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Burnside

Andrew Burnside, Glasgow GB

Patent application numberDescriptionPublished
20090278124SCRIBE BASED BOND PADS FOR INTEGRATED CIRCUITS - An apparatus including a semiconductor substrate is disclosed. A first semiconductor die is disposed on the semiconductor substrate. A first bond out pad is disposed on the semiconductor substrate adjacent to the first semiconductor die. A first sawn semiconductor die is disposed on the semiconductor substrate adjacent to the first semiconductor die and the first bond out pad.11-12-2009

Gerard Burnside, Nozay FR

Patent application numberDescriptionPublished
20090156244METHOD FOR DYNAMICALLY MONITORING A GROUP OF MOBILE ENTITIES - A method for dynamically monitoring a group of wirelessly communicating mobile entities, characterized in that it comprises: 06-18-2009

Gérard Burnside, Nozay FR

Patent application numberDescriptionPublished
20110119239METHOD FOR AGGREGATING WEB FEED MINIMIZING REDUNDANCIES - Method for aggregating syndicated Web content, comprising the steps of: Retrieving (05-19-2011

Kevin Burnside, Burleigh Heads AU

Patent application numberDescriptionPublished
20100252210 PLEATED SCREEN APPARATUS - The present invention relates generally to barriers for architectural openings, in particular to a screen apparatus and method for screening off an architectural opening. The screen apparatus includes an elongated overhead frame member, a transverse fixed side frame member, a displaceable side frame member, and an elongated articulated bottom frame member. A screen member extends between the frame members, the screen member being interchangeable between a collapsed condition when the screen is open and an extended condition when the screen is closed by movement of the displaceable side frame member.10-07-2010