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Byoung Youl

Byoung Youl Min, Seoul KR

Patent application numberDescriptionPublished
20090134507Adhesive on wire stacked semiconductor package - A semiconductor package and a method of producing the same has a substrate. A first semiconductor chip is coupled to a surface of the substrate. The first semiconductor chip has a first and second surfaces which are substantially flat in nature. An adhesive layer is coupled to the second surface of the first semiconductor chip. A second semiconductor chip having first and second surfaces which are substantially flat in nature is further provided. An insulator is coupled to the first surface of the second semiconductor chip for preventing shorting of wirebonds. The second semiconductor chip is coupled to the adhesive layer by the insulator coupled to the first surface thereof.05-28-2009
20090325105PRINTED CIRCUIT BOARD WITH EMBEDDED CAPACITORS THEREIN, AND PROCESS FOR MANUFACTURING THE SAME - Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO12-31-2009
20110089564ADHESIVE ON WIRE STACKED SEMICONDUCTOR PACKAGE - A semiconductor package and a method of producing the same has a substrate. A first semiconductor chip is coupled to a surface of the substrate. The first semiconductor chip has a first and second surfaces which are substantially flat in nature. An adhesive layer is coupled to the second surface of the first semiconductor chip. A second semiconductor chip having first and second surfaces which are substantially flat in nature is further provided. An insulator is coupled to the first surface of the second semiconductor chip for preventing shorting of wirebonds. The second semiconductor chip is coupled to the adhesive layer by the insulator coupled to the first surface thereof.04-21-2011

Patent applications by Byoung Youl Min, Seoul KR

Byoung Youl Min, Kyunggi-Do KR

Patent application numberDescriptionPublished
20080314863PRINTED CIRCUIT BOARD INCLUDING EMBEDDED CAPACITOR AND METHOD OF FABRICATING SAME - Disclosed is a PCB including an embedded capacitor and a method of fabricating the same. The long embedded capacitor is formed through an insulating layer, making a high capacitance and various capacitance designs possible.12-25-2008

Byoung Youl Song, Daejeon KR

Patent application numberDescriptionPublished
20100115524SYSTEM AND METHOD FOR THREAD PROCESSING ROBOT SOFTWARE COMPONENTS - An apparatus for thread processing robot software components includes a data port unit for storing input data in a buffer and then processing the data in a periodic execution mode or in a dedicated execution mode; an event port unit for processing an input event in a passive execution mode; and a method port unit for processing an input method call in the passive execution mode by calling a user-defined method corresponding to the method call. In the periodic execution mode, the data is processed by using an execution thread according to a period of a corresponding component. In the dedicated execution mode, a dedicated thread for the data is created and the data is processed by using the dedicated thread.05-06-2010
20100161836METHOD PORT ARRANGEMENT AND CONFIGURATION METHOD THEREOF FOR ROBOT SOFTWARE COMPONENT - A configuration method of a method port arrangement for robot software component includes: generating a requester method port module and a provider method port module; generating a requester method module and a provider method module depending on application of a method module to be generated in the component; registering the requester method module in the requester method port module and the provider method module in the provider method port module; and registering, in a method port management module, the requester method port module and the provider method port module where the requester method module and the provider method module have been registered. The method further includes establishing the requester method port module to be operated by interconnecting the requester method port module and the provider method port module; and executing input and output operations to/from the requester method port or the provider method port depending on application of the component.06-24-2010
20100168911METHOD AND APPARATUS FOR MANAGING ROBOT COMPONENTS - An apparatus for managing robot components in an intelligent robot includes a robot application including a plurality of robot components, a robot application management tool that manages the operation of the robot application, monitors the status caused by the operations of the robot application and information on the robot components, a lifecycle manager that manages lifecycles of the robot components under the management of the robot application management tool, and an operation system that transfers a sensing signal about peripheral environment generated from the sensor to the robot application, and transfers an execution signal from the robot application to the actuator.07-01-2010
20110153073FAULT TOLERANCE METHOD AND APPARATUS FOR ROBOT SOFTWARE COMPONENT - An apparatus for performing fault tolerance against a failure occurring during driving robot software components includes: a component executor for executing the robot software components, which are assigned with one thread from an operating system and have a same priority and cycle, by using the assigned thread; and an executor monitor for periodically monitoring the operation of the component executor and determining whether or not there is a failure in the robot software components executed by the component executor. The apparatus further includes: an executor manager for generating the component executor which is assigned with the robot software components having the same priority and cycle and, when the executor monitor determines that there is a failure in the execution of the robot software components, generating a new component executor.06-23-2011
20110153079APPARATUS AND METHOD FOR DISTRIBUTING AND MONITORING ROBOT APPLICATION AND ROBOT DRIVEN THEREBY - Provided is a technology that effectively distributes and monitors the execution of robot application to allow a plurality of robots to perform tasks in cooperation with each other. An apparatus for distributing and monitoring robot application according to an embodiment of the present invention comprises: a robot information manager managing information of a plurality of robots constituted by a plurality of nodes classified by a driving function; a robot application generator generating the robot application combining a plurality of components for driving the plurality of robots; and a robot application controller distributing the robot application to the plurality of robots on the basis of the information of the plurality of robots and receiving execution monitoring information of the robot application.06-23-2011
20110154361APPARATUS AND METHOD OF COORDINATING OPERATION ACTION OF ROBOT SOFTWARE COMPONENT - Provided are an apparatus and a method of controlling the execution of components without an additional port or messaging for applying the dependency among the components. The apparatus comprises: a profile analyzing unit analyzing execution dependency information of components defined in an execution coordination profile; a component managing unit arranging the components in accordance with the execution sequence of the components caused by the execution dependency information; an execution coordination managing unit determining whether or not each of the components executes the operation on the basis of the execution dependency information of the corresponding component managed by the execution coordination units allocated to the components, respectively; and an operation executing unit executing the operation of each of the components in accordance with the determination result of the execution coordination manager.06-23-2011

Patent applications by Byoung Youl Song, Daejeon KR