| Patent application number | Description | Published |
|---|
| 20080282537 | Wiring forming method of printed circuit board - The present invention relates to a method for forming a wiring of a printed circuit board and more particularly, to a method including: preparing a base film; forming a wiring pattern with ink including metal nanoparticles on the base film by printing; and forming a wring by the induction heating of the base film on which the wiring pattern is formed. The method of the present invention which minimizes the thermal strain and thermal decomposition of a base film, provides an appropriate sintering process of wirings, shortens the manufacturing process, and exhibits excellent mechanical strength is provided by using the induction heating. | 11-20-2008 |
| 20090120238 | Method of manufacturing metal nanoparticles - The present invention relates to a method for manufacturing metal nanoparticles including: preparing a first solution including a metal precursor and a non-polar solvent; preparing a second solution with adding a capping molecule presented by the following Formula 1 into the first solution; and stirring the second solution with applying heat. | 05-14-2009 |
| 20090223410 | METHOD FOR PRODUCING SILVER NANOPARTICLES AND CONDUCTIVE INK - A method of producing metal nanoparticles in a high yield rate and uniform shape and size, which is thus suitable for mass production. In addition, metal nanoparticles are provided that have superior dispersion stability when re-dispersed in various organic solvents, which thus suitable for use as a conductive ink having high conductivity. The method of producing nanoparticles includes mixing a metal precursor with a copper compound to a hydrocarbon based solvent, mixing an amine-based compound to the mixed solution of the metal precursor with copper compound and hydrocarbon based solvent, and mixing a compound including one or more atoms having at least one lone pair, selected from a group consisting of nitrogen, oxygen, sulfur and phosphorous to the mixed solution of the amine-based compound, metal precursor with a copper compound and hydrocarbon based solvent. | 09-10-2009 |
| 20100031774 | Apparatus and method for manufacturing metal nanoparticles - The present invention relates to an apparatus and a method of manufacturing metal nanoparticles, and more particularly to an apparatus including: a precursor supplying part which supplies a precursor solution of metal nanoparticles; a first heating part which is connected with the precursor supplying part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where any particle is not produced; a second heating part which is connected with the first heating part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where particles are produced; and a cooler which is connected with the second heating part and collects and cools metal nanoparticles produced at the second heating part which allows continuous mass production of metal nanoparticles. | 02-11-2010 |
| 20100051329 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed are a printed circuit board and a method of manufacturing the same. The method in accordance with an embodiment of the present invention includes: forming an electroless plated layer on an insulation layer; and forming a circuit pattern by applying conductive ink on the electroless plated layer through an inkjet method. | 03-04-2010 |
| 20100275729 | Method for manufacturing metal nanoparticles comprising rod-shaped nanoparticles - The present invention relates to a method for manufacturing metal nanoparticles containing rod-shaped nanoparticles, the method including: producing metal oxide nanoparticle intermediates having at least rod-shaped metal oxide nanoparticles by heating a mixture of a nonpolar solvent, a metal precursor and an amine including secondary amine at 60-300° C.; producing metal nanoparticles by adding a capping molecule and a reducing agent to the mixture and heating the result mixture at 90-150° C.; and recovering the metal nanoparticles. | 11-04-2010 |
| 20100282022 | Method for manufaturing copper-based nanoparticles - The present invention relates to a method for manufacturing copper-based nanoparticles, in particular, to a method for manufacturing copper-based nanoparticles, wherein the method includes producing CuO nanoparticles by mixing CuO micropowder and alkylamine in a nonpolar solvent and heating the mixture at 60-300° C.; and producing copper-based nanoparticles by mixing a capping molecule and a reducing agent with the CuO nanoparticles and heating the mixture at 60-120° C. | 11-11-2010 |
| 20100319489 | APPARATUS AND METHOD FOR MANUFACTURING METAL NANOPARTICLES - The present invention relates to an apparatus and a method of manufacturing metal nanoparticles, and more particularly to an apparatus including: a precursor supplying part which supplies a precursor solution of metal nanoparticles; a first heating part which is connected with the precursor supplying part, includes a reactor channel having a diameter of | 12-23-2010 |
| 20110040014 | INKJET INK COMPOSITION - The invention is to provide a metal ink composition for ink-jet and more particularly, a metal ink composition which causes no formation of cracks on a PCB substrate, allows a low curing temperature, and provides improved adhesive strength even after coating. | 02-17-2011 |
