Patent application number | Description | Published |
20090027979 | Semiconductor memory device and data sensing method thereof - A semiconductor memory device includes first and second edge drivers configured to generate sensing control signals, a memory cell array between first and second edge drivers, and pluralities of unit sense amplifiers detecting data from the memory cell array in response to the sensing control signals. | 01-29-2009 |
20090116297 | Redundancy program circuit and methods thereof - A redundancy program circuit and methods thereof. The redundancy program circuit may include a master fuse circuit with a master fuse outputting an operation enable signal to indicate a master fuse operating status, at least one control fuse circuit including at least one control fuse, the at least one control fuse circuit outputting an operating status signal for the at least one control fuse and a multiplexing unit configured to multiplex decoding address signal bits based on at least one of the operating status signal and the operation enable signal. | 05-07-2009 |
20090116319 | Redundancy program circuit and methods thereof - A redundancy program circuit and methods thereof. The redundancy program circuit may include a master fuse circuit with a master fuse outputting an operation enable signal to indicate a master fuse operating status, at least one control fuse circuit including at least one control fuse, the at least one control fuse circuit outputting an operating status signal for the at least one control fuse and a multiplexing unit configured to multiplex decoding address signal bits based on at least one of the operating status signal and the operation enable signal. | 05-07-2009 |
20090116327 | Redundancy program circuit and methods thereof - A redundancy program circuit and methods thereof. The redundancy program circuit may include a master fuse circuit with a master fuse outputting an operation enable signal to indicate a master fuse operating status, at least one control fuse circuit including at least one control fuse, the at least one control fuse circuit outputting an operating status signal for the at least one control fuse and a multiplexing unit configured to multiplex decoding address signal bits based on at least one of the operating status signal and the operation enable signal. | 05-07-2009 |
20100226187 | Semiconductor memory device - A semiconductor memory device includes a memory cell array having a plurality of memory cells coupled between a plurality of word lines and a plurality of bit line pairs, a bit line selection circuit configured to transmit data between a selected bit line pair and a local input/output line pair in response to a column selection signal, a local global input/output gate circuit configured to transmit data between the local input/output line pair and a global input/output line pair in response to a local global input/output selection signal, and a controller configured to drive the word lines, output the column selection signal having a first voltage level to the bit line selection circuit, and output the local global input/output selection signal having a second voltage level that is lower than the first voltage level to the local global input/output gate circuit, in response to an external address signal and an external command. | 09-09-2010 |
20110267915 | ANTI-FUSE, ANTI-FUSE CIRCUIT INCLUDING THE SAME, AND METHOD OF FABRICATING THE ANTI-FUSE - Provided are an anti-fuse, an anti-fuse circuit, and a method of fabricating the anti-fuse. The anti-fuse includes a semiconductor substrate, an isolation region, a channel diffusion region, a gate oxide layer, and a gate electrode. The semiconductor substrate includes a top surface and a bottom portion, the bottom portion of the semiconductor substrate having a first conductivity type. The isolation region is disposed inward from the top surface of the semiconductor substrate to a first depth. The channel diffusion region is disposed inward from the top surface of the semiconductor substrate to a second depth, the second depth located at a depth where the channel diffusion region meets an upper boundary of the bottom portion of the semiconductor substrate. The channel diffusion region is surrounded by the isolation region, the first depth is a greater distance from the top surface of the semiconductor substrate than the second depth, and the channel diffusion region has a second conductivity type opposite to the first conductivity type. The gate oxide layer is disposed on the channel diffusion region, and the gate electrode is disposed on the gate oxide layer to cover a top surface of the gate oxide layer. | 11-03-2011 |
20110292708 | 3D SEMICONDUCTOR DEVICE - A three-dimensional (3D) semiconductor device may include a stack of chips, including a master chip and one or more slave chips. I/O connections of slave chips need not be connected to channels on a motherboard, and only electrode pads of a master chip may be connected to the channels. Only the master chip may provide a load to the channels. A through-substrate via (TSV) boundary may be set on a data input path, a data output path, an address/command path, and/or a clock path of a semiconductor device in which the same type of semiconductor chips are stacked. | 12-01-2011 |
20120039140 | FUSE CIRCUIT AND SEMICONDUCTOR MEMORY DEVICE INCLUDING THE SAME - A fuse circuit includes a program unit, a sensing unit and a control unit. The program unit is programmed in response to a program signal, and outputs a program output signal in response to a sensing enable signal. The sensing unit includes a variable resistor unit that has a resistance that varies based on a control signal, and generates a sensing output signal based on the resistance of the variable resistor unit and the program output signal. The control unit generates the control signal having a value changed depending on operation modes, and performs a verification operation with respect to the program unit based on the sensing output signal to generate a verification result. The program unit may be re-programmed based on the verification result. | 02-16-2012 |
20120120733 | SEMICONDUCTOR DEVICE INCLUDING FUSE ARRAY AND METHOD OF OPERATION THE SAME - Provided are a semiconductor device including a fuse and a method of operating the same. The semiconductor device includes a fuse array, a first register unit, and a second register unit. The fuse array includes a plurality of rows and columns. The first register unit receives at least one row of fuse data from the fuse array. Fuse data of the at least one row of fuse data is received in parallel by the first register unit. The second register unit receives the fuse data at least one bit at a time from the first register unit. | 05-17-2012 |
20130003477 | SEMICONDUCTOR MEMORY DEVICE INCLUDING SPARE ANTIFUSE ARRAY AND ANTIFUSE REPAIR METHOD OF THE SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device including an antifuse cell array and a spare antifuse cell array are provided. An antifuse cell array includes a first set of antifuse cells arranged in a first direction and each one of the first set of antifuse cells is connected to a corresponding one of first through nth word lines. The spare antifuse cell array includes a first spare set of antifuse cells arranged in the first direction and each one of the first spare set of antifuse cells is connected to a corresponding one of first through kth spare word lines. A first operation control circuit is configured to program antifuses of the antifuse cell array and the spare antifuse cell array, and to read a status of each of the antifuses. The first operation control circuit is commonly connected to the first set of antifuse cells and the first spare set of antifuse cells. | 01-03-2013 |
20130061102 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device including a data bus inversion (DBI) determination unit, a first inverter, a cyclic redundancy check (CRC) calculation unit, a second inverter, and a DQ pin. The DBI determination unit is configured to determine whether to perform DBI based on first data on a main data line and configured to generate DBI data. The first inverter is configured to invert or non-invert the first data according to the DBI data to generate second data. The CRC calculation unit is configured to generate CRC data based on the second data and the DBI data. The second inverter is configured to invert or non-invert the first data according to the DBI data to generate third data. The DQ pin is configured to output the third data externally. | 03-07-2013 |
20140233292 | 3D SEMICONDUCTOR DEVICE - A three-dimensional (3D) semiconductor device may include a stack of chips, including a master chip and one or more slave chips. I/O connections of slave chips need not be connected to channels on a motherboard, and only electrode pads of a master chip may be connected to the channels. Only the master chip may provide a load to the channels. A through-substrate via (TSV) boundary may be set on a data input path, a data output path, an address/command path, and/or a clock path of a semiconductor device in which the same type of semiconductor chips are stacked. | 08-21-2014 |