| Patent application number | Description | Published |
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| 20100193409 | SCREEN FOR A VIBRATORY SEPARATOR - A shaker apparatus including a basket having an upstream side, a downstream side, and two side walls, at least one wedge guide and one support rail disposed on each side wall, and at least one screen assembly. The support rails and the wedge guides may be configured to engage the screen assembly. The screen assembly may have one or more layers of screen mesh mounted on a screen frame. The screen frame may include a first and a second side rail, each having an upstream end, a downstream end, a top surface, and a bottom surface. A slope of the top surfaces intermediate the upstream end and the downstream end may be different than a slope of the bottom surfaces intermediate the upstream end and the downstream end. | 08-05-2010 |
| 20100236995 | SCREEN CLAMP - A screen clamp ( | 09-23-2010 |
| 20100270215 | VIBRATORY SEPARATOR SCREEN ATTACHMENT - A vibratory separator including a screen frame and a screen attachment. The screen attachment including at least one vertically disposed latch on the screen frame, at least one vertically disposed catch on the screen frame, and at least one bearing surface proximate the at least one vertically disposed catch. Additionally, a method of securing adjacent screens including inserting a vertically disposed latch of a first screen into a catch of a second screen, wherein the inserting includes contacting the latch of the first screen with a bearing surface of the second screen adjacent the catch of the second screen. The method further includes forming a planar alignment of the first screen to the second screen. | 10-28-2010 |
| 20110139688 | PERIPHERAL SEALING SYSTEM FOR PRE-TENSIONED SCREENS - A method of forming a shaker screen includes forming a frame, and attaching a first sealing element to at least one side of an outer perimeter of the frame, wherein the attaching comprises aligning a first mating surface of the frame to a second mating surface of the first sealing element, and wherein the first mating surface of the frame includes an extension, and the second mating surface of the first sealing element includes a groove configured to align with the extension. A system of sealing shaker screens includes a first screen and a second screen disposed adjacent the first screen, wherein a first sealing element of a first frame and a portion of the second screen interact to provide a seal between the first screen and the second screen. | 06-16-2011 |
| 20110266214 | Improved Sifting Screen - The invention relates to a screen frame adapted for use in a shaker to separate solids from a liquid/solid mixture and to which woven wire mesh is to be attached, comprising an outer perimeter and a plurality of plastics ribs extending between opposing regions of the perimeter, the plastics ribs together forming an upper face and a lower face, wherein the frame further comprises at least one metal rib extending between opposing regions of the perimeter and extending from the upper face to the lower face, and to a shaker comprising at least one such screen frame. | 11-03-2011 |
| 20110284455 | Sifting Screen - The invention relates to a screen frame adapted for use in a shaker and to which woven wire mesh is to be attached, comprising an outer perimeter and a plurality of plastics ribs extending between opposing regions of the perimeter, the frame being arranged such that, when fitted in a shaker to which it is adapted for, a portion of the opposing regions is clamped in place and a portion of the opposing regions is not clamped with the number of plastics ribs per unit length for the clamped portion greater than the number of plastics ribs per unit length for the unclamped portion, and to a shaker comprising at least one such screen frame. | 11-24-2011 |
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| 20080211077 | Low profile chip scale stacking system and method - The present invention stacks chip scale-packaged integrated circuits (CSPs) into low profile modules that conserve PWB or other board surface area. Low profile structures provide connection between CSPs of the stacked module and between and to the flex circuitry. Low profile contacts are created by any of a variety of methods and materials including, for example, screen paste techniques and use of high temperature solders, although other application techniques and traditional solders may be employed for creating low profile contacts in the present invention. A consolidated low profile contact structure and technique is provided for use in alternative embodiments of the present invention. The CSPs employed in stacked modules devised in accordance with the present invention are connected with flex circuitry. That flex circuitry may exhibit one or two or more conductive layers. In some preferred embodiments, a form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In other embodiments, a heat spreader is disposed between the CSP and the flex circuitry thus providing an improved heat transference function without the standardization of the form standard, while still other embodiments lack either a form standard or a heat spreader and may employ, for example, the flex circuitry as a heat transference material. | 09-04-2008 |
| 20090124045 | Low Profile Stacking System and Method - The present invention provides a system and method that mounts integrated circuit devices onto substrates and a system and method for employing the method in stacked modules. The contact pads of a packaged integrated circuit device are substantially exposed. A solder paste that includes higher temperature solder paste alloy is applied to a substrate or to the integrated circuit device to be mounted. The integrated circuit device is positioned to contact the contacts of the substrate. Heat is applied to create high temperature joints between the contacts of the substrate and the integrated circuit device resulting in a device-substrate assembly with high temperature joints. The formed joints are less subject to re-melting in subsequent processing steps. The method may be employed in devising stacked module constructions such as those disclosed herein as preferred embodiments in accordance with the invention. Typically, the created joints are low in profile. | 05-14-2009 |
