Patent application number | Description | Published |
20100237496 | Thermal Interface Material with Support Structure - Various semiconductor chip thermal interface material methods and apparatus are disclosed. In one aspect, a method of establishing thermal contact between a first semiconductor chip and a heat spreader is provided. The method includes placing a thermal interface material layer containing a support structure on the first semiconductor chip. The heat spreader is positioned proximate the thermal interface material layer. The thermal interface material layer is reflowed to establish thermal contact with both the first semiconductor chip and the heat spreader. | 09-23-2010 |
20110057677 | DIE STACKING, TESTING AND PACKAGING FOR YIELD - A method to test and package dies so as to increase overall yield is provided. The method includes performing a wafer test on a first die and mounting the first die on a package substrate to form a partial package, if the wafer test of the first die is successful. The method further includes performing a system test on the partial package including the first die and stacking a second die on the first die if the system test on the partial package and the first die is successful. | 03-10-2011 |
20110304051 | THERMAL INTERFACE MATERIAL WITH SUPPORT STRUCTURE - Various semiconductor chip thermal interface material methods and apparatus are disclosed. In one aspect, a method of establishing thermal contact between a first semiconductor chip and a heat spreader is provided. The method includes placing a thermal interface material layer containing a support structure on the first semiconductor chip. The heat spreader is positioned proximate the thermal interface material layer. The thermal interface material layer is reflowed to establish thermal contact with both the first semiconductor chip and the heat spreader. | 12-15-2011 |
20120038061 | SEMICONDUCTOR CHIP WITH OFFSET PADS - A semiconductor chip device includes a first semiconductor chip adapted to be stacked with a second semiconductor chip wherein the second semiconductor chip includes a side and first and second conductor structures projecting from the side. The first semiconductor chip includes a first edge, a first conductor pad, a first conductor pillar positioned on but laterally offset from the first conductor pad toward the first edge and that has a first lateral dimension and is adapted to couple to one of the first and second conductor structures, a second conductor pad positioned nearer the first edge than the first conductor pad, and a second conductor pillar positioned on but laterally offset from the second conductor pad and that has a second lateral dimension larger than the first lateral dimension and is adapted to couple to the other of the first and second conductor structures. | 02-16-2012 |
20120043539 | SEMICONDUCTOR CHIP WITH THERMAL INTERFACE TAPE - A method of manufacturing is provided that includes applying a thermal interface tape to a side of a semiconductor wafer that includes at least one semiconductor chip. The thermal interface material tape is positioned on the at least one semiconductor chip. The at least one semiconductor chip is singulated from the semiconductor wafer with at least a portion of the thermal interface tape still attached to the semiconductor chip. | 02-23-2012 |
20120043668 | STACKED SEMICONDUCTOR CHIPS WITH THERMAL MANAGEMENT - A method of assembling a semiconductor chip device is provided that includes placing an interposer on a first semiconductor chip. The interposer includes a first surface seated on the first semiconductor chip and a second surface adapted to thermally contact a heat spreader. The second surface includes a first aperture. A second semiconductor chip is placed in the first aperture. | 02-23-2012 |
20120043669 | STACKED SEMICONDUCTOR CHIP DEVICE WITH THERMAL MANAGEMENT CIRCUIT BOARD - A method of assembling a semiconductor chip device is provided that includes providing a circuit board including a surface with an aperture. A portion of a first heat spreader is positioned in the aperture. A stack is positioned on the first heat spreader. The stack includes a first semiconductor chip positioned on the first heat spreader and a substrate that has a first side coupled to the first semiconductor chip. | 02-23-2012 |
20120061821 | SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS - A semiconductor chip with conductive vias and a method of manufacturing the same are disclosed. The method includes forming a first plurality of conductive vias in a layer of a first semiconductor chip. The first plurality of conductive vias includes first ends and second ends. A first conductor pad is formed in ohmic contact with the first ends of the first plurality of conductive vias. | 03-15-2012 |
20120061852 | SEMICONDUCTOR CHIP DEVICE WITH POLYMERIC FILLER TRENCH - A method of manufacturing is provided that includes providing a semiconductor chip with an insulating layer. The insulating layer includes a trench. A second semiconductor chip is stacked on the first semiconductor chip to leave a gap. A polymeric filler is placed in the gap wherein a portion of the polymeric filler is drawn into the trench. | 03-15-2012 |
