGE RETENTION DEVICE FOR LGA SOCKETS - A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms. | 07-01-2010 |