Patent application number | Description | Published |
20090154734 | METHOD FOR FABRICATING MICRO SPEAKER AND MICRO SPEAKER FABRICATED BY THE SAME - A method for fabricating a micro speaker is provided, including forming a package wafer and a device wafer by batch processing, bonding the package wafer and the device wafer to each other, and forming a diaphragm by isotropic-etching a back surface of the device wafer using a xenon difluoride (XeF | 06-18-2009 |
20100072860 | PIEZOELECTRIC MICROSPEAKER AND METHOD OF FABRICATING THE SAME - Provided is a method of fabricating a piezoelectric microspeaker. According to the method, drive units having a piezoelectric layer and an electrode are symmetrically formed so as to be disposed over and under a diaphragm, respectively. When a thin conductive layer is used as the diaphragm, the diaphragm can be used as a common electrode. On the other hand, when a thin non-conductive layer is used as the diaphragm, a common electrode is necessary in each of the drive units. | 03-25-2010 |
20100074459 | PIEZOELECTRIC MICROSPEAKER AND METHOD OF FABRICATING THE SAME - Provided are a piezoelectric microspeaker and a method of fabricating the same. In the piezoelectric microspeaker, a diaphragm includes a first region and a second region. The first region may be formed of a material capable of maximizing an exciting force, and the second region may be formed of a material having less initial stress and a lower Young's modulus than the first region. | 03-25-2010 |
20100156238 | PIEZOELECTRIC ACOUSTIC TRANSDUCER AND METHOD OF FABRICATING THE SAME - Provided are a piezoelectric acoustic transducer and a method of fabricating the same. In the piezoelectric acoustic transducer, a piezoelectric portion is formed in a portion of a diaphragm, and a deformation layer is formed in another portion of the diaphragm. Deformation of the piezoelectric portion is transferred to the deformation layer, or deformation of the deformation layer is transferred to the piezoelectric layer so that the deformation layer vibrates with the piezoelectric layer. | 06-24-2010 |
20110038495 | PIEZOELECTRIC MICRO SPEAKER AND METHOD OF MANUFACTURING THE SAME - A piezoelectric micro speaker and a method of manufacturing the same are provided. The piezoelectric micro speaker includes a device plate, a front plate bonded on a front surface of the device plate, and a rear plate bonded on a rear surface of the device plate. The device plate includes a diaphragm, a piezoelectric actuator that vibrates the diaphragm, and a front cavity disposed in front of the diaphragm. The front plate includes a radiation hole connected to the front cavity. The rear plate includes a rear cavity formed in a surface of the rear plate facing the piezoelectric actuator, and a bent hole connected to the rear cavity. A sound absorption layer is formed on an inner surface of the rear cavity and absorbs sound radiated backward from the diaphragm so as to suppress the sound from being reflected on the rear plate. | 02-17-2011 |
20110051985 | PIEZOELECTRIC MICRO SPEAKER HAVING PISTON DIAPHRAGM AND METHOD OF MANUFACTURING THE SAME - Provided are a piezoelectric micro speaker having a piston diaphragm and a method of manufacturing the piezoelectric micro speaker. The piezoelectric micro speaker includes: a substrate having a cavity formed therein; a vibrating membrane that is disposed on the substrate and covers at least a center part of the cavity; a piezoelectric actuator disposed on the vibrating membrane so as to vibrate the vibrating membrane; and a piston diaphragm that is disposed in the cavity and performs piston motion by vibration of the vibrating membrane. When the vibrating membrane vibrates by the piezoelectric actuator, the piston diaphragm, which is connected to the vibrating membrane through a piston bar, performs a piston motion in the cavity. | 03-03-2011 |
20110064250 | PIEZOELECTRIC MICRO SPEAKER INCLUDING ANNULAR RING-SHAPED VIBRATING MEMBRANES AND METHOD OF MANUFACTURING THE PIEZOELECTRIC MICRO SPEAKER - A piezoelectric micro speaker and a method of manufacturing the same are provided. The piezoelectric micro speaker includes a substrate having a cavity formed therein and a diaphragm that is disposed on the substrate that overlaps the cavity. A plurality of first vibrating membranes having concentric annular ring shapes are disposed in a first region of the diaphragm corresponding to a center of the cavity. A second vibrating membrane including a different material from that of the first vibrating membranes is formed in the second region of the diaphragm corresponding to an edge of the cavity. A piezoelectric actuator for vibrating the first vibrating membranes is formed on and between the concentric annular rings of the first vibrating membranes. | 03-17-2011 |
20110075867 | PIEZOELECTRIC MICRO SPEAKER INCLUDING WEIGHT ATTACHED TO VIBRATING MEMBRANE AND METHOD OF MANUFACTURING THE SAME - Provided are a piezoelectric micro speaker and a method of manufacturing the same. The piezoelectric micro speaker includes: a substrate having a cavity therein; a diaphragm that is disposed on the substrate, the diaphragm including a vibrating membrane that overlaps the cavity; a piezoelectric actuator that is disposed on the vibrating membrane; and a weight that is disposed in the cavity and attached to a center portion of the vibrating membrane. | 03-31-2011 |