20120061853 | SEMICONDUCTOR CHIP DEVICE WITH UNDERFILL - A method of manufacturing is provided that includes placing a removable cover on a surface of a substrate. The substrate includes a first semiconductor chip positioned on the surface. The first semiconductor chip includes a first sidewall. The removable cover includes a second sidewall positioned opposite the first sidewall. A first underfill is placed between the first semiconductor chip and the surface wherein the second sidewall provides a barrier to flow of the first underfill. Various apparatus are also disclosed. | 03-15-2012 |
20120074579 | SEMICONDUCTOR CHIP WITH REINFORCING THROUGH-SILICON-VIAS - A method of manufacturing includes connecting a first end of a first through-silicon-via to a first die seal proximate a first side of a first semiconductor chip. A second end of the first thu-silicon-via is connected to a second die seal proximate a second side of the first semiconductor chip opposite the first side. | 03-29-2012 |
20120075807 | STACKED SEMICONDUCTOR CHIP DEVICE WITH THERMAL MANAGEMENT - A method of manufacturing is provided that includes placing a thermal management device in thermal contact with a first semiconductor chip of a semiconductor chip device. The semiconductor chip device includes a first substrate coupled to the first semiconductor chip. The first substrate has a first aperture. At least one of the first semiconductor chip and the thermal management device is at least partially positioned in the first aperture. | 03-29-2012 |
20120098119 | SEMICONDUCTOR CHIP DEVICE WITH LIQUID THERMAL INTERFACE MATERIAL - A method of manufacturing is provided that includes providing a semiconductor chip device that has a circuit board and a first semiconductor chip coupled thereto. A lid is placed on the circuit board. The lid includes an opening and an internal cavity. A liquid thermal interface material is placed in the internal cavity for thermal contact with the first semiconductor chip and the circuit board. | 04-26-2012 |
20120205791 | SEMICONDUCTOR CHIP WITH REINFORCING THROUGH-SILICON-VIAS - A method of manufacturing includes connecting a first end of a first through-silicon-via to a first die seal proximate a first side of a first semiconductor chip. A second end of the first thu-silicon-via is connected to a second die seal proximate a second side of the first semiconductor chip opposite the first side. | 08-16-2012 |
20130141442 | METHOD AND APPARATUS FOR MULTI-CHIP PROCESSING - Various methods, computer-readable mediums and apparatus are disclosed. In one aspect, a method of generating a graphical image on a display device is provided that includes splitting geometry level processing of the image between plural processors coupled to an interposer. Primitives are created using each of the plural processors. Any primitives not needed to render the image are discarded. The image is rasterized using each of the plural processors. A portion of the image is rendered using one of the plural processors and any remaining portion of the image using one or more of the other plural processors. | 06-06-2013 |
20130147028 | HEAT SPREADER FOR MULTIPLE CHIP SYSTEMS - Various heat spreaders and methods of making and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a heat spreader that has a surface adapted to establish thermal contact with a first semiconductor chip and a second semiconductor chip on a substrate. The surface includes a first portion adapted to thermally contact a solder-based thermal interface material and a second portion having an opening adapted to hold an organic thermal interface material. | 06-13-2013 |
20130159584 | DATA BUS INVERSION CODING - Techniques are disclosed relating to data inversion encoding. In one embodiment, an apparatus includes an interface circuit. The interface circuit is configured to perform first and second data bursts that include respective pluralities of data transmissions encoded using an inversion coding scheme. In such an embodiment, the initial data transmission of the second data burst is encoded using the final data transmission of the first data burst. In some embodiments, the first and second data bursts correspond to successive write operations or successive read operations to a memory module from a memory PHY. | 06-20-2013 |
20130159587 | Interconnect Redundancy for Multi-Interconnect Device - A multi-interconnect integrated circuit device includes an input/output (I/O) circuit for conveying a plurality of interleaved data channel groups by configuring the I/O circuit to convey a first data channel group over a default fixed interconnect signal paths if there are no connection failures in the default fixed interconnect signal paths, and to convey the first data channel group over a second plurality of default fixed interconnect signal paths if there is at least one connection failure in the first plurality of default fixed interconnect signal paths, where the second plurality of default fixed interconnect signal paths includes a redundant fixed interconnect signal path for replacing a failed interconnect signal path from the first plurality of default fixed interconnect signal paths. | 06-20-2013 |
