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Cadix, FR
Arnaud Cadix, Paris FR
| Patent application number | Description | Published |
|---|---|---|
| 20090326142 | AQUEOUS DISPERSION OF STRUCTURED POLYMER, MANUFACTURING PROCESS AND USE IN COATING FORMULATIONS - The invention concerns the field of aqueous dispersions. It concerns in particular an aqueous dispersion based on structured polymer comprising at least two phases, one called soft with low Tg and the other called hard with high Tg. The invention also concerns the use of such dispersions, as binder in formulation for paints free of solvents or coalescent agents. | 12-31-2009 |
| 20100210485 | Oil Formulation for Preventing Water Penetration in Underground Formations - The present invention relates to the use of an oil formulation in the field of the oil industry, in particular for the prevention of water penetration. The formulation according to the invention is in particular intended to be injected into underground formations, such as injection wells or production wells. | 08-19-2010 |
Arnaud Cadix, Saint-Ouen FR
| Patent application number | Description | Published |
|---|---|---|
| 20100093874 | COPOLYMER INCLUDING BETAINE UNITS AND HYDROPHOBIC AND/OR AMPHIPHILIC UNITS, METHOD FOR PREPARING SAME AND USES THEREOF - The invention relates to a copolymer including betaininc units and hydrophobic and/or amphiphile units. The invention also relates to a method for preparing a copolymer including betaininc units and hydrophobic and/or amphiphile units, by controlled micellar polymerisation. The invention further relates to the uses of the copolymer. The copolymer is particularly used for increasing the viscosity of saline aqueous compositions. | 04-15-2010 |
| 20100210724 | Method for modifying the properties of an aqueous suspension - A method for modifying the properties of a suspension of solid or liquid particles in an aqueous medium, includes the step of adding to the suspension or to the aqueous medium a polymer prepared by inverse emulsion polymerization of monomers A | 08-19-2010 |
Lionel Cadix, Grenoble FR
| Patent application number | Description | Published |
|---|---|---|
| 20110018133 | ELECTRIC VIA WITH A ROUGH LATERAL SURFACE - A via connecting the front surface of a semiconductor substrate to its rear surface, this via having a rough lateral surface. | 01-27-2011 |
| 20110018139 | SCALLOPED TUBULAR ELECTRIC VIA - A via connecting the front surface of a substrate to its rear surface and having, in cross-section in a plane parallel to the surfaces, the shape of a scalloped ring. | 01-27-2011 |
| 20110018140 | ELECTRIC VIA COMPRISING LATERAL OUTGROWTHS - A via connecting the front surface of a substrate to its rear surface, this substrate including a porous region extending from at least a portion of the periphery of the via, the via including outgrowths extending in pores of the porous region. | 01-27-2011 |
| 20110079919 | ELECTRICAL CONNECTION VIA FOR THE SUBSTRATE OF A SEMICONDUCTOR DEVICE - An electrical connection via passing through a substrate for a semiconductor device is made of at least one conducting ring formed in an annular hole passing through the substrate. | 04-07-2011 |
| 20110079920 | ELECTRICAL CONNECTION VIA FOR THE SUBSTRATE OF A SEMICONDUCTOR DEVICE - An electrical connection via is formed through a substrate to make an electrical connection from one face of the substrate to the other. The via includes a ring made of an electrically conductive material. The ring is formed in a hole in the substrate so as to at least partly form the via. | 04-07-2011 |