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Byquist
Tod Byquist, Federal Way, WA US
| Patent application number | Description | Published |
|---|---|---|
| 20100330823 | Cast grid array (CGA) package and socket - A cast grid array (CGA) package comprises shaped solder posts which may be reflowed and connected directly to a circuit board, such as mother board, or remain in a solid state with the shape allowing them to be secured within a CGA socket which, in turn, may be connected to the a board. Embodiments of the CGA allows for a lower cost socket and package combination by using solder post to interface the socket and not requiring a loading mechanism on every socket. | 12-30-2010 |
Tod A. Byquist, Federal Way, WA US
| Patent application number | Description | Published |
|---|---|---|
| 20110019378 | COMPOSITE MICRO-CONTACTS - Composite microelectronic contacts are provided in embodiments. These may include one or more arrays of isolated conductive tines coupled to and by isolation carriers. These carriers may serve to space the conductive tines apart and to couple the isolated tines together after the tines are no longer ganged together. The isolation carriers may comprise injection molded polymers as well as stamped materials. The isolation carriers may also contain locking tabs and recesses and seating plane stops. | 01-27-2011 |