20130159818 | Unified Data Masking, Data Poisoning, and Data Bus Inversion Signaling - Provided herein is a method and system for providing and analyzing unified data signaling that includes setting, or analyzing a state of a single indicator signal, generating or analyzing a data pattern of a plurality of data bits, and signal, or determine, based on the state of the single indicator signal and the pattern of the plurality of data bits, that data bus inversion has been applied to the plurality of data bits or that the plurality of data bits is poisoned. | 06-20-2013 |
20130161814 | SEMICONDUCTOR CHIP WITH OFFSET PADS - A semiconductor chip device includes a first semiconductor chip adapted to be stacked with a second semiconductor chip wherein the second semiconductor chip includes a side and first and second conductor structures projecting from the side. The first semiconductor chip includes a first edge, a first conductor pad, a first conductor pillar positioned on but laterally offset from the first conductor pad toward the first edge and that has a first lateral dimension and is adapted to couple to one of the first and second conductor structures, a second conductor pad positioned nearer the first edge than the first conductor pad, and a second conductor pillar positioned on but laterally offset from the second conductor pad and that has a second lateral dimension larger than the first lateral dimension and is adapted to couple to the other of the first and second conductor structures. | 06-27-2013 |
20130256872 | THERMAL MANAGEMENT OF STACKED SEMICONDUCTOR CHIPS WITH ELECTRICALLY NON-FUNCTIONAL INTERCONNECTS - A method of manufacturing is provided that includes fabricating a first plurality of electrically functional interconnects on a front side of a first semiconductor chip and fabricating a first plurality of electrically non-functional interconnects on a back side of the first semiconductor chip. Additional chips may be stacked on the first semiconductor chip. | 10-03-2013 |
20130256895 | STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT - A method of manufacturing is provided that includes fabricating a first set of interconnect structures on a side of a first semiconductor substrate. The first semiconductor substrate is operable to have at least one of plural semiconductor substrates stacked on the side. The first set of interconnect structures is arranged in a pattern. Each of the plural semiconductor substrates has a second set of interconnect structures arranged in the pattern, one of the plural semiconductor substrates has a smallest footprint of the plural semiconductor substrates. The pattern has a footprint smaller than the smallest footprint of the plural semiconductor substrates. | 10-03-2013 |
20130256913 | DIE STACKING WITH COUPLED ELECTRICAL INTERCONNECTS TO ALIGN PROXIMITY INTERCONNECTS - A method of manufacturing is provided that includes forming a first proximity interconnect on a first side of a first semiconductor chip and a first plurality of interconnect structures projecting from the first side. A second proximity interconnect is formed on a second side of a second semiconductor chip and a second plurality of interconnect structures are formed projecting from the second side. The second semiconductor chip is coupled to the first semiconductor chip so that the second side faces the first side and the first interconnect structures are coupled to the second interconnect structures. The first and second proximity interconnects cooperate to provide a proximity interface. The coupling of the first interconnect structures to the second interconnect structures provides desired vertical and lateral alignment of the first and second proximity interconnects. | 10-03-2013 |
20130341783 | INTERPOSER WITH IDENTIFICATION SYSTEM - Various interposers and method of manufacturing related thereto are disclosed. In one aspect, a method of manufacturing is provided that includes coupling an identification structure to an interposer. The identification structure is operable to provide identification information about the interposer. The identification structure is programmable to create or alter the identification information. | 12-26-2013 |
20130342231 | SEMICONDUCTOR SUBSTRATE WITH ONBOARD TEST STRUCTURE - Various interposers and methods of manufacturing related thereto are disclosed. In one aspect, a method of manufacturing is provided that includes fabricating a first test structure onboard an interposer that has a first side and second side opposite the first side. Additional test structures may be fabricated. | 12-26-2013 |
20140103506 | SEMICONDUCTOR CHIP DEVICE WITH POLYMERIC FILLER TRENCH - A method of manufacturing is provided that includes providing a semiconductor chip with an insulating layer. The insulating layer includes a trench. A second semiconductor chip is stacked on the first semiconductor chip to leave a gap. A polymeric filler is placed in the gap wherein a portion of the polymeric filler is drawn into the trench. | 04-17-2014 |