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Candler

John Candler, Houston, TX US

Patent application numberDescriptionPublished
20090139770Cuttings treatment and reuse - A method for treating drill cuttings including depositing drill cuttings in a desalinization cell, the desalinization cell having a high end, a low end, and a cuttings pad. The method further includes washing the drill cuttings in the desalinization cell with a liquid phase and removing a cuttings runoff from the drill cuttings. Also, a method for treating drill cuttings including depositing drill cuttings in a desalinator, the desalinator having a geometric structure having a perforated side. The method further includes adding a liquid phase to the desalinator through the perforated side, washing the drill cuttings in the desalinator with the liquid phase, and producing desalinated drill cuttings and a cuttings runoff.06-04-2009

Robert Candler, Palo Alto, CA US

Patent application numberDescriptionPublished
20090058561Multi-Ring Resonator System and Method - A system and method are provided which includes ring resonator structures coupled together with beam structure(s). The ring resonators are configured to operate in the contour or breathe mode. The center of the coupling beam structure is used as a nodal anchor point for anchoring the ring resonators and the beam structures, and also provides a reflecting interface. In an embodiment, the coupling beam structure includes two quarter-wavelength matched beams and an anchor located at a nodal point for coupling the two quarter-wavelength matched beams and ring resonator structures. The symmetric ring design also provides a differential drive and sense configuration while balancing the driving forces about the anchor located at the center of the beam structure. The system exhibits low energy losses while providing large sensing signals and a high quality factor (Q) of about 186,000 at a resonant frequency of about twenty-nine (29) MHz.03-05-2009
20090085442Passive self-tuning resonator system - The invention is a system incorporating a self-tuning resonator and method of self-tuning a resonator within a system. In one embodiment, a method of powering a system with energy harvested from a vibrating surface includes receiving a first mechanical energy at a first driving frequency from the vibrating surface, transferring the received first mechanical energy to a suspended structure within the system, vibrating the suspended structure with the transferred first mechanical energy, passively adjusting the resonant frequency of the suspended structure to a first resonant frequency associated with the first driving frequency by moving a movable mass in response to the movement of the suspended structure, vibrating the adjusted suspended structure with the transferred first mechanical energy, generating electrical energy using the vibrations of the adjusted suspended structure, and powering the system with the generated electrical energy.04-02-2009

Robert N. Candler, Los Angeles, CA US

Patent application numberDescriptionPublished
20100237039METHOD OF ACCURATELY SPACING Z-AXIS ELECTRODE - A method of forming a device with a controlled electrode gap width includes providing a substrate, forming a functional layer on top of a surface of the substrate, forming a sacrificial layer above the functional layer, exposing a first portion of the functional layer through the sacrificial layer, forming a first spacer layer on the exposed first portion of the functional layer, forming an encapsulation layer above the first spacer layer, and vapor etching the encapsulated first spacer layer to form a first gap between the functional layer and the encapsulation layer.09-23-2010
20100240163SUBSTRATE WITH MULTIPLE ENCAPSULATED PRESSURES - A method of forming a device with multiple encapsulated pressures is disclosed herein. In accordance with one embodiment of the present invention, there is provided a method of forming a device with multiple encapsulated pressures, including providing a substrate, forming a functional layer on top of a surface of the substrate, the functional layer including a first device portion at a first location, and a second device portion at a second location adjacent to the first location, encapsulating the functional layer, forming at least one diffusion resistant layer above the encapsulated functional layer at a location above the first location and not above the second location, modifying an environment adjacent the at least one diffusion resistant layer, and diffusing a gas into the second location as a result of the modified environment.09-23-2010