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Brooksby
Jacob Brooksby, Folsom, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110127642 | PACKAGE INCLUDING AT LEAST ONE TOPOLOGICAL FEATURE ON AN ENCAPSULANT MATERIAL TO RESIST OUT-OF-PLANE DEFORMATION - Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, including a die and an encapsulant material formed over the die, and at least one topological feature formed on an external surface of the encapsulant material, and configured to resist out-of-plane deformation of the package. Other embodiments may be described and claimed. | 06-02-2011 |
Ryan V. Brooksby, American Fork, UT US
Scot Lorin Brooksby, Highland, UT US
| Patent application number | Description | Published |
|---|---|---|
| 20110123003 | METHODS AND SYSTEMS RELATED TO TEXT CAPTION ERROR CORRECTION - Systems and methods related to providing error correction in a text caption are disclosed. A method may comprise displaying a text caption including one or more blocks of text on each of a first device and a second device remote from the first device. The method may also include generating another block of text and replacing a block of text of the text caption with the another block of text. Furthermore, the method may include displaying the text caption on the second device having the block of text of the first text caption replaced by the another block of text. | 05-26-2011 |