20110075879 | PIEZOELECTRIC MICRO SPEAKER WITH CURVED LEAD WIRES AND METHOD OF MANUFACTURING THE SAME - A micro speaker includes a substrate having a cavity formed therein, a diaphragm formed on the substrate overlapping the cavity. The diaphragm includes a first vibration membrane formed in a first area corresponding to a center portion of the cavity and a second vibration membrane formed in a second area corresponding to an edge portion of the cavity and formed of material different from that used for the first vibration membrane. A piezoelectric actuator is formed including a first electrode layer formed on the first vibration membrane, a piezoelectric layer formed on the first electrode layer, and a second electrode layer formed on the piezoelectric layer, and first and second curved lead wires, respectively connected to the first and second electrode layers across the second area, which are symmetrical to the center of the piezoelectric actuator. | 03-31-2011 |
20110085684 | PIEZOELECTRIC MICRO SPEAKER - Provided is a piezoelectric micro speaker. The piezoelectric micro speaker includes a device plate having a front cavity, a front plate having a radiation hole which communicates with the front cavity in front of the device plate, and a rear plate having a rear cavity and a vent portion. A rear portion of the device plate forms a wall of the vent portion. The device plate includes at least one first vent hole which communicates with the vent portion, and the front plate includes at least one second vent hole which communicates with the first vent hole. | 04-14-2011 |
20110182450 | PIEZOELECTRIC MICRO-ACOUSTIC TRANSDUCER AND METHOD OF FABRICATING THE SAME - Provided are a piezoelectric micro-acoustic transducer and a method of fabricating the same. In the piezoelectric micro-acoustic transducer, a diaphragm is divided into a first region and a second region. The first region may be formed of a material capable of maximizing the exciting force, and the second region may be formed of a material having less initial stress and a lower Young's modulus than the first region. Also, the second region has a corrugated shape. | 07-28-2011 |
20120150041 | CELL AND CHANNEL OF ULTRASONIC TRANSDUCER, AND ULTRASONIC TRANSDUCER INCLUDING THE SAME - A cell of an ultrasonic transducer is provided. The cell includes a substrate; a supporting portion disposed on the substrate; a thin film spaced apart from the substrate and the supporting portion; and a connection portion which connects the supporting portion and the thin film. The connection portion may include a deformation portion that is elastically deformable. A channel of the ultrasonic transducer includes a plurality of cells arranged in an array. The ultrasonic transducer includes a plurality of channels arranged in an array. | 06-14-2012 |
20120176002 | ACOUSTIC TRANSDUCER AND METHOD OF DRIVING THE SAME - An acoustic transducer includes a first driving unit group including at least one electrode and a second driving unit group including at least one electrode. The first driving unit group is driven at a first phase, and the second driving unit group is driven at a second phase that is different from the first phase. | 07-12-2012 |
20130169110 | ULTRASONIC TRANSDUCER STRUCTURE, ULTRASONIC TRANSDUCER, AND METHOD OF MANUFACTURING ULTRASONIC TRANSDUCER - An ultrasonic transducer structure, an ultrasonic transducer, and a method of manufacturing the ultrasonic transducer are provided. The ultrasonic transducer structure includes a driving wafer that includes a driving circuit; and an ultrasonic transducer wafer that is disposed on the driving wafer and includes a first wafer in which a via-hole is formed, a first insulating layer formed on the first wafer, a second wafer spaced apart from the first insulating layer, and a cavity formed between the first insulating layer and the second wafer. | 07-04-2013 |
20140061826 | ULTRASONIC TRANSDUCER AND METHOD OF MANUFACTURING THE SAME - An ultrasonic transducer and a method of manufacturing the same are disclosed. The ultrasonic transducer includes a first electrode layer which is disposed to cover a conductive substrate and an inner wall and a top of a via hole penetrating a membrane and has a top surface at a same height as a top surface of the membrane; a second electrode layer which is disposed on a bottom surface of the conductive substrate to be spaced apart from the first electrode layer; and a top electrode which is disposed on the top surface of the membrane and which contacts the top surface of the first electrode layer. | 03-06-2014 |
20140070669 | MICROMACHINED ULTRASONIC TRANSDUCER ARRAY - A micromachined ultrasonic transducer (MUT) array includes a printed circuit board, an alignment plate formed on the printed circuit board, the alignment plate having a plurality of cavities formed therein and a plurality of protruding portions respectively formed between neighboring cavities of the plurality of cavities, and a plurality of MUT modules formed on the plurality of the cavities and the plurality of the protruding portions of the alignment plate. In the MUT array, each of the plurality of MUT modules includes an application-specific integrated circuit (ASIC) arranged on the alignment plate and an MUT arranged on the ASIC. | 03-13-2014 |