Buljan
Biljana Buljan, Acton, MA US
Patent application number | Description | Published |
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20120060426 | Conditioning Tools and Techniques for Chemical Mechanical Planarization - Tools for conditioning chemical mechanical planarization (CMP) pads comprise a substrate with abrasive particles coupled to at least one surface. The tools can have various particle and bond configurations. For instance, abrasive particles may be bonded (e.g., brazed or other metal bond technique) to one side, or to front and back sides. Alternatively, abrasive particles are bonded to a front side, and filler particles coupled to a back side. The abrasive particles can form a pattern (e.g., hexagonal) and have particle sizes that are sufficiently small to penetrate pores of a CMP pad during conditioning, leading to fewer defects on wafers polished with the conditioned CMP pad. Grain bonding can be accomplished using brazing films, although other metal bonds may be used as well. Also, balanced bond material (e.g., braze on both sides) allows for low out-of-flatness value. | 03-15-2012 |
Marina Buljan, Madrid ES
Patent application number | Description | Published |
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20100307586 | REFLECTIVE FREE-FORM KOHLER CONCENTRATOR - One example of a solar photovoltaic concentrator has a primary mirror with multiple free-form panels, each of which forms a Köhler integrator with a respective panel of a lenticular secondary lens. The Köhler integrators are folded by a common intermediate mirror. The resulting plurality of integrators all concentrate sunlight onto a common photovoltaic cell. Luminaires using a similar geometry are also described. | 12-09-2010 |
Sergej-Tomislav Buljan, Acton, MA US
Patent application number | Description | Published |
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20080271384 | CONDITIONING TOOLS AND TECHNIQUES FOR CHEMICAL MECHANICAL PLANARIZATION - Tools for conditioning chemical mechanical planarization (CMP) pads comprise a substrate with abrasive particles coupled to at least one surface. The tools can have various particle and bond configurations. For instance, abrasive particles may be bonded (e.g., brazed or other metal bond technique) to one side, or to front and back sides. Alternatively, abrasive particles are bonded to a front side, and filler particles coupled to a back side. The abrasive particles can form a pattern (e.g., hexagonal) and have particle sizes that are sufficiently small to penetrate pores of a CMP pad during conditioning, leading to fewer defects on wafers polished with the conditioned CMP pad. Grain bonding can be accomplished using brazing films, although other metal bonds may be used as well. Also, balanced bond material (e.g., braze on both sides) allows for low out-of-flatness value. | 11-06-2008 |
20120244791 | Rotary Dressing Tool Containing Brazed Diamond Layer - A disc-shaped, rotary dressing tool has a rigid core and an abrasive rim around at least one surface of the periphery of the rigid core. The rigid core and the abrasive rim are oriented in a direction orthogonal to the axis of rotation of the tool. In an embodiment, the abrasive rim comprises an abrasive component bonded to the rigid core by means of an active braze. The abrasive component can be diamond grains arranged in a single layer or diamond film inserts. In a particular embodiment, the abrasive component can comprise a plurality of abrasive inserts mechanically fastened to the rigid core. In another embodiment, the abrasive rim can comprise strips of an abrasive component with each strip being filled into slots machined into and through the perimeter of the core. | 09-27-2012 |