| 20090273069 | LOW PROFILE CHIP SCALE STACKING SYSTEM AND METHOD - The present invention stacks chip scale-packaged integrated circuits (CSPs) into low profile modules that conserve PWB or other board surface area. Low profile structures provide connection between CSPs of the stacked module and between and to the flex circuitry. Low profile contacts are created by any of a variety of methods and materials including, for example, screen paste techniques and use of high temperature solders, although other application techniques and traditional solders may be employed for creating low profile contacts in the present invention. A consolidated low profile contact structure and technique is provided for use in alternative embodiments of the present invention. The CSPs employed in stacked modules devised in accordance with the present invention are connected with flex circuitry. That flex circuitry may exhibit one or two or more conductive layers. In some preferred embodiments, a form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In other embodiments, a heat spreader is disposed between the CSP and the flex circuitry thus providing an improved heat transference function without the standardization of the form standard, while still other embodiments lack either a form standard or a heat spreader and may employ, for example, the flex circuitry as a heat transference material. | 11-05-2009 |
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| 20090170416 | Methods and Apparatus for Forming a Slurry Polishing Pad - Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad. | 07-02-2009 |
| 20110030569 | ROLL MECHANICS FOR ENABLING PRINTED ELECTRONICS - A print press system and a method are described herein that print an electronic circuit onto a material (e.g., glass substrate, plastic film, plastic film-glass substrate laminate). In exemplary applications, the print press system can print an electronic circuit onto a material to form, for instance, a flexible Liquid Crystal Display, a retail point of purchase sign and an e-book. | 02-10-2011 |
| 20110162786 | METHODS AND APPARATUS FOR FORMING A SLURRY POLISHING PAD - Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad. | 07-07-2011 |
| 20110290078 | Methods Of Fabricating A Honeycomb Extrusion Die From A Die Body - A method for screening abrasive wheels for fabricating a honeycomb extrusion die from a die body, and methods for fabricating a honeycomb extrusion die using an abrasive wheel assembly. One method for fabricating a honeycomb extrusion die includes measuring at least one of runout and thickness of each of a plurality of abrasive blades while rotating the blades, selecting a subset of the plurality of blades that have a measured runout or a measured thickness within a predetermined range, and mounting the subset of blades spaced from one another and concentrically aligned along a rotation axis of the abrasive wheel assembly. | 12-01-2011 |
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| 20090041619 | DEVICES FOR SANITIZING MEDICAL FITTINGS - Single-use devices for sanitizing accessible surfaces of needleless medical valves at risk of contamination with infectious agents are described, as are methods for making and using such devices. | 02-12-2009 |
| 20090297400 | DEVICES FOR SANITIZING MEDICAL FITTINGS - Single-use devices for sanitizing accessible surfaces of needleless medical valves at risk of contamination with infectious agents are described, as are methods for making and using such devices. | 12-03-2009 |
| 20100296968 | SANITIZING DEVICES FOR NEEDLELESS MEDICAL FITTINGS - Single-use devices configured to sanitize accessible surfaces of needleless medical valves at risk of contamination with infectious agents are described, as are methods for making and using such devices. Such devices include a sanitizing element securely attached to an inner surface of at least one of the two or more layers that make up the container inside of which the sanitizing element is stored until it is ready to be used. Examples of containers include laminated foil pouches or packets. | 11-25-2010 |
| 20110184382 | MULTI-PURPOSE ARTICLES FOR SANITIZING AND CAPPING LUER ACCESS VALVES - Multi-purpose devices for capping fluid reservoirs and sanitizing accessible surfaces of fluid-transporting medical fittings (e.g., luer access valves) at risk of contamination with infectious agents are described, as are methods for making and using such devices. | 07-28-2011 |
| 20120059330 | ADAPTIVE DEVICES FOR SECURING MEDICAL ARTICLES - Adaptive medical article securement devices are described. These devices retain a medical article, for example, a catheter hub or a connector fitting, in position on a patient's body and reduce or inhibit longitudinal or other movement of the medical article. The securement device includes an adaptive retainer and at least one anchor pad used to attach the securement device to a patient's skin. The adaptive retainer is a flexible element that can adapt and conform to an exterior portion of the medical article to be secured, and in doing so forms a central channel in which at least a portion of the medical article becomes disposed. In some embodiments the retainer includes at least one engaging element that can engage a retention element disposed on the medical article. The engaging element, alone or in conjunction with the retention element and/or the shape (e.g., tapering) of the central channel, reduces or inhibits longitudinal motion of the medical article in the central channel. | 03-08-2012 |
